JPS6428921A - Plasma treatment device - Google Patents
Plasma treatment deviceInfo
- Publication number
- JPS6428921A JPS6428921A JP18483687A JP18483687A JPS6428921A JP S6428921 A JPS6428921 A JP S6428921A JP 18483687 A JP18483687 A JP 18483687A JP 18483687 A JP18483687 A JP 18483687A JP S6428921 A JPS6428921 A JP S6428921A
- Authority
- JP
- Japan
- Prior art keywords
- permanent magnet
- stop
- arbitrary position
- uniformly
- detect
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Physical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18483687A JPS6428921A (en) | 1987-07-24 | 1987-07-24 | Plasma treatment device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18483687A JPS6428921A (en) | 1987-07-24 | 1987-07-24 | Plasma treatment device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6428921A true JPS6428921A (en) | 1989-01-31 |
Family
ID=16160160
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18483687A Pending JPS6428921A (en) | 1987-07-24 | 1987-07-24 | Plasma treatment device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6428921A (ja) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5482610A (en) * | 1991-11-14 | 1996-01-09 | Leybold Aktiengesellschaft | Cathode for coating a substrate |
US6183614B1 (en) * | 1999-02-12 | 2001-02-06 | Applied Materials, Inc. | Rotating sputter magnetron assembly |
US6290825B1 (en) | 1999-02-12 | 2001-09-18 | Applied Materials, Inc. | High-density plasma source for ionized metal deposition |
WO2001081100A1 (fr) | 2000-04-25 | 2001-11-01 | Pentel Kabushiki Kaisha | Dispositif d'enduction |
US6497802B2 (en) | 1999-02-12 | 2002-12-24 | Applied Materials, Inc. | Self ionized plasma sputtering |
US6692617B1 (en) * | 1997-05-08 | 2004-02-17 | Applied Materials, Inc. | Sustained self-sputtering reactor having an increased density plasma |
US6790323B2 (en) | 1999-02-12 | 2004-09-14 | Applied Materials, Inc. | Self ionized sputtering using a high density plasma source |
US9051641B2 (en) | 2001-07-25 | 2015-06-09 | Applied Materials, Inc. | Cobalt deposition on barrier surfaces |
CN111733394A (zh) * | 2020-08-10 | 2020-10-02 | 光驰科技(上海)有限公司 | 一种可适时调节磁场角度的孪生旋转溅射阴极装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56156763A (en) * | 1980-05-02 | 1981-12-03 | Tohoku Metal Ind Ltd | Finely working method and apparatus by plasma sputtering |
JPS6091641A (ja) * | 1983-10-25 | 1985-05-23 | Toshiba Corp | 反応性イオンエツチング装置 |
JPS6272121A (ja) * | 1985-09-26 | 1987-04-02 | Tokuda Seisakusho Ltd | 半導体処理装置 |
JPS6321833A (ja) * | 1986-07-16 | 1988-01-29 | Toshiba Corp | ドライエツチング装置 |
-
1987
- 1987-07-24 JP JP18483687A patent/JPS6428921A/ja active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56156763A (en) * | 1980-05-02 | 1981-12-03 | Tohoku Metal Ind Ltd | Finely working method and apparatus by plasma sputtering |
JPS6091641A (ja) * | 1983-10-25 | 1985-05-23 | Toshiba Corp | 反応性イオンエツチング装置 |
JPS6272121A (ja) * | 1985-09-26 | 1987-04-02 | Tokuda Seisakusho Ltd | 半導体処理装置 |
JPS6321833A (ja) * | 1986-07-16 | 1988-01-29 | Toshiba Corp | ドライエツチング装置 |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5482610A (en) * | 1991-11-14 | 1996-01-09 | Leybold Aktiengesellschaft | Cathode for coating a substrate |
US6692617B1 (en) * | 1997-05-08 | 2004-02-17 | Applied Materials, Inc. | Sustained self-sputtering reactor having an increased density plasma |
US6960284B2 (en) | 1997-05-08 | 2005-11-01 | Applied Materials, Inc. | Rotational and reciprocal radial movement of a sputtering magnetron |
US6183614B1 (en) * | 1999-02-12 | 2001-02-06 | Applied Materials, Inc. | Rotating sputter magnetron assembly |
US6290825B1 (en) | 1999-02-12 | 2001-09-18 | Applied Materials, Inc. | High-density plasma source for ionized metal deposition |
US6497802B2 (en) | 1999-02-12 | 2002-12-24 | Applied Materials, Inc. | Self ionized plasma sputtering |
US6790323B2 (en) | 1999-02-12 | 2004-09-14 | Applied Materials, Inc. | Self ionized sputtering using a high density plasma source |
WO2001081100A1 (fr) | 2000-04-25 | 2001-11-01 | Pentel Kabushiki Kaisha | Dispositif d'enduction |
US9051641B2 (en) | 2001-07-25 | 2015-06-09 | Applied Materials, Inc. | Cobalt deposition on barrier surfaces |
CN111733394A (zh) * | 2020-08-10 | 2020-10-02 | 光驰科技(上海)有限公司 | 一种可适时调节磁场角度的孪生旋转溅射阴极装置 |
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