JP2017049435A - Method for mounting optoelectronic integrated circuit and optoelectronic integrated circuit package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for mounting an optoelectronic integrated circuit capable of achieving light irradiation from a rear surface to a light-receiving element on the optoelectronic integrated circuit by simple alignment adjustment using a low-cost and small member.SOLUTION: An optoelectronic integrated circuit package 1 comprises an optical fiber array 4, a V-groove fiber block 6 attached to an end part on an emission side of the optical fiber array 4 so that an emission end part of the optical fiber array 4 is exposed to an end surface of the block, and the optoelectronic integrated circuit 2 fixed onto the V-groove fiber block 6. The optoelectronic integrated circuit 2 is mounted on the V-groove fiber block 6 so that a rear surface of the optoelectronic integrated circuit 2 in which a light-emitting element is formed on the surface thereof faces the end surface of the V-groove fiber block 6. The position of the optoelectronic integrated circuit 2 on the V-groove fiber block 6 is adjusted so that the incident position of light from the optical fiber array 4 to the optoelectronic integrated circuit 2 matches the position of the light-receiving element of the optoelectronic integrated circuit 2.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a method for mounting an optoelectronic integrated circuit that realizes light irradiation to a light receiving element formed on the surface of the optoelectronic integrated circuit.

  In the current data center, dozens to millions of servers are connected by a fat tree type network having a hierarchical structure composed of a large number of L2 switches (layer 2 switches), L3 switches (layer 3 switches) and routers. ing. For this reason, with the increase in scale, large delays and fluctuations in data transfer via electrical switches and routers, enormous power consumption and scalability, etc. have become major problems, and optical technologies such as optical packet switching have been introduced. Research on flat data center networks is actively underway.

  FIG. 3A shows a configuration of a data center network using a torus type structure that is currently being studied, and FIG. 3B shows a configuration of an optoelectronic type optical packet router arranged at a node of the data center network. Indicates. Dozens of servers 11 are housed in one rack 12 and connected to a ToR (Top of Rack) switch 13 placed thereon. The ToR switch 13 is connected with a large number of optoelectronic optical packet routers 14. A plurality of ToR switches 13 are connected to one optical packet router 14 and a plurality of other optical packet routers 14 are connected via an optical fiber 16. All the optical packet routers 14 are connected to the network controller 15 and controlled by the network controller 15.

  The 10 Gb Ethernet (registered trademark) data output from the ToR switch 13 connected to the transmission source server 11 is sent to the shared buffer 40 in the transmission side optical packet router 14 connected to the ToR switch 13. Based on the IP (Internet Protocol) header and MAC (Media Access Control) header of the data, a fixed-length optical label dedicated to optical packet switching is inserted at the head of the packet and sent out as a 100 Gbps optical packet in burst mode.

  A relay optical packet router 14 exists between the destination optical packet router 14 connected to the destination server 11 via the ToR switch 13 and the transmission side optical packet router 14. The optical label processor 41 of the relay optical packet router 14 reads the destination information included in the optical label of the received 100 Gbps optical packet, and controls the high-speed space optical switch 42 to switch the output port. Reference numeral 43 in FIG. 3B denotes an optical fiber delay line (FDL) used to temporarily save one optical packet when two optical packets collide.

  When receiving the 100 Gbps optical packet, the optical label processor 41 of the optical packet router 14 on the destination side deletes the optical label from the optical packet, converts it again into a normal 10 Gb Ethernet signal, and converts this 10 Gb Ethernet signal to the server on the destination side. 11 is sent to the ToR switch 13 connected to the terminal 11.

  As described above, in an optical packet switching network, it is indispensable to read the label information of the input optical packet in the burst mode at high speed and to receive the information in the buffer. For this purpose, it is necessary to convert a high-speed packet signal into a low-speed parallel signal that can be processed by a complementary metal oxide semiconductor (CMOS) circuit. As a key device for realizing such parallel conversion in the burst mode, research on a serial-parallel converter using an opto-electronic integrated circuit (OEIC) with ultra-high speed and low power consumption is in progress.

Next, a configuration example of the optical label processor 41 is shown in FIG. The optical label processor 41 includes an optical trigger pulse generator 410, a serial-parallel converter 411, a high-speed light receiving element 412, and a CMOS processor 413.
A part of the input optical packet is input to the optical trigger pulse generator 410. The optical trigger pulse generator 410 extracts only the first optical pulse from the optical packet.

