JPS6432640A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS6432640A
JPS6432640A JP18754887A JP18754887A JPS6432640A JP S6432640 A JPS6432640 A JP S6432640A JP 18754887 A JP18754887 A JP 18754887A JP 18754887 A JP18754887 A JP 18754887A JP S6432640 A JPS6432640 A JP S6432640A
Authority
JP
Japan
Prior art keywords
fluorine atoms
layers
diffusion layer
semiconductor substrate
impurity diffusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18754887A
Other languages
Japanese (ja)
Inventor
Shizunori Oyu
Nobuyoshi Kashu
Yasuo Wada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP18754887A priority Critical patent/JPS6432640A/en
Publication of JPS6432640A publication Critical patent/JPS6432640A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To reduce the reverse leakage currents of the peripheral section of a shallow impurity diffusion layer, and to improve the reliability of a device by incorporating fluorine atoms into a semiconductor substrate in the periphery of the impurity diffusion layer or a structure formed to the main surface of the semiconductor substrate. CONSTITUTION:Layers 5 containing fluorine atoms are shaped to a semiconductor substrate 3 in the peripheral section 2 of an impurity diffusion layer 1 formed or a structure 4 shaped to the main surface of the substrate 3. The layers 5 including fluorine atoms have an effect on generating and recombining components 9 in the surface in each component of leakage currents. Traps on the interface can be decreased by fluorine in the layers 5 containing fluorine atoms, and the stress of the structure 4 can be reduced by mixing fluorine, thus reducing the whole trap density. Consequently, the leakage currents of the generating and recombining components 9 in the surface are diminished. Accordingly, the reliability of a device can be improved.
JP18754887A 1987-07-29 1987-07-29 Manufacture of semiconductor device Pending JPS6432640A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18754887A JPS6432640A (en) 1987-07-29 1987-07-29 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18754887A JPS6432640A (en) 1987-07-29 1987-07-29 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS6432640A true JPS6432640A (en) 1989-02-02

Family

ID=16208006

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18754887A Pending JPS6432640A (en) 1987-07-29 1987-07-29 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS6432640A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7129141B2 (en) 2004-01-09 2006-10-31 Elpida Memory, Inc. Method for manufacturing a semiconductor device having a low junction leakage current

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7129141B2 (en) 2004-01-09 2006-10-31 Elpida Memory, Inc. Method for manufacturing a semiconductor device having a low junction leakage current

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