JPS6435985A - Manufacture of printed board - Google Patents

Manufacture of printed board

Info

Publication number
JPS6435985A
JPS6435985A JP19142587A JP19142587A JPS6435985A JP S6435985 A JPS6435985 A JP S6435985A JP 19142587 A JP19142587 A JP 19142587A JP 19142587 A JP19142587 A JP 19142587A JP S6435985 A JPS6435985 A JP S6435985A
Authority
JP
Japan
Prior art keywords
resist
etching
conductor pattern
manufacture
printed board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19142587A
Other languages
English (en)
Inventor
Masahiro Hoshino
Kiyotaka Tanaka
Yasuo Takeoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP19142587A priority Critical patent/JPS6435985A/ja
Publication of JPS6435985A publication Critical patent/JPS6435985A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds

Landscapes

  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP19142587A 1987-07-30 1987-07-30 Manufacture of printed board Pending JPS6435985A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19142587A JPS6435985A (en) 1987-07-30 1987-07-30 Manufacture of printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19142587A JPS6435985A (en) 1987-07-30 1987-07-30 Manufacture of printed board

Publications (1)

Publication Number Publication Date
JPS6435985A true JPS6435985A (en) 1989-02-07

Family

ID=16274400

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19142587A Pending JPS6435985A (en) 1987-07-30 1987-07-30 Manufacture of printed board

Country Status (1)

Country Link
JP (1) JPS6435985A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019083250A (ja) * 2017-10-30 2019-05-30 ラピスセミコンダクタ株式会社 半導体装置及び半導体装置の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5179268A (en) * 1974-03-29 1976-07-10 Siemens Ag Hotoetsuchingunyoru dotaibankozono seizohoho
JPS54108274A (en) * 1978-02-15 1979-08-24 Shindo Denshi Kougiyou Kk Method of producing printed circuit board
JPS6232684A (ja) * 1985-08-05 1987-02-12 三菱電機株式会社 プリント基板の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5179268A (en) * 1974-03-29 1976-07-10 Siemens Ag Hotoetsuchingunyoru dotaibankozono seizohoho
JPS54108274A (en) * 1978-02-15 1979-08-24 Shindo Denshi Kougiyou Kk Method of producing printed circuit board
JPS6232684A (ja) * 1985-08-05 1987-02-12 三菱電機株式会社 プリント基板の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019083250A (ja) * 2017-10-30 2019-05-30 ラピスセミコンダクタ株式会社 半導体装置及び半導体装置の製造方法

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