  The optical trigger pulse extracted by the optical trigger pulse generator 410 is branched into the number of bits of the optical label, for example, 16 and the 16 branched optical trigger pulses are shifted in order by the time of τ (bit interval of input optical packet). Thus, the time difference is given and the serial-parallel converter 411 is irradiated. The serial-parallel converter 411 is an OEIC in which HEMT (High Electron Mobility Transistor) and MSM-PD (Metal-Semiconductor-Metal Photo Detector) are monolithically integrated.

  The high-speed light receiving element 412 converts the input optical packet into an electrical signal. The serial-parallel converter 411 receives the packet signal converted by the high-speed light-receiving element 412 and irradiates the optical trigger pulse in time, thereby extracting only the label information from the packet signal and performing low-speed parallel processing. It is designed to output as a signal. Therefore, the CMOS processor 413 can recognize the label information immediately by taking in the parallel signal.

  As described above, the OEIC can realize various functions at an extremely high speed and with low power consumption by irradiating the optical trigger pulse. However, in the example of the optical label processor, as shown in FIGS. 5A and 5B, a large optical head for irradiating the MSM-PD having a small light receiving area with the optical trigger pulse is required. Become. FIG. 5A is a plan view of the optical head arranged on the OEIC, and FIG. 5B is a cross-sectional view of the optical head.

  The optical trigger pulse extracted by the optical trigger pulse generator 410 is guided to the optical head 415 by the fiber array 414. The fiber array 414 is formed by bundling a plurality of optical fiber core wires and arranging them in one row. By changing the lengths of the plurality of optical fiber core wires, a time difference is given so that the plurality of optical trigger pulses branched as described above are sequentially shifted by the time τ. The optical fiber core wires arranged at a pitch of 250 μm of the fiber array 414 are fixed by a V-groove fiber block 416 in the optical head 415.

  The light pulse emitted from the end of the fiber array 414 is bent 90 degrees by a 45-degree mirror 417 in the optical head 415 and irradiated to the MSM-PD on the OEIC 421 by the microlens arrays 419 and 420 (Non-Patent Document 1). reference). 6A is a plan view of the MSM-PD 422 formed on the OEIC 421, FIG. 6B is a cross-sectional view taken along the line II of FIG. 6A, and FIG. 7 shows the optical head 415 disposed on the OEIC 421. It is a photograph taken. 423 is an InP substrate on which the OEIC 421 is formed, 424 is a light absorption layer of the MSM-PD 422, 425 is a + (plus) electrode of the MSM-PD 422, and 426 is a-(minus) electrode of the MSM-PD 422.

  The optical head 415 as described above is costly and alignment adjustment for accurately irradiating the MSM-PD 422 with the optical trigger pulse is very difficult. Further, as shown in FIGS. 6A and 6B, when light is irradiated from the front side of the MSM-PD 422, part of the light is reflected on the surfaces of the electrodes 425 and 426 and irradiated to the light absorption layer 424. Part of the emitted light also passes through the light absorption layer 424 without being absorbed, so that the photoelectric conversion efficiency of the MSM-PD 422 deteriorates.

  In order to improve the photoelectric conversion efficiency of the MSM-PD 422, it is generally considered that light is irradiated from the back side (InP substrate 423 side) of the MSM-PD 422. In this case, all of the irradiated light can reach the light absorption layer 424, and part of the light that has passed through the light absorption layer 424 is reflected by the electrodes 425 and 426 and sent to the light absorption layer 424 again. Therefore, the photoelectric conversion efficiency is greatly improved. However, in order to irradiate light from the back side of the MSM-PD422, it is necessary to flip the OEIC chip upside down and to flip-chip mount the OEIC chip on the interior substrate in the package, which further complicates the mounting process. It becomes.

