JPH0665974B2 - Method for manufacturing pressure sensor unit - Google Patents
Method for manufacturing pressure sensor unitInfo
- Publication number
- JPH0665974B2 JPH0665974B2 JP5133482A JP5133482A JPH0665974B2 JP H0665974 B2 JPH0665974 B2 JP H0665974B2 JP 5133482 A JP5133482 A JP 5133482A JP 5133482 A JP5133482 A JP 5133482A JP H0665974 B2 JPH0665974 B2 JP H0665974B2
- Authority
- JP
- Japan
- Prior art keywords
- liquid
- hollow pipe
- diaphragm
- sensor unit
- pressure sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/142—Multiple part housings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0007—Fluidic connecting means
- G01L19/0038—Fluidic connecting means being part of the housing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0061—Electrical connection means
- G01L19/0084—Electrical connection means to the outside of the housing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
- G01L19/0627—Protection against aggressive medium in general
- G01L19/0645—Protection against aggressive medium in general using isolation membranes, specially adapted for protection
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、ピエゾ抵抗型圧力センサユニットの製造方法
に係り、特に液封構造に好適な圧力センサユニットの製
造方法に関する。The present invention relates to a method for manufacturing a piezoresistive pressure sensor unit, and more particularly to a method for manufacturing a pressure sensor unit suitable for a liquid sealing structure.
従来のピエゾ抵抗型圧力センサを第１図に示す。41は、
シールダイアフラムでありボディ２に溶接により気密に
接合されている。５は、封入液であり、９は封入穴であ
る。また、シリコンダイアフラム21とダイ22及びポスト
29は互いに固着されており、これらのボディ２は溶接に
より気密に接合されている。本構造で封入液５を液封す
る場合、液封穴９を用いてシールダイアフラム41とボデ
ィ２間の空間を真空にし、封入液５を、液封穴９を通
し、充填し、次に真空解除する。充填後はスチールボー
ル91を打ち込み封入液５の漏れを遮断していた。A conventional piezoresistive pressure sensor is shown in FIG. 41 is
It is a seal diaphragm and is hermetically joined to the body 2 by welding. Reference numeral 5 is a fill liquid, and 9 is a fill hole. Also, the silicon diaphragm 21, die 22 and post
29 are fixed to each other, and these bodies 2 are hermetically joined by welding. When the sealed liquid 5 is liquid-sealed with this structure, the space between the seal diaphragm 41 and the body 2 is evacuated using the liquid sealing hole 9, the sealed liquid 5 is filled through the liquid sealing hole 9, and then the vacuum is applied. To release. After the filling, the steel ball 91 was driven in to block the leakage of the enclosed liquid 5.
上記従来技術は、液封用の穴をボディに加工する必要が
あるため製造コストがかかりボディの小型化が難しいと
いう問題があった。また、封入液の漏れを防止する方法
としてスチールボールを打ち込み、その後その上を接続
していたため、製造工程が多くなるという問題があっ
た。The above-mentioned conventional technique has a problem that it is difficult to reduce the size of the body because the manufacturing cost is increased because it is necessary to process the liquid sealing hole in the body. Further, as a method of preventing the leakage of the enclosed liquid, a steel ball was driven in and then the steel ball was connected to the steel ball, and there was a problem that the number of manufacturing steps was increased.
本発明の目的は、簡易な方法で液封構造ができる圧力セ
ンサユニットの製造方法を提供することにある。An object of the present invention is to provide a method for manufacturing a pressure sensor unit that can have a liquid-sealed structure by a simple method.
上記目的は、ひずみゲージを有するシリコンダイヤフラ
ムをボディの中央部に固着し、外部との電気的接続用の
中実ピンと前記中実ピンと同工程で製作された液封用の
中空パイプとを絶縁する気密ガラス端子を前記ボディの
一部に加熱封着し、前記シリコンダイヤフラムを覆うよ
うにキャップ状シールダイヤフラムと前記ボディの外周
部とを気密接合し、前記中空パイプを通して前記ボディ
と前記シールダイヤフラムとの間に封入液を封入し、前
記封入液の外部への漏れを防止するように溶接または半
田により前記中空パイプを潰すことにより達成される。The purpose is to fix a silicon diaphragm having a strain gauge to the center of the body, and to insulate the solid pin for electrical connection to the outside and the hollow pipe for liquid sealing manufactured in the same process as the solid pin. An airtight glass terminal is heat-sealed to a part of the body, a cap-shaped seal diaphragm and an outer peripheral portion of the body are airtightly bonded so as to cover the silicon diaphragm, and the body and the seal diaphragm are passed through the hollow pipe. This can be achieved by filling an encapsulating liquid between them and crushing the hollow pipe with welding or solder so as to prevent the encapsulating liquid from leaking to the outside.
