JPS6425446A - Mounting structure of semiconductor device on heat sink - Google Patents

Mounting structure of semiconductor device on heat sink

Info

Publication number
JPS6425446A
JPS6425446A JP18190787A JP18190787A JPS6425446A JP S6425446 A JPS6425446 A JP S6425446A JP 18190787 A JP18190787 A JP 18190787A JP 18190787 A JP18190787 A JP 18190787A JP S6425446 A JPS6425446 A JP S6425446A
Authority
JP
Japan
Prior art keywords
package
heat sink
semiconductor device
mounting structure
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18190787A
Other languages
Japanese (ja)
Inventor
Tomoharu Yamauchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP18190787A priority Critical patent/JPS6425446A/en
Publication of JPS6425446A publication Critical patent/JPS6425446A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To prevent a package from cracking and leads from damaging by mounting a semiconductor device on a heat sink by utilizing the pressure of a spring. CONSTITUTION:The leads 3 of a semiconductor device are mounted on a printed substrate 1, and a clamping pin 5 is inserted via a spring 6 into the pin insertion holes of a package 4 and a heat sink 2, and a disc-like clamping pin 7 is engaged with the and of the pin 5. Thus, the package 4 of the device is clamped by the pressure of the spring 6 to the plate 2. In this manner, an excess stress is not applied to the package 4 to prevent the package 4 from cracking and the leads 3 from damaging, and to facilitate a mounting work.
JP18190787A 1987-07-21 1987-07-21 Mounting structure of semiconductor device on heat sink Pending JPS6425446A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18190787A JPS6425446A (en) 1987-07-21 1987-07-21 Mounting structure of semiconductor device on heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18190787A JPS6425446A (en) 1987-07-21 1987-07-21 Mounting structure of semiconductor device on heat sink

Publications (1)

Publication Number Publication Date
JPS6425446A true JPS6425446A (en) 1989-01-27

Family

ID=16108977

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18190787A Pending JPS6425446A (en) 1987-07-21 1987-07-21 Mounting structure of semiconductor device on heat sink

Country Status (1)

Country Link
JP (1) JPS6425446A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05270337A (en) * 1992-02-10 1993-10-19 Trw Inc Air bag and its production
US5302432A (en) * 1990-08-16 1994-04-12 Asahi Kasei Kogyo Kabushiki Kaisha Air bag

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5302432A (en) * 1990-08-16 1994-04-12 Asahi Kasei Kogyo Kabushiki Kaisha Air bag
JPH05270337A (en) * 1992-02-10 1993-10-19 Trw Inc Air bag and its production

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