JPS5655831A - Mounting method for pressure-sensor assembly - Google Patents

Mounting method for pressure-sensor assembly

Info

Publication number
JPS5655831A
JPS5655831A JP13191779A JP13191779A JPS5655831A JP S5655831 A JPS5655831 A JP S5655831A JP 13191779 A JP13191779 A JP 13191779A JP 13191779 A JP13191779 A JP 13191779A JP S5655831 A JPS5655831 A JP S5655831A
Authority
JP
Japan
Prior art keywords
substrate
pressure
assembly
electrode
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13191779A
Other languages
Japanese (ja)
Inventor
Kiyomitsu Suzuki
Kazuji Yamada
Motohisa Nishihara
Shigeyuki Kobori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP13191779A priority Critical patent/JPS5655831A/en
Publication of JPS5655831A publication Critical patent/JPS5655831A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/142—Multiple part housings
    • G01L19/143—Two part housings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

PURPOSE:To make the device small-sized and increase the reliability thereof by a method wherein the pressure-sensor assembly is arranged on the side of a substrate of ceramics whereon a thick- film conductor is not formed and the electrode of the sensor is connected with the thick-film conductor by solder through the intermediary of the hole made in the substrate. CONSTITUTION:The pressure-sensor assembly wherein a silicone member 4 formed of a semiconductor strain gage 2 and the electrode 3 provided at one end of the gage 2 is bonded on to a diaphragm 1 is prepared on a glass member 6 with a hole 5 for introducing the pressure to be measured in the center thereof. This assembly is arranged in a concavity 20 formed in the substrate 7 of ceramics, the solder 11 is put on the hole 10 of the substrate 7 and the thick-film conductor 8 on the substrate 7 is connected with the electrode 3, whereby the assembly is fixed to the substrate 7. Next, the substrate 7 and the glass member 6 of the assembly are bonded to a case 13 by a bonding agent 14, an IC amplifier 9, the conductor 8 and the member 4 are covered with a gel-like substance 18 whose modulus of rigidity is small and which has humidity-proof properties, then a cover plate 15 is bonded and thus the pressure sensor 100 is completed. In this way, the part wherein the electrode 3 is joined to the conductor 8 by the solder 11 is constituted so as not to be overstrained by the pressure to be measured, vibrations and the change in the temperature.
JP13191779A 1979-10-15 1979-10-15 Mounting method for pressure-sensor assembly Pending JPS5655831A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13191779A JPS5655831A (en) 1979-10-15 1979-10-15 Mounting method for pressure-sensor assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13191779A JPS5655831A (en) 1979-10-15 1979-10-15 Mounting method for pressure-sensor assembly

Publications (1)

Publication Number Publication Date
JPS5655831A true JPS5655831A (en) 1981-05-16

Family

ID=15069205

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13191779A Pending JPS5655831A (en) 1979-10-15 1979-10-15 Mounting method for pressure-sensor assembly

Country Status (1)

Country Link
JP (1) JPS5655831A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61278729A (en) * 1985-06-03 1986-12-09 Yokogawa Electric Corp Pressure detecting device
JPH05231971A (en) * 1991-11-20 1993-09-07 Delco Electron Corp Pressure sensor and manufacture thereof
US5266827A (en) * 1992-04-16 1993-11-30 Fuji Electric Co., Ltd. Semiconductor pressure sensor assembly having an improved package structure

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61278729A (en) * 1985-06-03 1986-12-09 Yokogawa Electric Corp Pressure detecting device
JPH05231971A (en) * 1991-11-20 1993-09-07 Delco Electron Corp Pressure sensor and manufacture thereof
US5266827A (en) * 1992-04-16 1993-11-30 Fuji Electric Co., Ltd. Semiconductor pressure sensor assembly having an improved package structure

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