JPS5526684A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5526684A
JPS5526684A JP10028278A JP10028278A JPS5526684A JP S5526684 A JPS5526684 A JP S5526684A JP 10028278 A JP10028278 A JP 10028278A JP 10028278 A JP10028278 A JP 10028278A JP S5526684 A JPS5526684 A JP S5526684A
Authority
JP
Japan
Prior art keywords
plate
conductor
semiconductor elements
conductor plate
bolt
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10028278A
Other languages
Japanese (ja)
Inventor
Kazuo Tokuda
Yasuhiro Kamitamari
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP10028278A priority Critical patent/JPS5526684A/en
Publication of JPS5526684A publication Critical patent/JPS5526684A/en
Pending legal-status Critical Current

Links

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  • Die Bonding (AREA)

Abstract

PURPOSE: To reduce the number of parts by clamping semiconductor elements or conduction plate with a bolt after placing a single conductor plate through another conductor having a normal compression property and a low contact resistance and specific resistance upon a plurality of plan type semiconductor elements provided on a single condcutor plate.
CONSTITUTION: A plurality of plan type semiconductor elements 10 and 11 are arranged on one face of a single L-shaped conductor plate 9, and a buffer member 12 comprising a conductor having a high compressibility and a low contact resistance and specific resistance is mounted thereon. Subsequently, a single conductor plate 13 having the same shape as the conduction plate 9 is covered thereon and the conductor plate 9 and 13 are clamped by utilizing a press spring 14, clamping member 15 and bolt 16 to form a semiconductor device for large power. In such a device, the fixing of the device can be certainly achieved, and a degree of freedom of a design be increased by reducing a number of the parts.
COPYRIGHT: (C)1980,JPO&Japio
JP10028278A 1978-08-16 1978-08-16 Semiconductor device Pending JPS5526684A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10028278A JPS5526684A (en) 1978-08-16 1978-08-16 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10028278A JPS5526684A (en) 1978-08-16 1978-08-16 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5526684A true JPS5526684A (en) 1980-02-26

Family

ID=14269830

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10028278A Pending JPS5526684A (en) 1978-08-16 1978-08-16 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5526684A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5592021A (en) * 1995-04-26 1997-01-07 Martin Marietta Corporation Clamp for securing a power device to a heatsink
US6942556B2 (en) 2002-06-07 2005-09-13 Koyo Seiko Co., Ltd. Polishing jig for bearing for use in back-up roll of rolling mill

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5592021A (en) * 1995-04-26 1997-01-07 Martin Marietta Corporation Clamp for securing a power device to a heatsink
US6942556B2 (en) 2002-06-07 2005-09-13 Koyo Seiko Co., Ltd. Polishing jig for bearing for use in back-up roll of rolling mill
US7001258B2 (en) 2002-06-07 2006-02-21 Koyo Seiko Co., Ltd. Polishing jig for rolling mill backup roll bearing

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