Kiyohide Sakai et al., “Photodiode Packaging Technique Using Ball Lens and Offset Parabolic Mirror”, JOURNAL OF LIGHTWAVE TECHNOLOGY, VOL.27, NO.17, SEPTEMBER 1, 2009, pp.3874-3879

As described above, conventionally, in order to irradiate the optical trigger pulse to the MSM-PD having a small light receiving area on the OEIC, a large optical head is required. The use of such an optical head is a serious problem because it causes an increase in cost, an increase in size, and difficulty in alignment adjustment. Furthermore, in OEIC using MSM-PD, when light is irradiated from the surface, a part of the light is not absorbed, so that the photoelectric conversion efficiency of MSM-PD is extremely lowered. In order to improve the photoelectric conversion efficiency, flip chip mounting of OEIC is necessary, but there are problems in terms of complexity of mounting and cost increase.
Note that the above problem occurs in the same manner when a light receiving element other than the MSM-PD is used, and also occurs in light irradiation other than the light trigger pulse.

  The problem to be solved by the present invention is to irradiate the light receiving element on the OEIC from the back surface with extremely simple alignment adjustment using a low-cost and small-sized member without using an optical head of a large lens system. Is to realize.

  The method for mounting an optoelectronic integrated circuit according to the present invention is such that the output end face of the optical fiber array or the optical waveguide array is exposed to the end face of the optical fiber array or the optical waveguide array so that the output end face of the optical fiber array or the optical waveguide array is exposed at the end face of the fixing block. A step of attaching the block, and a step of placing the optoelectronic integrated circuit on the fixing block such that a back surface of the optoelectronic integrated circuit having a light receiving element formed on the front surface faces an end surface of the fixing block. The light is input to the incident end face of the optical fiber array or the optical waveguide array, and the incident position of the light from the optical fiber array or the optical waveguide array to the optoelectronic integrated circuit coincides with the position of the light receiving element of the optoelectronic integrated circuit. Adjusting the position of the optoelectronic integrated circuit on the fixing block, and adjusting the optoelectronic integrated circuit to the fixing block. It is characterized in that a step of fixing the.

  In addition, one configuration example of the mounting method of the optoelectronic integrated circuit according to the present invention further includes a printed circuit board provided with an opening of a size through which the fixing block can be penetrated, and mounted on the printed circuit board. Inserting the fixing block into the opening of the printed circuit board and the opening of the package housing from the back side of the printed circuit board with respect to the package housing provided with an opening of a size that allows the block to pass therethrough; Adjusting the height of the surface of the interior substrate mounted in the package housing and the optoelectronic integrated circuit fixed to the fixing block, and fixing the fixing block to the printed circuit board And a step of electrically connecting the optoelectronic integrated circuit and the interior substrate with a wire.

  In addition, the optoelectronic integrated circuit package of the present invention includes an optical fiber array or an optical waveguide array, and an optical fiber array or an optical waveguide array such that an emission end face of the optical fiber array or the optical waveguide array is exposed at an end face of the block. A fixing block attached to an end of the emitting side, and an optoelectronic integrated circuit fixed on the fixing block, and a back surface of the optoelectronic integrated circuit having a light receiving element formed on the surface and the fixing block The optoelectronic integrated circuit is placed on the fixing block so as to face the end face, and the light incident position from the optical fiber array or the optical waveguide array to the optoelectronic integrated circuit and the light receiving element of the optoelectronic integrated circuit The position of the optoelectronic integrated circuit on the fixing block is adjusted so as to match the position of It is intended to.

  Further, in one configuration example of the optoelectronic integrated circuit package of the present invention, the optoelectronic integrated circuit package is mounted on a printed circuit board provided with an opening of a size that allows the fixing block to pass therethrough, and the fixing is performed at a position coincident with the opening. The fixing block, comprising: a package housing provided with an opening of a size through which the block for use can be penetrated; and a wire for electrically connecting the optoelectronic integrated circuit and an interior substrate mounted in the package housing. Is inserted into the opening of the printed circuit board and the opening of the package housing from the back side of the printed circuit board, and is fixed to the printed circuit board at a position where the height of the surface of the optoelectronic integrated circuit and the interior substrate is the same. The optoelectronic integrated circuit and the interior board are electrically connected by the wire.

  In the case of irradiating light to a light receiving element having a small light receiving diameter on an optoelectronic integrated circuit, a large optical head using a lens system has been conventionally required. On the other hand, in the present invention, a lens-type optical head is not required, and light irradiation to the light receiving element can be realized with a very low cost and small fixing block. In the present invention, alignment adjustment of the light irradiation position is very simple. Moreover, in this invention, the photoelectric conversion efficiency of a light receiving element can be improved significantly by irradiating light to the light receiving element on an optoelectronic integrated circuit from a back surface.

