JPS6431492A - Enamel substrate for electronic circuit - Google Patents

Enamel substrate for electronic circuit

Info

Publication number
JPS6431492A
JPS6431492A JP18862787A JP18862787A JPS6431492A JP S6431492 A JPS6431492 A JP S6431492A JP 18862787 A JP18862787 A JP 18862787A JP 18862787 A JP18862787 A JP 18862787A JP S6431492 A JPS6431492 A JP S6431492A
Authority
JP
Japan
Prior art keywords
copper
alloy
layer
layers
enamel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18862787A
Other languages
Japanese (ja)
Inventor
Fumiya Numajiri
Kenji Yamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP18862787A priority Critical patent/JPS6431492A/en
Publication of JPS6431492A publication Critical patent/JPS6431492A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

PURPOSE:To assure an enamel substrate for an electronic circuit with uniform coating by providing at least one metal thin layer between a copper or copper series alloy layer. CONSTITUTION:Thin metal layers 5, 6 are provided between copper or copper series alloy layers 3, 4 and enamel layers 9, 10, thereby preventing an oxide layer from being produced. In addition, copper is oxidized in baking (800-900 deg.C) upon formation of an enamel layer, and copper oxide so produced is prevented from entering the enamel layer to keep insulating voltage high. For constitutent metals of the thin metal layers 5, 6, any metal or alloy will do if it could prevent an oxide layer from being produced on the copper or copper series alloy layers 3, 4, the metal or alloy hereby demonstrating clear effect in particular. Additionally, said constituent metal may be selected from at least any one from Ni, Ni-Sn alloy, NiP alloy, Co, Co-Sn alloy, Ti, Ti series alloy, all being excellent in an adhesion (joint) property with enamel. Still more, for the thin metal layer formed on the copper or copper series alloy layer, two or more layers may be provided at need without limitation to a single layer.
JP18862787A 1987-07-28 1987-07-28 Enamel substrate for electronic circuit Pending JPS6431492A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18862787A JPS6431492A (en) 1987-07-28 1987-07-28 Enamel substrate for electronic circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18862787A JPS6431492A (en) 1987-07-28 1987-07-28 Enamel substrate for electronic circuit

Publications (1)

Publication Number Publication Date
JPS6431492A true JPS6431492A (en) 1989-02-01

Family

ID=16227002

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18862787A Pending JPS6431492A (en) 1987-07-28 1987-07-28 Enamel substrate for electronic circuit

Country Status (1)

Country Link
JP (1) JPS6431492A (en)

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