JPS6425446A - Mounting structure of semiconductor device on heat sink - Google Patents
Mounting structure of semiconductor device on heat sinkInfo
- Publication number
- JPS6425446A JPS6425446A JP18190787A JP18190787A JPS6425446A JP S6425446 A JPS6425446 A JP S6425446A JP 18190787 A JP18190787 A JP 18190787A JP 18190787 A JP18190787 A JP 18190787A JP S6425446 A JPS6425446 A JP S6425446A
- Authority
- JP
- Japan
- Prior art keywords
- package
- heat sink
- semiconductor device
- mounting structure
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE:To prevent a package from cracking and leads from damaging by mounting a semiconductor device on a heat sink by utilizing the pressure of a spring. CONSTITUTION:The leads 3 of a semiconductor device are mounted on a printed substrate 1, and a clamping pin 5 is inserted via a spring 6 into the pin insertion holes of a package 4 and a heat sink 2, and a disc-like clamping pin 7 is engaged with the and of the pin 5. Thus, the package 4 of the device is clamped by the pressure of the spring 6 to the plate 2. In this manner, an excess stress is not applied to the package 4 to prevent the package 4 from cracking and the leads 3 from damaging, and to facilitate a mounting work.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18190787A JPS6425446A (en) | 1987-07-21 | 1987-07-21 | Mounting structure of semiconductor device on heat sink |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18190787A JPS6425446A (en) | 1987-07-21 | 1987-07-21 | Mounting structure of semiconductor device on heat sink |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6425446A true JPS6425446A (en) | 1989-01-27 |
Family
ID=16108977
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18190787A Pending JPS6425446A (en) | 1987-07-21 | 1987-07-21 | Mounting structure of semiconductor device on heat sink |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6425446A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05270337A (en) * | 1992-02-10 | 1993-10-19 | Trw Inc | Air bag and its production |
US5302432A (en) * | 1990-08-16 | 1994-04-12 | Asahi Kasei Kogyo Kabushiki Kaisha | Air bag |
-
1987
- 1987-07-21 JP JP18190787A patent/JPS6425446A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5302432A (en) * | 1990-08-16 | 1994-04-12 | Asahi Kasei Kogyo Kabushiki Kaisha | Air bag |
JPH05270337A (en) * | 1992-02-10 | 1993-10-19 | Trw Inc | Air bag and its production |
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