シリコンダイヤフラムを覆うようにキャップ状シールダ
イヤフラムとボディの外周部とを気密接合し、その後の
中空パイプを通してボディとシールダイヤフラムとの間
に封入液を封入しているため、ボディの加工なくして封
入液を封入することができる。また、気密ガラス端子で
外部と遮断されているため、封液後の漏れ対策は単にパ
イプを潰すだけで良い。The cap-shaped seal diaphragm and the outer peripheral part of the body are airtightly bonded so as to cover the silicon diaphragm, and the enclosed liquid is enclosed between the body and the seal diaphragm through the hollow pipe after that, so the enclosed liquid is not processed in the body. Can be enclosed. Further, since the airtight glass terminal is shielded from the outside, it is only necessary to crush the pipe to prevent leakage after sealing the liquid.
以下、本発明の一実施例を第２図により説明する。１は
導圧金具、２はボディ、３はハウジングである。導圧金
具１とハウジング３は、ボディ２を内部に収納し、ネジ
で締結される。６は、Ｏリングで、導圧金具１とボディ
２及びハウジング３内の気密を行う。ボディ２の中央部
には、シリコンとほぼ同じ線膨張係数を有する絶縁物
（例えばパイレックスガラス）からなるダイ22が、接着
剤28により固着されている。ダイ28の上面には、シリコ
ンダイアフラム21が、陽極結合法などによって接合され
ている。シリコンダアヤフラム21は単結晶から成り、そ
の中央片裏面がエッチング等によって一部除去され、薄
日の起歪部と厚肉の固定部を構成している。シリコンダ
イアフラム21上には、ピエゾ抵抗素子211が選択的に拡
散されていて、その端子部にはアルミニウム電極212が
蒸着されている。また、ホディ２の周囲には、中実ピン
23と中空パイプ24を絶縁する気密ガラス端子25が、加熱
封着されている。そして、アルミニウム電極212と中実
ピン23とは金線26で接続されている。７は、厚膜抵抗網
からなる出力調整回路であり温度補償や他の補償のため
抵抗が配置されており、かつ、中実ピン23と半田等によ
り接続されている。71は、出力増幅回路であり、出力調
整回路７と接続されている。８は、出力リード線であ
り、出力増幅回路71に接続され、外部へ電気信号を伝送
する。４はキャップ状シールダイアフラムであり、サイ
リスタ、パワートランジスタなどの各種ICのカン封じ技
術を利用しボディの一部にプロジェクション接合してい
る。材質は、ステンレスであり、加工はプレスが適して
いる。キャップ状シールダイアフラム４の外周部とボデ
ィ２は、プロジェクション接合により気密接合される。
この接合後、ボディ２の周囲に形成されている中空パイ
プ24の穴を通じてキャップ状シールダイアフラム４とボ
ディ２で囲まれた空間を10-2〜10-3mmHg程度の真空にす
る。後、シリコ油などの封入液５を中空パイプ24を通
じ、キャップ状シールダイアフラム内に入れ、真空を解
除してこれを封入する。封入後、中空パイプ24を溶接や
半田等によりつぶし、封入液と外気を完全に遮断する。An embodiment of the present invention will be described below with reference to FIG. Reference numeral 1 is a pressure guide fitting, 2 is a body, and 3 is a housing. The pressure guide fitting 1 and the housing 3 house the body 2 inside and are fastened with screws. Reference numeral 6 denotes an O-ring that hermetically seals the pressure guide fitting 1, the body 2 and the housing 3. A die 22 made of an insulating material (for example, Pyrex glass) having a linear expansion coefficient substantially the same as that of silicon is fixed to the center of the body 2 with an adhesive 28. A silicon diaphragm 21 is bonded to the upper surface of the die 28 by an anodic bonding method or the like. The silicon daiafram 21 is made of a single crystal, and the back surface of the central piece is partially removed by etching or the like to form a strained portion on a thin day and a thick fixed portion. A piezoresistive element 211 is selectively diffused on the silicon diaphragm 21, and an aluminum electrode 212 is vapor-deposited on the terminal portion thereof. Also, around the body 2, a solid pin
An airtight glass terminal 25 that insulates the hollow pipe 23 and the hollow pipe 24 is heat-sealed. The aluminum electrode 212 and the solid pin 23 are connected by the gold wire 26. Reference numeral 7 is an output adjusting circuit composed of a thick film resistor network, in which resistors are arranged for temperature compensation and other compensation, and are connected to the solid pins 23 by soldering or the like. 71 is an output amplifier circuit, which is connected to the output adjustment circuit 7. Reference numeral 8 is an output lead wire, which is connected to the output amplifier circuit 71 and transmits an electric signal to the outside. Reference numeral 4 is a cap-shaped seal diaphragm, which is projection-bonded to a part of the body by using a can-sealing technology for various ICs such as thyristors and power transistors. The material is stainless steel, and a press is suitable for processing. The outer peripheral portion of the cap-shaped seal diaphragm 4 and the body 2 are airtightly joined together by projection joining.
