JPS6430274A - Optical semiconductor element package - Google Patents

Optical semiconductor element package

Info

Publication number
JPS6430274A
JPS6430274A JP62187062A JP18706287A JPS6430274A JP S6430274 A JPS6430274 A JP S6430274A JP 62187062 A JP62187062 A JP 62187062A JP 18706287 A JP18706287 A JP 18706287A JP S6430274 A JPS6430274 A JP S6430274A
Authority
JP
Japan
Prior art keywords
bottom plate
optical fiber
package
optical semiconductor
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62187062A
Other languages
Japanese (ja)
Inventor
Masaharu Shinya
Fumihiko Nashimoto
Hideto Matsui
Chisugi Okamoto
Yoshiki Tanigawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KANEMATSU SEMICONDUCTOR KK
Original Assignee
KANEMATSU SEMICONDUCTOR KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KANEMATSU SEMICONDUCTOR KK filed Critical KANEMATSU SEMICONDUCTOR KK
Priority to JP62187062A priority Critical patent/JPS6430274A/en
Publication of JPS6430274A publication Critical patent/JPS6430274A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To realize an accurate positioning between an optical semiconductor chip and an optical fiber by a method wherein the optical fiber is inserted into a penetration hole drilled in the bottom plate of a package so as to make the surface of its tip placed in the same plane with the upper surface of the bottom plate and look into the housing recess of the package. CONSTITUTION:A penetration hole 11 for an optical fiber is drilled at the center of the bottom plate 3 of a package 1. On the other hand, a sealing plate 12 is attached to an optical fiber 10 and the optical fiber 10 is inserted into the penetration hole 11 from the bottom of the bottom plate 3 so as to make its tip surface look into the housing recess 2 and the sealing plate 12 is bonded to the bottom plate 3. On the other hand, gold-plated bumps 5 are provided in the circumference of an optical semiconductor chip 4. The chip 4 is turned upside-down so as to make its light detecting plane 5 face the optical fiber 10 and bonded to the bottom plate 3 by face- down bonding and the respective bumps 5 are electrically connected to external leads 7 through wirings 14 formed on the surface of the bottom plate 3. Then a cover 8 is attached to the package 1 to seal the optical semiconductor chip 4 in the housing recess 2. With this constitution, the accuracy of the relative position between the optical fiber and the optical semiconductor chip can be improved.
JP62187062A 1987-07-27 1987-07-27 Optical semiconductor element package Pending JPS6430274A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62187062A JPS6430274A (en) 1987-07-27 1987-07-27 Optical semiconductor element package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62187062A JPS6430274A (en) 1987-07-27 1987-07-27 Optical semiconductor element package

Publications (1)

Publication Number Publication Date
JPS6430274A true JPS6430274A (en) 1989-02-01

Family

ID=16199486

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62187062A Pending JPS6430274A (en) 1987-07-27 1987-07-27 Optical semiconductor element package

Country Status (1)

Country Link
JP (1) JPS6430274A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5424573A (en) * 1992-03-04 1995-06-13 Hitachi, Ltd. Semiconductor package having optical interconnection access
EP0726477A2 (en) * 1995-02-09 1996-08-14 AT&T IPM Corp. An arrangement for interconnecting an optical fiber to an optical component
EP0798583A1 (en) * 1996-03-28 1997-10-01 Motorola, Inc. Optoelectric interconnect and method for interconnecting an optical fibre with an optoelectric device
EP1061392A1 (en) * 1999-06-16 2000-12-20 Seiko Epson Corporation Optical module and method of manufacture thereof, semiconductor device, and optical transmission device
JP2017049435A (en) * 2015-09-02 2017-03-09 日本電信電話株式会社 Method for mounting optoelectronic integrated circuit and optoelectronic integrated circuit package

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55138283A (en) * 1979-04-16 1980-10-28 Ibm Optical transducer

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55138283A (en) * 1979-04-16 1980-10-28 Ibm Optical transducer

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5424573A (en) * 1992-03-04 1995-06-13 Hitachi, Ltd. Semiconductor package having optical interconnection access
EP0726477A2 (en) * 1995-02-09 1996-08-14 AT&T IPM Corp. An arrangement for interconnecting an optical fiber to an optical component
EP0726477A3 (en) * 1995-02-09 1997-07-30 At & T Corp An arrangement for interconnecting an optical fiber to an optical component
EP0798583A1 (en) * 1996-03-28 1997-10-01 Motorola, Inc. Optoelectric interconnect and method for interconnecting an optical fibre with an optoelectric device
EP1061392A1 (en) * 1999-06-16 2000-12-20 Seiko Epson Corporation Optical module and method of manufacture thereof, semiconductor device, and optical transmission device
JP2017049435A (en) * 2015-09-02 2017-03-09 日本電信電話株式会社 Method for mounting optoelectronic integrated circuit and optoelectronic integrated circuit package

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