1 is a cross-sectional view of an optoelectronic integrated circuit package and an enlarged cross-sectional view of an optoelectronic integrated circuit package according to an embodiment of the present invention. It is the photograph which image | photographed the V-groove fiber block and the optoelectronic integrated circuit. It is a figure which shows the structural example of the conventional torus type | mold data center network and an optical packet router. It is a figure which shows the structural example of the conventional optical label processor. It is the top view and sectional drawing of the optical head arrange | positioned on an optoelectronic integrated circuit. It is the top view and sectional drawing of MSM-PD formed in the optoelectronic integrated circuit. It is the photograph which image | photographed the optical head arrange | positioned on an optoelectronic integrated circuit.

[Principle of the Invention]
The light emitted from the optical fiber into the air propagates while the light beam is greatly expanded. Therefore, in order to irradiate light to a minute light receiving element or the like, it is necessary to collect the light again using a lens system. In the present invention, it is considered that an OEIC chip is directly attached on a fiber block for fixing an optical fiber. At this time, when the semiconductor chip is directly bonded to the output end face of the optical fiber, the refractive index of the semiconductor (for example, InP substrate) is larger than the refractive index of the optical fiber. The light propagates through the substrate and enters the light receiving element manufactured on the front surface of the semiconductor substrate from the back surface.

  Therefore, the conventional large-scale lens system optical head is not required, and an extremely compact and low-cost configuration can be realized. Furthermore, in the present invention, since the incident light is inevitably backside incident, the photoelectric conversion efficiency of the light receiving element is greatly improved.

  In addition, conventionally, in order to accurately irradiate the light receiving element with the light output from the optical head, it is necessary to perform alignment adjustment of the xyz axis in a completely groping state, which is extremely difficult. However, in the present invention, since the irradiation position of the light beam can be clearly seen by observing with a microscope from above the OEIC, the OEIC is set so that the irradiation position of the light beam coincides with the position of the light receiving element while observing the light beam. By simply adjusting the position, it is possible to irradiate light onto the light receiving element very easily and in a short time.

[Embodiment]
Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1A is a cross-sectional view of an OEIC package according to an embodiment of the present invention, and FIG. 1B is an enlarged cross-sectional view of a portion C in FIG. Here, the OEIC 2 targeted in the present embodiment is an integration of 1:16 serial-parallel converters, and 16 MSM-PDs 20 are linearly formed at intervals of 250 μm. That is, the OEIC package 1 is a 1:16 serial-parallel converter packaged. The OEIC package 1 is mounted on a printed circuit board (PCB) 3.

  The MSM-PD 20 is formed on the InP substrate 21 of the OEIC 2, the light absorption layer 22 formed on the InP substrate 21, the + (plus) electrode 23 formed on the light absorption layer 22, and the light absorption layer 22. -(Minus) electrode 24.

  The optical fiber array 4 that guides the light irradiated to the MSM-PD 20 of the OEIC 2 is a bundle of 16 optical fiber core wires 5 arranged in a row. The output side end of the optical fiber array 4 is fixed by a V-groove fiber block 6 (fixing block) so that 16 optical fiber core wires 5 are arranged in a line at intervals of 250 μm. The V-groove fiber block 6 has an optical fiber core wire 5 arranged one by one in 16 V-shaped grooves of a V-groove substrate made of glass or ceramics. It is fixed so as to sandwich the core wire 5. The exit end face of the optical fiber array 4 is optically polished. Further, the end face of the V-groove fiber block 6 is polished so as to have the same height as the outgoing end face of the optical fiber array 4.

  In order for the light emitted from the 10 μm core of each optical fiber core wire 5 to propagate through the InP substrate 21 and efficiently enter the 20 μm square MSM-PD 20 formed on the surface, the light beam incident on the MSM-PD 20 Therefore, it is necessary to polish the InP substrate 21 of the OEIC 2 so that the thickness thereof is about 100 μm. Further, the back surface of the OEIC 2 is optically polished in the same manner, and the back surface of the OEIC 2 (the back surface of the InP substrate 21) is used to suppress reflection of light at the interface between the optical fiber array 4 and the V-groove fiber block 6 and the OEIC 2. It is desirable to deposit a non-reflective coating material.

