JPS6439383A - Aluminum-ceramic-copper composite material - Google Patents

Aluminum-ceramic-copper composite material

Info

Publication number
JPS6439383A
JPS6439383A JP19602887A JP19602887A JPS6439383A JP S6439383 A JPS6439383 A JP S6439383A JP 19602887 A JP19602887 A JP 19602887A JP 19602887 A JP19602887 A JP 19602887A JP S6439383 A JPS6439383 A JP S6439383A
Authority
JP
Japan
Prior art keywords
copper
compd
ceramic
anodized
5min
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19602887A
Other languages
Japanese (ja)
Inventor
Mamoru Koyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TOYO METAL KK
Original Assignee
TOYO METAL KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TOYO METAL KK filed Critical TOYO METAL KK
Priority to JP19602887A priority Critical patent/JPS6439383A/en
Publication of JPS6439383A publication Critical patent/JPS6439383A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/18—After-treatment, e.g. pore-sealing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)

Abstract

PURPOSE:To provide an IC board having excellent heat resistance and to which a heavy current can be applied by allowing aluminum oxide and a copper compd. to act on the surface of an Al material to form a ceramic, and reducing the surface. CONSTITUTION:For example, an Al material having >=99% purity is anodized at 20 deg.C, 15V voltage, and 2.2A-dm<-2> current density by using an electrolyte contg. 20% sulfuric acid and 25g/dm<3> aluminum sulfate to form alumite having 25mu thickness. The fine powder of a copper compd. (e.g., an inorg. metal compd. such as copper chloride and copper fluoride and an organometal compd. such as copper alkoxide) is uniformly applied on the Al material coated with an anodized Al film, and the material is heat-treated in a gaseous N2 atmosphere at 300-500 deg.C for 5min to 1hr. The treated material is drawn out, kept at 550 deg.C in a gaseous H2 current for 10sec to 5min, and secondarily reduced. By this method, an IC board having excellent heat resistance can be obtained.
JP19602887A 1987-08-05 1987-08-05 Aluminum-ceramic-copper composite material Pending JPS6439383A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19602887A JPS6439383A (en) 1987-08-05 1987-08-05 Aluminum-ceramic-copper composite material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19602887A JPS6439383A (en) 1987-08-05 1987-08-05 Aluminum-ceramic-copper composite material

Publications (1)

Publication Number Publication Date
JPS6439383A true JPS6439383A (en) 1989-02-09

Family

ID=16351014

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19602887A Pending JPS6439383A (en) 1987-08-05 1987-08-05 Aluminum-ceramic-copper composite material

Country Status (1)

Country Link
JP (1) JPS6439383A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5139346A (en) * 1990-10-16 1992-08-18 Taiyo Kogyo Corporation Flexible container
US5181900A (en) * 1990-10-16 1993-01-26 Taiyo Kogyo Corporation Method of fabricating a flexible container

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5139346A (en) * 1990-10-16 1992-08-18 Taiyo Kogyo Corporation Flexible container
US5181900A (en) * 1990-10-16 1993-01-26 Taiyo Kogyo Corporation Method of fabricating a flexible container

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