After this joining, the space surrounded by the cap-shaped seal diaphragm 4 and the body 2 is evacuated to about 10 -2 to 10 -3 mmHg through the hole of the hollow pipe 24 formed around the body 2. After that, the filling liquid 5 such as silicon oil is put into the cap-shaped seal diaphragm through the hollow pipe 24, the vacuum is released, and this is sealed. After filling, the hollow pipe 24 is crushed by welding, soldering or the like to completely shut off the filled liquid from the outside air.
以上のように組立てたセンサユニット２をハウジング３
に納め、Ｏリング６を挟んで導体金具１押え、これとハ
ウジング間に設けたねじでセンサユニットを装着する。The sensor unit 2 assembled as described above is attached to the housing 3
Then, hold the conductor fitting 1 with the O-ring 6 in between, and attach the sensor unit with the screw provided between the conductor fitting 1 and the housing.
以下、実施例の動作の説明をする。第２図のように、導
圧口11より圧力はキャップ状シールダイアフラムに達す
る。キャップ状シールダイアフラムは、厚みが極めて薄
いため（約50μｍ）殆んど圧力を低下させることなく、
圧力を封入液５に伝達する。この圧力により、シリコン
ダイアフラム21が変形する。そのひずみによってピエゾ
抵抗素子211の抵抗が変化し、それに基づく電気信号が
金線26、中軸ピン23、出力調整回路７、出力増幅回路71
及び出力リード線８を伝わり外部に取り出される。ただ
し、一般的には、出力感度を高くしたり、温度補償その
他の補償を容易にするため、シリコンダイアフラム21が
圧力によって変形した際に圧縮ひずみが生じる位置と引
張りひずみが生ずる位置に複数個のピエゾ抵抗素子211
を設けて、これらでブリッジ回路を構成し、電気的な出
力を取り出すようにしている。以上の説明で、以下に本
実施例の効果を説明する。The operation of the embodiment will be described below. As shown in FIG. 2, the pressure reaches the cap-shaped seal diaphragm from the pressure guide port 11. Since the cap-shaped seal diaphragm is extremely thin (about 50 μm), there is almost no decrease in pressure.
The pressure is transmitted to the fill liquid 5. This pressure deforms the silicon diaphragm 21. The resistance of the piezoresistive element 211 changes due to the distortion, and an electric signal based on it changes to the gold wire 26, the center pin 23, the output adjusting circuit 7, the output amplifying circuit 71.
And it is taken out through the output lead wire 8. However, in general, in order to increase the output sensitivity and to facilitate temperature compensation and other compensation, a plurality of silicon diaphragms 21 are placed at a position where compressive strain is generated and a position where tensile strain is generated when the silicon diaphragm 21 is deformed by pressure. Piezoresistive element 211
Is provided, and a bridge circuit is configured with these to take out an electrical output. In the above description, the effects of this embodiment will be described below.
