JPS6435792U - - Google Patents
Info
- Publication number
- JPS6435792U JPS6435792U JP13114787U JP13114787U JPS6435792U JP S6435792 U JPS6435792 U JP S6435792U JP 13114787 U JP13114787 U JP 13114787U JP 13114787 U JP13114787 U JP 13114787U JP S6435792 U JPS6435792 U JP S6435792U
- Authority
- JP
- Japan
- Prior art keywords
- electronic components
- cooling structure
- air cooling
- forced air
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 2
- 230000003247 decreasing effect Effects 0.000 claims 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の一実施例による電子部品の強
制空冷構造を示す側視図、第２図は従来の電子部
品の強制空冷構造を示す側視図である。
図において、１は基板、２は素子、３は放熱フ
イン、１４は風洞、１４ａは側壁、１４ｂは天板
、を示す。
FIG. 1 is a side view showing a forced air cooling structure for electronic components according to an embodiment of the present invention, and FIG. 2 is a side view showing a conventional forced air cooling structure for electronic components. In the figure, 1 is a substrate, 2 is an element, 3 is a radiation fin, 14 is a wind tunnel, 14a is a side wall, and 14b is a top plate.
Claims (1)
造であつて、一方より他方にかけて風路の断面積
を順次小さくした風洞１４を、冷却風の風上より
風下かけて該風路断面積が順次小さくなるように
上記電子部品２を実装した該基板１に冠着したこ
とを特徴とする電子部品の強制空冷構造。 This is a forced air cooling structure for electronic components mounted on a printed circuit board, and the wind tunnel 14 has a cross-sectional area of the air passage gradually decreasing from one side to the other. A forced air cooling structure for electronic components, characterized in that it is mounted on the substrate 1 on which the electronic components 2 described above are mounted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13114787U JPS6435792U (en) | 1987-08-27 | 1987-08-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13114787U JPS6435792U (en) | 1987-08-27 | 1987-08-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6435792U true JPS6435792U (en) | 1989-03-03 |
Family
ID=31386942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13114787U Pending JPS6435792U (en) | 1987-08-27 | 1987-08-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6435792U (en) |
-
1987
- 1987-08-27 JP JP13114787U patent/JPS6435792U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6435792U (en) | ||
| JPS646085U (en) | ||
| JPS5993170U (en) | Mounting structure of flat package IC | |
| JPS6398675U (en) | ||
| JPS6439648U (en) | ||
| JPH02131395U (en) | ||
| JPS62182555U (en) | ||
| JPH0263590U (en) | ||
| JPH0334292U (en) | ||
| JPH032667U (en) | ||
| JPS6435791U (en) | ||
| JPH0361386U (en) | ||
| JPS63149544U (en) | ||
| JPS61144697U (en) | ||
| JPH0263549U (en) | ||
| JPH02138439U (en) | ||
| JPS5874345U (en) | heat sink fins | |
| JPS6190251U (en) | ||
| JPS61174775U (en) | ||
| JPS6192067U (en) | ||
| JPS6252940U (en) | ||
| JPS63125387U (en) | ||
| JPS63153542U (en) | ||
| JPH0184490U (en) | ||
| JPS6439697U (en) |