JPS642440Y2 - - Google Patents
Info
- Publication number
- JPS642440Y2 JPS642440Y2 JP1981160265U JP16026581U JPS642440Y2 JP S642440 Y2 JPS642440 Y2 JP S642440Y2 JP 1981160265 U JP1981160265 U JP 1981160265U JP 16026581 U JP16026581 U JP 16026581U JP S642440 Y2 JPS642440 Y2 JP S642440Y2
- Authority
- JP
- Japan
- Prior art keywords
- connector
- semiconductor device
- external lead
- utility
- model registration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
- 
        - H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
 
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| JP1981160265U JPS5866640U (ja) | 1981-10-29 | 1981-10-29 | 半導体装置 | 
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| JP1981160265U JPS5866640U (ja) | 1981-10-29 | 1981-10-29 | 半導体装置 | 
Publications (2)
| Publication Number | Publication Date | 
|---|---|
| JPS5866640U JPS5866640U (ja) | 1983-05-06 | 
| JPS642440Y2 true JPS642440Y2 (en:Method) | 1989-01-20 | 
Family
ID=29952680
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date | 
|---|---|---|---|
| JP1981160265U Granted JPS5866640U (ja) | 1981-10-29 | 1981-10-29 | 半導体装置 | 
Country Status (1)
| Country | Link | 
|---|---|
| JP (1) | JPS5866640U (en:Method) | 
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| JPH0734457B2 (ja) * | 1988-04-05 | 1995-04-12 | 株式会社東芝 | 半導体装置 | 
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| JPS5384556A (en) * | 1976-12-29 | 1978-07-26 | Fujitsu Ltd | Semiconductor device | 
- 
        1981
        - 1981-10-29 JP JP1981160265U patent/JPS5866640U/ja active Granted
 
Also Published As
| Publication number | Publication date | 
|---|---|
| JPS5866640U (ja) | 1983-05-06 | 
Similar Documents
| Publication | Publication Date | Title | 
|---|---|---|
| US6541856B2 (en) | Thermally enhanced high density semiconductor package | |
| JPS642440Y2 (en:Method) | ||
| JPS63296252A (ja) | 樹脂封止型半導体装置 | |
| JPH06291230A (ja) | 複合半導体装置の製造方法 | |
| JPH023621Y2 (en:Method) | ||
| JPH0324271U (en:Method) | ||
| JPH0423330Y2 (en:Method) | ||
| JP2536568B2 (ja) | リ―ドフレ―ム | |
| JPS6018846Y2 (ja) | 半導体装置 | |
| JPH01120856A (ja) | リードフレーム | |
| JPS6228780Y2 (en:Method) | ||
| JPS6233346Y2 (en:Method) | ||
| JPH021862Y2 (en:Method) | ||
| JPH056666Y2 (en:Method) | ||
| JPS6050347B2 (ja) | シングルインライン半導体装置用リ−ドフレ−ム | |
| JPS62117355A (ja) | 集積回路の製造方法 | |
| JPH0714657U (ja) | 半導体装置 | |
| JPH0799276A (ja) | 半導体装置 | |
| JPH0268452U (en:Method) | ||
| JPS6177332A (ja) | 半導体装置 | |
| JPH03122543U (en:Method) | ||
| JPS5889953U (ja) | 混成回路 | |
| JPS62166640U (en:Method) | ||
| JPH0613157U (ja) | 半導体装置 | |
| JPS61150255A (ja) | 半導体装置とその製造方法 |