JPS5526684A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5526684A JPS5526684A JP10028278A JP10028278A JPS5526684A JP S5526684 A JPS5526684 A JP S5526684A JP 10028278 A JP10028278 A JP 10028278A JP 10028278 A JP10028278 A JP 10028278A JP S5526684 A JPS5526684 A JP S5526684A
- Authority
- JP
- Japan
- Prior art keywords
- plate
- conductor
- semiconductor elements
- conductor plate
- bolt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Die Bonding (AREA)
Abstract
PURPOSE: To reduce the number of parts by clamping semiconductor elements or conduction plate with a bolt after placing a single conductor plate through another conductor having a normal compression property and a low contact resistance and specific resistance upon a plurality of plan type semiconductor elements provided on a single condcutor plate.
CONSTITUTION: A plurality of plan type semiconductor elements 10 and 11 are arranged on one face of a single L-shaped conductor plate 9, and a buffer member 12 comprising a conductor having a high compressibility and a low contact resistance and specific resistance is mounted thereon. Subsequently, a single conductor plate 13 having the same shape as the conduction plate 9 is covered thereon and the conductor plate 9 and 13 are clamped by utilizing a press spring 14, clamping member 15 and bolt 16 to form a semiconductor device for large power. In such a device, the fixing of the device can be certainly achieved, and a degree of freedom of a design be increased by reducing a number of the parts.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10028278A JPS5526684A (en) | 1978-08-16 | 1978-08-16 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10028278A JPS5526684A (en) | 1978-08-16 | 1978-08-16 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5526684A true JPS5526684A (en) | 1980-02-26 |
Family
ID=14269830
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10028278A Pending JPS5526684A (en) | 1978-08-16 | 1978-08-16 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5526684A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5592021A (en) * | 1995-04-26 | 1997-01-07 | Martin Marietta Corporation | Clamp for securing a power device to a heatsink |
US6942556B2 (en) | 2002-06-07 | 2005-09-13 | Koyo Seiko Co., Ltd. | Polishing jig for bearing for use in back-up roll of rolling mill |
-
1978
- 1978-08-16 JP JP10028278A patent/JPS5526684A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5592021A (en) * | 1995-04-26 | 1997-01-07 | Martin Marietta Corporation | Clamp for securing a power device to a heatsink |
US6942556B2 (en) | 2002-06-07 | 2005-09-13 | Koyo Seiko Co., Ltd. | Polishing jig for bearing for use in back-up roll of rolling mill |
US7001258B2 (en) | 2002-06-07 | 2006-02-21 | Koyo Seiko Co., Ltd. | Polishing jig for rolling mill backup roll bearing |
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