JPS5669398A - Holding apparatus of electroplating - Google Patents
Holding apparatus of electroplatingInfo
- Publication number
- JPS5669398A JPS5669398A JP14618379A JP14618379A JPS5669398A JP S5669398 A JPS5669398 A JP S5669398A JP 14618379 A JP14618379 A JP 14618379A JP 14618379 A JP14618379 A JP 14618379A JP S5669398 A JPS5669398 A JP S5669398A
- Authority
- JP
- Japan
- Prior art keywords
- plated
- racks
- space
- electroplating bath
- bar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
PURPOSE: To enable to form a uniform thickness plated layer on the material to be plated having various shapes, by making adjustable the space of two racks using for electroplating bath and also, providing shielding frame on the lower part of moving cathode bar.
CONSTITUTION: Two racks 14 are suspended from a moving cathode bar 11 of electroplating bath and a material 4 to be plated such as printing substrate, is supported putting between a rod-shaped part 16 and a supporting contact parts 17, 18 supplying an electric current for plating, are provided at a definite space alternately. The material 4 is held by a contacts 17a, 18a controlling the space of two racks 14, 14 in accordance with its dimension and shape. Further, a shielding frame 20 is provided on the lower part of the bar 11 so as to be surrounded the movable region of the rack 14. Current is only concentrated on the outside materials 4 because of surrounding many materials 4 in the frame 20 entirely and outside plated layer of the material 4 thicker than the central part of the material 4 is formed and then, it is prevented that the whole material 4 is plated in an uneven thickness.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14618379A JPS5669398A (en) | 1979-11-12 | 1979-11-12 | Holding apparatus of electroplating |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14618379A JPS5669398A (en) | 1979-11-12 | 1979-11-12 | Holding apparatus of electroplating |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5669398A true JPS5669398A (en) | 1981-06-10 |
JPS6254880B2 JPS6254880B2 (en) | 1987-11-17 |
Family
ID=15402006
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14618379A Granted JPS5669398A (en) | 1979-11-12 | 1979-11-12 | Holding apparatus of electroplating |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5669398A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1172462A1 (en) * | 2000-07-12 | 2002-01-16 | BAE SYSTEMS plc | A jig and a method and apparatus of applying a surface treatment to a member on the jig |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103510144A (en) * | 2013-09-17 | 2014-01-15 | 兰继红 | Metal piece electroplating suspension frame |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4214766Y1 (en) * | 1964-07-11 | 1967-08-23 | ||
JPS50148560U (en) * | 1974-05-27 | 1975-12-10 | ||
JPS524414U (en) * | 1975-06-24 | 1977-01-12 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS524414B2 (en) * | 1971-09-28 | 1977-02-03 |
-
1979
- 1979-11-12 JP JP14618379A patent/JPS5669398A/en active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4214766Y1 (en) * | 1964-07-11 | 1967-08-23 | ||
JPS50148560U (en) * | 1974-05-27 | 1975-12-10 | ||
JPS524414U (en) * | 1975-06-24 | 1977-01-12 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1172462A1 (en) * | 2000-07-12 | 2002-01-16 | BAE SYSTEMS plc | A jig and a method and apparatus of applying a surface treatment to a member on the jig |
Also Published As
Publication number | Publication date |
---|---|
JPS6254880B2 (en) | 1987-11-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ZA803746B (en) | Cathode for the electrolytic production of hydrogen | |
ES436808A1 (en) | Method and apparatus for electroplating | |
DE3278119D1 (en) | Process of electroforming screen material, material as obtained and apparatus for executing said process | |
JPS5669398A (en) | Holding apparatus of electroplating | |
SU1118285A3 (en) | Method of obtaining zeolite type l surface-modified glass | |
DE2961926D1 (en) | Process for reducing the magnetic perturbations in rows of high amperage electrolytic cells | |
JPS5669397A (en) | Holding apparatus for electroplating | |
JPS5319935A (en) | Method of supplying metallic ions in electroplating bath | |
JPS55147969A (en) | Manufacture of iron core teeth for linear pulse motor | |
GB1329916A (en) | Apparatus for electroplating | |
JPS5550489A (en) | Continuous production of tin plated strip material | |
IT1107747B (en) | MANUFACTURING PROCEDURE OF A CONSUMABLE METALLIC ELECTRODE WITH VERTICAL AXIS FOR REFUSING USING THE ELECTROSLAG PROCESS AND THE PRODUCTION OF A METALLIC INGOT WITH CRIMIC COMPOSITION CONTINUOUSLY VARIANT ALONG ITS AXIS | |
JPS579894A (en) | Partial plating method | |
JPS56169798A (en) | Plating apparatus | |
JPS51130566A (en) | Heat treating apparatus for food in electrolyte bath | |
JPS5620199A (en) | Anode body for plating | |
ES450982A1 (en) | Electrolytic production of perforated metal foil | |
JPS57210985A (en) | Partial plating device | |
GB1324528A (en) | Molten salt electroplating method | |
JPS57131395A (en) | Jig for plating | |
JPS5739193A (en) | Continuous plating apparatus | |
YU19780A (en) | Process for recovering cyanide from the rinsing solution in the cyanide process for electrodeposition of metals | |
JPS5550490A (en) | Plating method of printing type body | |
JPS57153431A (en) | Electroplating method for semiconductor wafer | |
JPS5334631A (en) | Process and apparatus for molten metal plating |