  Next, the exit end face of the V-groove fiber block 6 (the face where the exit end face of each optical fiber core wire 5 of the optical fiber array 4 is exposed) and the back surface of the OEIC 2 face each other on the V-groove fiber block 6. The OEIC 2 is placed (FIG. 2). In this state, light is input from a light source (not shown) to the incident end face of the optical fiber array 4, and the light guided by the optical fiber array 4 is incident on the OEIC 2 from the back surface.

  Then, the light passing through the OEIC 2 is observed from above the OEIC 2 with an IR (Infrared) camera microscope so that the incident position of the light from the optical fiber array 4 to the OEIC 2 matches the position of the MSM-PD 20 of the OEIC 2. After adjusting the position of the OEIC 2 on the V-groove fiber block 6, the V-groove fiber block 6 and the OEIC 2 are fixed with an adhesive. Here, since the adhesive is not applied to the interface between the V-groove fiber block 6 and the OEIC 2 and the position is adjusted and then fixed, the OEIC 2 is fixed to the V-groove fiber block 6 with the adhesive adhered to the side of the OEIC 2 To do.

  Thus, the configuration as shown in FIG. 2 is completed, and the optical connection between the OEIC 2 and the optical fiber array 4 can be realized. Since the OEIC 2 is placed on the exit end face of the V-groove fiber block 6, it is desirable that the planar dimension of the exit end face of the V-groove fiber block 6 is equal to or greater than the planar dimension of the OEIC 2.

  The package housing 7 made of ceramics, for example, of the OEIC package 1 is mounted on the printed circuit board 3 as described above. The package housing 7 has an opening of a size that allows the V-groove fiber block 6 to pass through along a direction perpendicular to the plane of the interior substrate 8 mounted in the package housing 7 (vertical direction in FIG. 1A). Is provided. Similarly, the printed circuit board 3 is provided with an opening having a size through which the V-groove fiber block 6 can pass along a direction perpendicular to the plane. The package housing 7 is mounted on the printed circuit board 3 so that the position of the opening matches the position of the opening of the printed circuit board 3.

  A GPPO (registered trademark) connector 10 for electrical connection to the outside is attached to the package housing 7, and wiring (not shown) on the interior substrate 8 and the GPPO connector 10 are electrically connected. Has been. Further, terminals (not shown) connected to the wiring on the interior board 8 are provided on the outside of the package housing 7, and the wiring (not shown) on the printed board 3 and the OEIC package are connected via the terminals. 1 is electrically connected.

  Next, with the OEIC 2 fixed on the V-groove fiber block 6, the back side of the printed circuit board 3 along the light propagation direction in the V-groove fiber block 6 (from the bottom to the top in FIG. 1A) After inserting the V-groove fiber block 6 into the opening of the printed circuit board 3 and the opening of the package housing 7 and adjusting the surface height of the OEIC 2 and the interior substrate 8 to coincide with each other, The printed board 3 is fixed with an adhesive.

  Then, the pad formed on the OEIC 2 and the pad formed on the interior substrate 8 are electrically connected by a wire 9. In this way, electrical connection between the OEIC 2 and the outside can be realized. By attaching a lid (lid) (not shown) to the package housing 7, the OEIC package 1 is completed.

  In this embodiment, the MSM-PD has been described as an example of the light receiving element of the OEIC 2. However, the present invention can be applied to light receiving elements other than the MSM-PD (however, 10 μm). It is difficult to apply to the following extremely small light receiving elements). The present invention is also applicable to OEICs other than serial-parallel converters.

  In this embodiment, the optical fiber array 4 is used as a means for transmitting light to the light receiving element of the OEIC 2. However, the present invention can also be applied to a glass waveguide or a semiconductor optical waveguide array. In this case, as in the case of the optical fiber array 4, a fixing block made of glass or ceramics sandwiching the end of the output side of the optical waveguide array is bonded to the optical waveguide array. The plane dimension of the output end face of the fixing block (the surface where the output end face of each optical waveguide of the optical waveguide array is exposed) is preferably equal to or larger than the plane dimension of the OEIC. As in the case of the optical fiber array, the exit end face of the fixing block and the exit end face of the optical waveguide array are optically polished.

  Then, the OEIC 2 is placed on the fixing block so that the output end face of the fixing block and the back surface of the OEIC 2 face each other. After the position of the OEIC 2 on the fixing block is adjusted so as to match, the fixing block and the OEIC 2 are fixed with an adhesive. The subsequent steps are the same as in the case of the optical fiber array.

