JPS6130424B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a semiconductor device in which a connection conductor to an electrode of a semiconductor element supported on a substrate of a metal container is drawn out from the top of a container lid facing a base.

Such a semiconductor device is particularly suitable for a device including a power semiconductor element whose connecting conductor has a large current flowing through it and whose cross section is large. Fig. 1 shows an example of the so-called can seal type, in which a semiconductor element is fixed (not visible) on a substrate 1 made of a good thermal conductor such as copper, and a conductor 2 is connected to the electrode of the element. and 3 are led out to the outside via glass hermetic seals 21 and 31 provided on the metal lid 4. Such a metal package, which is a container consisting of a metal substrate, a metal lid, and a glass seal, seals the semiconductor element on the bottom plate with an insulator to ensure moisture resistance and heat resistance, and the connecting conductor is drawn out from the top surface of the insulator. , more reliable than, for example, plastic packaging. However, since the glass seal bodies 21 and 31 used for this are required to match the thermal expansion coefficients between the metal outer ring, the glass, and the through conductor, the connection conductors 2 and 3 and the lid body 4 shown in FIG. Technical difficulties arise in enlarging the effective insulation distance L or l between the two. It is also difficult to surround two conductors with glass and draw them out within one metal outer ring. Therefore, in order to increase the withstand voltage of a semiconductor device, there are restrictions on increasing the insulation distance at the portion where the conductor penetrates the container.

SUMMARY OF THE INVENTION An object of the present invention is to eliminate such limitations and provide a semiconductor device which is sealed with a long insulation distance and has good moisture resistance and heat resistance of a metal package.

The purpose of this is to hermetically connect the substrate that supports the semiconductor element and the lid mainly made of metal, and connect conductors to the electrodes of the element through a glass hermetic seal provided on the top of the lid facing the base. By fitting an insulating tube that is pulled out of the container, surrounding the sides of the lid and protruding higher than the top of the lid, and forming an insulating layer in the recess formed by the tube and the lid. achieved.

Embodiments of the present invention will be described below with reference to the drawings. 2 and 3 show one embodiment, in which a metal cover 4 having conventionally used glass hermetic seals 21 and 31 is coupled to a metal substrate 1. Semiconductor element 5 fixed to substrate 1
The conductor 51 connected to the electrode is caulked into the recess of the center conductor 2 of the seal body 21, and the other conductor 52 is passed through the center conduit 3 of the seal body 31 and pulled out to the outside, and then inserted into the center conduit 3. It is sealed and caulked airtight. An insulating tube 6 made of synthetic resin or ceramics is fitted in close contact with the side surface of the metal lid 4. In this case, the dimensions of the tube 6 are determined so that the upper end of the tube 6 is located at a higher position than the upper ends of the metal outer rings of the glass seal bodies 21, 31 of the lid body 4. Lid body 4 and seal bodies 21 and 3 surrounded by this insulator tube 6
Synthetic resin is injected into the space above 1 to form an insulating layer 7.
form. As a result, the effective insulation distance between the conductors 2 and 3 and the substrate 1 is 300 mm from L and l shown in FIG.
It increases significantly to L′ and l′ shown in the figure.

4 and 5 show different embodiments, and the same parts as in FIGS. 2 and 3 are given the same reference numerals. The example shown in FIG. 4 uses a metal tube 61 instead of the insulator tube 6 in FIGS. 2 and 3, and injects an insulator layer 7, and can be applied when the requirement for insulation distance is small. Great for reinforcing the container.
In the example shown in FIG. 5, the lid 4 is covered with an elastic insulating cap 8 such as silicone rubber, and the number of manufacturing steps is further reduced compared to the above two examples.

As described above, the present invention improves the insulation performance of the lead conductor of a conventional metal package semiconductor device container equipped with a glass hermetic seal by adding an insulating layer covering the glass portion of the container lid and seal. It is possible to use easily available container parts as is, the installation dimensions of the device are the same as conventional containers, and the external dimensions do not change significantly and can be kept within standard dimensions. Therefore, it is possible to manufacture semiconductor devices with high voltage resistance, high reliability, and ease of use at a low cost.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of an example of a conventional metal package semiconductor device, FIG. 2 is a sectional view of an embodiment of a semiconductor device according to the present invention, FIG. 3 is a perspective view thereof, and FIG.
5 are sectional views of different embodiments. DESCRIPTION OF SYMBOLS 1... Substrate, 21, 31... Glass hermetic seal body, 4... Lid body, 6, 7, 8... Insulator layer.

Claims (1)

[Claims] 1 A metal substrate and a cap-shaped lid are hermetically coupled to form a container, a semiconductor element is bonded with one main surface facing down on the substrate in the container, and a semiconductor element is bonded with one main surface facing down, and the other main surface of the element is bonded to the substrate. In cases where the external connection conductor connected to the electrode passes through a glass hermetic seal provided on the top of the lid facing the metal substrate and is drawn out of the container, the 1. A semiconductor device comprising: an insulating tube protruding higher than an upper end thereof; and an insulating layer provided in a recess formed by the tube and a lid.