JPS6425547A - Manufacture of semiconductor light emitting device - Google Patents

Manufacture of semiconductor light emitting device

Info

Publication number
JPS6425547A
JPS6425547A JP18117287A JP18117287A JPS6425547A JP S6425547 A JPS6425547 A JP S6425547A JP 18117287 A JP18117287 A JP 18117287A JP 18117287 A JP18117287 A JP 18117287A JP S6425547 A JPS6425547 A JP S6425547A
Authority
JP
Japan
Prior art keywords
epoxy resin
light emitting
emitting element
resin
same time
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18117287A
Other languages
Japanese (ja)
Inventor
Shizuo Tsuru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP18117287A priority Critical patent/JPS6425547A/en
Publication of JPS6425547A publication Critical patent/JPS6425547A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

PURPOSE:To impart flexibility to the surrounding part of a light emitting element and to improve heat resistance and moisture resistance at the outside of an outer resin, by adding a plasticizer into a first epoxy resin, whose base material is the same base resin, covering the outer part of the light emitting element, thereafter packaging the entire inner leads with a second epoxy resin, and heating and hardening the resins at the same time. CONSTITUTION:Inner lead terminals 1, outer lead terminals 2 and a semiconductor-light-emitting-element mounting part 3 are provided in a conductor lead 4. A semiconductor light emitting element 5 is mounted on the conductor lead 4 and electrically connected with a thin metal wire 6. The outer part of the light emitting element 5 is covered with a first epoxy resin 7. Then, the conductor lead 4 is fixed in a a casting metal mold 10, which is filled with a second epoxy resin for packaging. At the same time, the inner lead terminals 1 and the light emitting element 5, which is covered with the epoxy resin 7, are inserted into the epoxy resin 8. Then, the epoxy resins 7 and 8 are hardened at the same time. The epoxy resin 7 and the epoxy resin 8 are formed with the same base resin as a base material. Plasticizer or flexibility imparting agent is added to the epoxy resin 7.
JP18117287A 1987-07-22 1987-07-22 Manufacture of semiconductor light emitting device Pending JPS6425547A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18117287A JPS6425547A (en) 1987-07-22 1987-07-22 Manufacture of semiconductor light emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18117287A JPS6425547A (en) 1987-07-22 1987-07-22 Manufacture of semiconductor light emitting device

Publications (1)

Publication Number Publication Date
JPS6425547A true JPS6425547A (en) 1989-01-27

Family

ID=16096143

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18117287A Pending JPS6425547A (en) 1987-07-22 1987-07-22 Manufacture of semiconductor light emitting device

Country Status (1)

Country Link
JP (1) JPS6425547A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010108939A (en) * 2000-06-01 2001-12-08 유무친 Light emitting diode and manufacturing process thereof with blank
US7735306B2 (en) 2005-09-29 2010-06-15 Kubota Corporation Rear discharge type mower apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010108939A (en) * 2000-06-01 2001-12-08 유무친 Light emitting diode and manufacturing process thereof with blank
US7735306B2 (en) 2005-09-29 2010-06-15 Kubota Corporation Rear discharge type mower apparatus

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