第１に、封液用の中空パイプ24は、ピエゾ抵抗素子211
の出力信号伝送用の中実ピン23の同工程で製作されるた
め、工程削減できる。さらに、気密ガラス端子25で外部
と遮断されているため、封液後の漏れ対策は単にパイプ
をつぶすだけで良く簡単であり、かつ、中空パイプ24の
内径は0.2mm程度と小さいため信頼性も高い。第３に、
圧力センサユニットは、それのみで完全に圧力センサの
機能を有している。そのため、測定流体のあらゆる圧力
取出し口に対応できるようにハウジング３及び導圧金具
１を選定することができる。さらに、圧力センサユニッ
トを直接測定流体の装置に内蔵することもできる。First, the hollow pipe 24 for sealing liquid is provided with the piezoresistive element 211
Since the solid pin 23 for transmitting the output signal of is manufactured in the same process, the number of processes can be reduced. Furthermore, since it is shut off from the outside by the airtight glass terminal 25, it is easy to prevent leakage after sealing the liquid by simply crushing the pipe, and the hollow pipe 24 has a small inner diameter of about 0.2 mm, which is also reliable. high. Third,
The pressure sensor unit has the function of the pressure sensor by itself. Therefore, the housing 3 and the pressure guide fitting 1 can be selected so as to be compatible with all pressure outlets of the measurement fluid. Furthermore, the pressure sensor unit can be directly incorporated in the device for measuring fluid.
また、キャップ状シールダイアフラム４は、加工及びボ
ディ２との接合工程が量産に向き、加工コスト及び組立
てコストが低減できる。さらに、キャップ状シールダイ
アフラム４を用いた液封では、封入は0.1〜0.2cc程度の
小量で良い。また、圧力センサユニット自体も小型であ
るため、一度の工程で多数個の液封が可能である。Further, the cap-shaped seal diaphragm 4 is suitable for mass production in the processing and joining process with the body 2, and the processing cost and the assembly cost can be reduced. Further, in the liquid sealing using the cap-shaped seal diaphragm 4, the sealing amount may be as small as 0.1 to 0.2 cc. Also, since the pressure sensor unit itself is small, it is possible to seal a large number of liquids in one process.
〔発明の効果〕 本発明によれば、キャップ状シールダイアフラムと液封
用中空パイプを用いることにより、簡単でかつ信頼性の
高い液封ができる圧力センサユニットの製造方法を提供
することができる。[Advantages of the Invention] According to the present invention, it is possible to provide a method for manufacturing a pressure sensor unit capable of performing a liquid seal easily and with high reliability by using a cap-shaped seal diaphragm and a liquid sealing hollow pipe.
第１図は、従来の構造の断面図、第２図は本実施例の断
面図である。 〔符号の説明〕 １……導圧金具、２……ボディ、11……導圧口、21……
シリコンダイアフラム、22……ダイ、23……中軸ピン、
24……中空パイプ、25……気密ガラス端子、26……金
線、27……パイプ潰し部、28……接着剤、211……ピエ
ゾ抵抗素子、212……アルミニウム電極、29……ポス
ト、３……ハウジング、４……キャップ状シールダイア
フラム、５……封入液、６……Ｏリング、７……出力調
整回路、71……出力増幅器、８……出力リード線。FIG. 1 is a sectional view of a conventional structure, and FIG. 2 is a sectional view of this embodiment. [Explanation of symbols] 1 ... pressure guide fitting, 2 ... body, 11 ... pressure guide port, 21 ...
Silicon diaphragm, 22 …… die, 23 …… center pin,
24 …… Hollow pipe, 25 …… Airtight glass terminal, 26 …… Gold wire, 27 …… Pipe crushed part, 28 …… Adhesive, 211 …… Piezoresistive element, 212 …… Aluminum electrode, 29 …… Post, 3 ... Housing, 4 ... Cap-shaped seal diaphragm, 5 ... Filled liquid, 6 ... O-ring, 7 ... Output adjustment circuit, 71 ... Output amplifier, 8 ... Output lead wire.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 鈴木 清光 茨城県日立市幸町３丁目１番１号 株式会 社日立製作所日立研究所内 (72)発明者 山田 一二 茨城県日立市幸町３丁目１番１号 株式会 社日立製作所日立研究所内 ─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Kiyomitsu Suzuki 3-1-1, Saiwaicho, Hitachi City, Ibaraki Hitachi Ltd. Hitachi Research Laboratory (72) Inventor, Koji Yamada 3-chome, Hitachi City, Ibaraki Prefecture No. 1 No. 1 in Hitachi Research Laboratory, Hitachi Ltd.