  In this embodiment, the V-groove fiber block in which the optical fiber core wires of the optical fiber array are linearly arranged has been described as an example. However, the arrangement of the optical fiber core wires or the optical waveguides in the fixing block is arbitrary. is there. The arrangement of the optical fiber core wire or the optical waveguide in the fixing block varies depending on the arrangement of the light receiving elements on the OEIC. In the present invention, when the OEIC is placed on the output end face of the fixing block, if the point where the light incident position from the optical fiber array or optical waveguide array to the OEIC matches the position of the light receiving element of the OEIC is found. The arrangement of the optical fiber core wire or the optical waveguide in the fixing block may be set in advance so that such a coincidence point is generated.

  The present invention can be applied to a technique of irradiating light from the back surface to a light receiving element formed on the surface of an optoelectronic integrated circuit.

  DESCRIPTION OF SYMBOLS 1 ... Optoelectronic integrated circuit package, 2 ... Optoelectronic integrated circuit, 3 ... Printed circuit board, 4 ... Optical fiber array, 5 ... Optical fiber core wire, 6 ... V groove fiber block, 7 ... Package housing, 8 ... Interior substrate, 9 ... Wires, 10 ... GPPO connector, 20 ... MSM-PD, 21 ... InP substrate, 22 ... light absorption layer, 23 ... + electrode, 24 ...- electrode.

Claims (4)

Attaching the fixing block to the output side end of the optical fiber array or the optical waveguide array so that the output end surface of the optical fiber array or the optical waveguide array is exposed on the end surface of the fixing block;
Placing the optoelectronic integrated circuit on the fixing block such that the back surface of the optoelectronic integrated circuit having a light receiving element formed on the surface faces the end face of the fixing block;
Light is input to the incident end face of the optical fiber array or optical waveguide array, and the incident position of light from the optical fiber array or optical waveguide array to the optoelectronic integrated circuit coincides with the position of the light receiving element of the optoelectronic integrated circuit. Adjusting the position of the optoelectronic integrated circuit on the fixing block,
And a step of fixing the optoelectronic integrated circuit to the fixing block. In the mounting method of the optoelectronic integrated circuit of Claim 1,
Furthermore, a printed circuit board provided with an opening of a size through which the fixing block can pass, and a package housing mounted on the printed circuit board and provided with an opening of a size through which the fixing block can pass. In contrast, the step of inserting the fixing block into the opening of the printed circuit board and the opening of the package housing from the back side of the printed circuit board,
Adjusting the optoelectronic integrated circuit fixed to the fixing block and the height of the surface of the interior substrate mounted in the package housing to match,
Fixing the fixing block to the printed circuit board; and
A method for mounting an optoelectronic integrated circuit, comprising the step of electrically connecting the optoelectronic integrated circuit and the interior substrate with a wire. An optical fiber array or an optical waveguide array;
A fixing block attached to the output side end of the optical fiber array or optical waveguide array so that the output end surface of the optical fiber array or optical waveguide array is exposed at the end surface of the block;
An optoelectronic integrated circuit fixed on the fixing block;
The optoelectronic integrated circuit is mounted on the fixing block such that the back surface of the optoelectronic integrated circuit having a light receiving element formed on the front surface faces an end surface of the fixing block, and the optical fiber array or the optical waveguide. The position of the optoelectronic integrated circuit on the fixing block is adjusted so that the incident position of light from the array to the optoelectronic integrated circuit matches the position of the light receiving element of the optoelectronic integrated circuit. Optoelectronic integrated circuit package. The optoelectronic integrated circuit package of claim 3.
Further, the package is mounted on a printed circuit board provided with an opening of a size through which the fixing block can be penetrated, and an opening of a size through which the fixing block can be penetrated at a position coincident with the opening. A housing,
A wire for electrically connecting the optoelectronic integrated circuit and an interior substrate mounted in the package housing;
The fixing block is inserted into the opening of the printed circuit board and the opening of the package housing from the back side of the printed circuit board, and the printed circuit board is positioned at a position where the heights of the optoelectronic integrated circuit and the surface of the interior substrate coincide with each other. Fixed to the board,
The optoelectronic integrated circuit package, wherein the optoelectronic integrated circuit and the interior substrate are electrically connected by the wire.