JPS6428999A - Light receiving semiconductor device - Google Patents

Light receiving semiconductor device

Info

Publication number
JPS6428999A
JPS6428999A JP62185921A JP18592187A JPS6428999A JP S6428999 A JPS6428999 A JP S6428999A JP 62185921 A JP62185921 A JP 62185921A JP 18592187 A JP18592187 A JP 18592187A JP S6428999 A JPS6428999 A JP S6428999A
Authority
JP
Japan
Prior art keywords
lead
resin
photodiode
light receiving
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62185921A
Other languages
Japanese (ja)
Inventor
Atsushi Yonekura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP62185921A priority Critical patent/JPS6428999A/en
Publication of JPS6428999A publication Critical patent/JPS6428999A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Light Receiving Elements (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

PURPOSE:To eliminate charging with static electricity and to prevent an electrostatic damage by covering the surface of a light transmissible insulating resin body with conductive resin, and electrically connecting it to a ground side lead. CONSTITUTION:One electrode of a photodiode 3 is electrically connected by a gold wiring 4 to an inner lead 2. Then, the other part, the photodiode 3, and inner leads 1, 2 are sealed with light transmissible insulating resin 6 except the end of an inner lead 5, a photodetecting face 8 is formed forward of the photodiode 3, and an outer lead 9 connected to the leads 1, 2 is externally extended. Then, the surface of the resin 6 and the end of the inner lead 5 except the light receiving face 8 and the extension of the lead 9 are covered with epoxy conductive resin 7 containing 5-10% of carbon, and the resin 7 and the lead 1 are electrically connected by the end of the lead 5.
JP62185921A 1987-07-24 1987-07-24 Light receiving semiconductor device Pending JPS6428999A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62185921A JPS6428999A (en) 1987-07-24 1987-07-24 Light receiving semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62185921A JPS6428999A (en) 1987-07-24 1987-07-24 Light receiving semiconductor device

Publications (1)

Publication Number Publication Date
JPS6428999A true JPS6428999A (en) 1989-01-31

Family

ID=16179206

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62185921A Pending JPS6428999A (en) 1987-07-24 1987-07-24 Light receiving semiconductor device

Country Status (1)

Country Link
JP (1) JPS6428999A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5734354A (en) * 1980-08-08 1982-02-24 Mitsubishi Electric Corp Packaging method of electronic parts
JPS5923755B2 (en) * 1981-04-24 1984-06-04 花王株式会社 Cleaning composition for livestock barns

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5734354A (en) * 1980-08-08 1982-02-24 Mitsubishi Electric Corp Packaging method of electronic parts
JPS5923755B2 (en) * 1981-04-24 1984-06-04 花王株式会社 Cleaning composition for livestock barns

Similar Documents

Publication Publication Date Title
AU582454B2 (en) Portable ion generator
MY101527A (en) Disposable, electrically conductive body grounding strap
GB1513333A (en) Spark plug cap
EP0300632A3 (en) Plastic encapsulated integrated circuit package with electrostatic shield
EP0481094A4 (en)
JPS6428999A (en) Light receiving semiconductor device
MY107024A (en) Adjustible, conductive body strap.
JPS5721847A (en) Semiconductor device
EP0337485A3 (en) Film carrier for rf ic
BR7902152A (en) IMPROVEMENTS IN ELECTRICAL CONNECTOR, IN AN IMPLANTABLE STIMULATOR IN THE BODY AND IN THE PROCESS OF CONNECTING MECHANICAL AND ELECTRICALLY AN IMPLANTABLE SIGNAL GENERATOR IN THE BODY AND A CONDUCTOR
KR970006535B1 (en) Universal semiconductor chip package
JPS57170575A (en) Photodiode
EP0304929A3 (en) Semiconductor device having an electrode covered with a protective film
JPS6454686A (en) Spark plug with built-in pressure sensor and plug cap thereof
JPS56112767A (en) Light emitting semiconductor device
JPS5739571A (en) Constant current diode
JPS5769769A (en) Semiconductor device
JPS645079A (en) Semiconductor light emitting device
GB9121604D0 (en) Pressure-contact type semiconductor device
JPS5623768A (en) Semiconductor device
JPS6453568A (en) Semiconductor package
JPS5552259A (en) Phototrigger controlled rectifying semiconductor device
JPS6420420A (en) Infrared ray detector
JPS5743450A (en) Manufacture of hybrid integrated circuit
GB1494653A (en) Charge coupled devices