Claims (1)
ムをボディの中央部に固着し、外部との電気的接続用の
中実ピンと前記中実ピンと同工程で製作された液封用の
中空パイプとを絶縁する気密ガラス端子を前記ボディの
一部に加熱封着し、前記シリコンダイヤフラムを覆うよ
うにキャップ状シールダイヤフラムと前記ボディの外周
部とを気密接合し、前記中空パイプを通して前記ボディ
と前記シールダイヤフラムとの間に封入液を封入し、前
記封入液の外部への漏れを防止するように溶接または半
田により前記中空パイプを潰すことを特徴とする圧力セ
ンサユニットの製造方法。1. A silicon diaphragm having a strain gauge is fixed to a central portion of a body to insulate a solid pin for electrical connection with the outside and a hollow pipe for liquid sealing manufactured in the same process as the solid pin. The airtight glass terminal is heat-sealed to a part of the body, the cap-shaped seal diaphragm and the outer peripheral portion of the body are airtightly bonded so as to cover the silicon diaphragm, and the body and the seal diaphragm are passed through the hollow pipe. A method for manufacturing a pressure sensor unit, characterized in that an encapsulating liquid is enclosed between the two, and the hollow pipe is crushed by welding or solder so as to prevent the enclosed liquid from leaking to the outside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5133482A JPH0665974B2 (en) | 1982-03-31 | 1982-03-31 | Method for manufacturing pressure sensor unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5133482A JPH0665974B2 (en) | 1982-03-31 | 1982-03-31 | Method for manufacturing pressure sensor unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58168930A JPS58168930A (en) | 1983-10-05 |
| JPH0665974B2 true JPH0665974B2 (en) | 1994-08-24 |
Family
ID=12884017
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5133482A Expired - Lifetime JPH0665974B2 (en) | 1982-03-31 | 1982-03-31 | Method for manufacturing pressure sensor unit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0665974B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014167464A (en) * | 2013-01-31 | 2014-09-11 | Saginomiya Seisakusho Inc | Sealing method of pipe, sealing method of pipe for oil filling of liquid seal pressure sensor, and liquid seal pressure sensor |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USRE33518E (en) * | 1983-04-29 | 1991-01-15 | Baxter International, Inc. | Pressure transducer assembly |
| DE3337978A1 (en) * | 1983-10-19 | 1985-05-15 | Deutsche Forschungs- und Versuchsanstalt für Luft- und Raumfahrt e.V., 5000 Köln | DEVICE FOR MEASURING PRESSURES AND PRESSURE TIMES |
| JPH0267938A (en) * | 1988-09-01 | 1990-03-07 | Nippon Denso Co Ltd | Pressure sensor |
| WO1994014042A1 (en) * | 1992-12-11 | 1994-06-23 | Nippondenso Co., Ltd. | Semiconductor type pressure sensor |
| US5459351A (en) * | 1994-06-29 | 1995-10-17 | Honeywell Inc. | Apparatus for mounting an absolute pressure sensor |
| DE29502825U1 (en) * | 1995-02-21 | 1996-06-20 | Keller AG für Druckmeßtechnik, Winterthur | Piezoresistive pressure sensor or pressure sensor |
| KR100964923B1 (en) * | 2007-09-21 | 2010-06-23 | 주식회사 롤팩 | Pressure Sensor and Device for Preventing Air Inflow into the Pressure Sensor |
| KR100997488B1 (en) * | 2008-04-02 | 2010-12-01 | 이성기 | Pressure sensor for commercial vehicle |
| KR100982746B1 (en) | 2008-05-09 | 2010-09-20 | 군산대학교산학협력단 | Pressure sensor and pressure detection device having the same |
| KR101017304B1 (en) | 2008-12-10 | 2011-03-02 | 이성기 | Manufacturing method for pressure sensor for commercial vehicle |
| JP2019200200A (en) * | 2018-05-09 | 2019-11-21 | アズビル株式会社 | Pressure measurement device |
-
1982
- 1982-03-31 JP JP5133482A patent/JPH0665974B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014167464A (en) * | 2013-01-31 | 2014-09-11 | Saginomiya Seisakusho Inc | Sealing method of pipe, sealing method of pipe for oil filling of liquid seal pressure sensor, and liquid seal pressure sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58168930A (en) | 1983-10-05 |
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