JPS5769769A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5769769A JPS5769769A JP55144923A JP14492380A JPS5769769A JP S5769769 A JPS5769769 A JP S5769769A JP 55144923 A JP55144923 A JP 55144923A JP 14492380 A JP14492380 A JP 14492380A JP S5769769 A JPS5769769 A JP S5769769A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- cover body
- conductor
- substrate
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Casings For Electric Apparatus (AREA)
- Die Bonding (AREA)
Abstract
PURPOSE:To elongate the insulating distance and to perform favorably damp resisting and thermal resisting sealing of metal package of a semiconductor device by a method wherein connecting conductors of element electrodes are led out through glass hermetic sealing bodies prepared at the top part of a cover body consisted of a metal. CONSTITUTION:The metal cover body 4 having the glass hermetic sealing bodies 21, 31 is connected to a metal substrate 1. The conductor 51 connected to the electrode of the semiconductor element 5 fixed to the substrate 1 is calked to the concave part of the central conductor 2 of the sealing body 21, and the other conductor 52 is led out outside penetrating a central conducting pipe 3 of the sealing body 31, it is calked air-tightly by the central conducting pipe 3. A pipe 6 consisting of an insulator is inserted being adhered closely to the side of the metal cover body 4, and a synthetic resin 7 is poured on the upper part of the cover body 4. The effective insulating distances between the conductors 2, 3 and the substrate 1 are elongated sharply as shown with L', 1', and the semiconductor element having high withstand voltage and high reliability can be obtained.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55144923A JPS5769769A (en) | 1980-10-16 | 1980-10-16 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55144923A JPS5769769A (en) | 1980-10-16 | 1980-10-16 | Semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5769769A true JPS5769769A (en) | 1982-04-28 |
JPS6130424B2 JPS6130424B2 (en) | 1986-07-14 |
Family
ID=15373358
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP55144923A Granted JPS5769769A (en) | 1980-10-16 | 1980-10-16 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5769769A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6263459A (en) * | 1985-09-13 | 1987-03-20 | Internatl Rectifier Corp Japan Ltd | Airtight terminal for semiconductor element |
US6037652A (en) * | 1997-05-29 | 2000-03-14 | Nec Corporation | Lead frame with each lead having a peel generation preventing means and a semiconductor device using same |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03119331U (en) * | 1990-03-14 | 1991-12-09 | ||
JPH0574434U (en) * | 1992-03-12 | 1993-10-12 | 旭化成工業株式会社 | Extraction filter |
-
1980
- 1980-10-16 JP JP55144923A patent/JPS5769769A/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6263459A (en) * | 1985-09-13 | 1987-03-20 | Internatl Rectifier Corp Japan Ltd | Airtight terminal for semiconductor element |
US6037652A (en) * | 1997-05-29 | 2000-03-14 | Nec Corporation | Lead frame with each lead having a peel generation preventing means and a semiconductor device using same |
Also Published As
Publication number | Publication date |
---|---|
JPS6130424B2 (en) | 1986-07-14 |
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