JPS6430274A - Optical semiconductor element package - Google Patents
Optical semiconductor element packageInfo
- Publication number
- JPS6430274A JPS6430274A JP62187062A JP18706287A JPS6430274A JP S6430274 A JPS6430274 A JP S6430274A JP 62187062 A JP62187062 A JP 62187062A JP 18706287 A JP18706287 A JP 18706287A JP S6430274 A JPS6430274 A JP S6430274A
- Authority
- JP
- Japan
- Prior art keywords
- bottom plate
- optical fiber
- package
- optical semiconductor
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE:To realize an accurate positioning between an optical semiconductor chip and an optical fiber by a method wherein the optical fiber is inserted into a penetration hole drilled in the bottom plate of a package so as to make the surface of its tip placed in the same plane with the upper surface of the bottom plate and look into the housing recess of the package. CONSTITUTION:A penetration hole 11 for an optical fiber is drilled at the center of the bottom plate 3 of a package 1. On the other hand, a sealing plate 12 is attached to an optical fiber 10 and the optical fiber 10 is inserted into the penetration hole 11 from the bottom of the bottom plate 3 so as to make its tip surface look into the housing recess 2 and the sealing plate 12 is bonded to the bottom plate 3. On the other hand, gold-plated bumps 5 are provided in the circumference of an optical semiconductor chip 4. The chip 4 is turned upside-down so as to make its light detecting plane 5 face the optical fiber 10 and bonded to the bottom plate 3 by face- down bonding and the respective bumps 5 are electrically connected to external leads 7 through wirings 14 formed on the surface of the bottom plate 3. Then a cover 8 is attached to the package 1 to seal the optical semiconductor chip 4 in the housing recess 2. With this constitution, the accuracy of the relative position between the optical fiber and the optical semiconductor chip can be improved.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62187062A JPS6430274A (en) | 1987-07-27 | 1987-07-27 | Optical semiconductor element package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62187062A JPS6430274A (en) | 1987-07-27 | 1987-07-27 | Optical semiconductor element package |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6430274A true JPS6430274A (en) | 1989-02-01 |
Family
ID=16199486
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62187062A Pending JPS6430274A (en) | 1987-07-27 | 1987-07-27 | Optical semiconductor element package |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6430274A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5424573A (en) * | 1992-03-04 | 1995-06-13 | Hitachi, Ltd. | Semiconductor package having optical interconnection access |
EP0726477A2 (en) * | 1995-02-09 | 1996-08-14 | AT&T IPM Corp. | An arrangement for interconnecting an optical fiber to an optical component |
EP0798583A1 (en) * | 1996-03-28 | 1997-10-01 | Motorola, Inc. | Optoelectric interconnect and method for interconnecting an optical fibre with an optoelectric device |
EP1061392A1 (en) * | 1999-06-16 | 2000-12-20 | Seiko Epson Corporation | Optical module and method of manufacture thereof, semiconductor device, and optical transmission device |
JP2017049435A (en) * | 2015-09-02 | 2017-03-09 | 日本電信電話株式会社 | Method for mounting optoelectronic integrated circuit and optoelectronic integrated circuit package |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55138283A (en) * | 1979-04-16 | 1980-10-28 | Ibm | Optical transducer |
-
1987
- 1987-07-27 JP JP62187062A patent/JPS6430274A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55138283A (en) * | 1979-04-16 | 1980-10-28 | Ibm | Optical transducer |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5424573A (en) * | 1992-03-04 | 1995-06-13 | Hitachi, Ltd. | Semiconductor package having optical interconnection access |
EP0726477A2 (en) * | 1995-02-09 | 1996-08-14 | AT&T IPM Corp. | An arrangement for interconnecting an optical fiber to an optical component |
EP0726477A3 (en) * | 1995-02-09 | 1997-07-30 | At & T Corp | An arrangement for interconnecting an optical fiber to an optical component |
EP0798583A1 (en) * | 1996-03-28 | 1997-10-01 | Motorola, Inc. | Optoelectric interconnect and method for interconnecting an optical fibre with an optoelectric device |
EP1061392A1 (en) * | 1999-06-16 | 2000-12-20 | Seiko Epson Corporation | Optical module and method of manufacture thereof, semiconductor device, and optical transmission device |
JP2017049435A (en) * | 2015-09-02 | 2017-03-09 | 日本電信電話株式会社 | Method for mounting optoelectronic integrated circuit and optoelectronic integrated circuit package |
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