JPS6429843U - - Google Patents
Info
- Publication number
- JPS6429843U JPS6429843U JP12540587U JP12540587U JPS6429843U JP S6429843 U JPS6429843 U JP S6429843U JP 12540587 U JP12540587 U JP 12540587U JP 12540587 U JP12540587 U JP 12540587U JP S6429843 U JPS6429843 U JP S6429843U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- resin
- sealed
- mounting substrate
- external leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例の封止樹脂（破線の
囲み）を透視して示した斜視図、第２図は従来の
樹脂封止型半導体装置の封止樹脂を透視して示し
た斜視図である。 １，１１……半導体チツプ搭載基板、２……半
導体チツプ、３……外部リード、４……ボンデイ
ング線、５……絶縁物、６……封止樹脂。
囲み）を透視して示した斜視図、第２図は従来の
樹脂封止型半導体装置の封止樹脂を透視して示し
た斜視図である。 １，１１……半導体チツプ搭載基板、２……半
導体チツプ、３……外部リード、４……ボンデイ
ング線、５……絶縁物、６……封止樹脂。
Claims (1)
- 半導体チツプ搭載基板に半導体チツプを搭載し
、この半導体チツプ上の電極と外部リードとの間
をボンデイング線で接続し樹脂封止してなる半導
体装置において、前記外部リードは前記半導体チ
ツプ搭載基板に絶縁物を介して接着されているこ
とを特徴とする樹脂封止型半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12540587U JPS6429843U (ja) | 1987-08-17 | 1987-08-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12540587U JPS6429843U (ja) | 1987-08-17 | 1987-08-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6429843U true JPS6429843U (ja) | 1989-02-22 |
Family
ID=31375987
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12540587U Pending JPS6429843U (ja) | 1987-08-17 | 1987-08-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6429843U (ja) |
-
1987
- 1987-08-17 JP JP12540587U patent/JPS6429843U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6429843U (ja) | ||
| JPH0176040U (ja) | ||
| JPS5977241U (ja) | 樹脂封止型半導体装置 | |
| JP2629461B2 (ja) | 樹脂封止形半導体装置 | |
| JPH01112044U (ja) | ||
| JPH02101544U (ja) | ||
| JPH03116032U (ja) | ||
| JPS59117166U (ja) | 樹脂封止型半導体装置 | |
| JPS61127644U (ja) | ||
| JPH0254248U (ja) | ||
| JPS6196556U (ja) | ||
| JPH01140843U (ja) | ||
| JPS63174449U (ja) | ||
| JPH0275736U (ja) | ||
| JPS5840843U (ja) | 樹脂封止型半導体装置 | |
| JPH01120342U (ja) | ||
| JPH0343738U (ja) | ||
| JPH06334100A (ja) | 半導体装置及びそのリードフレーム | |
| JPS592155U (ja) | 樹脂封止集積回路 | |
| JPS61123544U (ja) | ||
| JPH01120343U (ja) | ||
| JPS6033452U (ja) | 樹脂封止型半導体装置 | |
| JPS5923751U (ja) | 半導体装置 | |
| JPH05226393A (ja) | 樹脂封止型半導体装置 | |
| JPS6389263U (ja) |