JPS6429479A - Adhesive composition for electroless plating - Google Patents
Adhesive composition for electroless platingInfo
- Publication number
- JPS6429479A JPS6429479A JP18434087A JP18434087A JPS6429479A JP S6429479 A JPS6429479 A JP S6429479A JP 18434087 A JP18434087 A JP 18434087A JP 18434087 A JP18434087 A JP 18434087A JP S6429479 A JPS6429479 A JP S6429479A
- Authority
- JP
- Japan
- Prior art keywords
- fine
- heat
- cured
- powder
- resin powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1641—Organic substrates, e.g. resin, plastic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0773—Dissolving the filler without dissolving the matrix material; Dissolving the matrix material without dissolving the filler
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18434087A JPS6429479A (en) | 1987-07-23 | 1987-07-23 | Adhesive composition for electroless plating |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18434087A JPS6429479A (en) | 1987-07-23 | 1987-07-23 | Adhesive composition for electroless plating |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6429479A true JPS6429479A (en) | 1989-01-31 |
JPH0564714B2 JPH0564714B2 (ja) | 1993-09-16 |
Family
ID=16151583
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18434087A Granted JPS6429479A (en) | 1987-07-23 | 1987-07-23 | Adhesive composition for electroless plating |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6429479A (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5854325A (en) * | 1996-05-27 | 1998-12-29 | Sumitomo Bakelite Company Limited | Photosensitive adhesive composition for additive plating |
WO2002002697A1 (en) | 2000-07-03 | 2002-01-10 | Cluster Technology Co., Ltd. | Molding resin composition and method of molding |
WO2006027947A1 (ja) * | 2004-09-10 | 2006-03-16 | Nippon Mining & Metals Co., Ltd. | 無電解めっき前処理剤及びフレキシブル基板用銅張り積層体 |
JP2008127669A (ja) * | 2006-11-24 | 2008-06-05 | Fujitsu Ltd | 樹脂筐体及びその製造方法 |
JP2009241992A (ja) * | 2008-03-31 | 2009-10-22 | Nichias Corp | 断熱容器及びその製造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5929309A (ja) * | 1982-08-12 | 1984-02-16 | 日本碍子株式会社 | コロナシ−ルドリング装置 |
JPS61276875A (ja) * | 1985-06-03 | 1986-12-06 | Ibiden Co Ltd | 配線板ならびにそれの製造方法と配線板に用いる無電解めっき用接着剤 |
-
1987
- 1987-07-23 JP JP18434087A patent/JPS6429479A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5929309A (ja) * | 1982-08-12 | 1984-02-16 | 日本碍子株式会社 | コロナシ−ルドリング装置 |
JPS61276875A (ja) * | 1985-06-03 | 1986-12-06 | Ibiden Co Ltd | 配線板ならびにそれの製造方法と配線板に用いる無電解めっき用接着剤 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5854325A (en) * | 1996-05-27 | 1998-12-29 | Sumitomo Bakelite Company Limited | Photosensitive adhesive composition for additive plating |
WO2002002697A1 (en) | 2000-07-03 | 2002-01-10 | Cluster Technology Co., Ltd. | Molding resin composition and method of molding |
EP1300446A1 (en) * | 2000-07-03 | 2003-04-09 | Cluster Technology Co., Ltd | Molding resin composition and method of molding |
EP1300446A4 (en) * | 2000-07-03 | 2009-04-29 | Cluster Technology Co Ltd | MOLD RESIN COMPOSITION AND INJECTION METHOD |
WO2006027947A1 (ja) * | 2004-09-10 | 2006-03-16 | Nippon Mining & Metals Co., Ltd. | 無電解めっき前処理剤及びフレキシブル基板用銅張り積層体 |
JP2008127669A (ja) * | 2006-11-24 | 2008-06-05 | Fujitsu Ltd | 樹脂筐体及びその製造方法 |
JP2009241992A (ja) * | 2008-03-31 | 2009-10-22 | Nichias Corp | 断熱容器及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPH0564714B2 (ja) | 1993-09-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
EXPY | Cancellation because of completion of term |