JPS6422025A - Semiconductor manufacturing equipment - Google Patents

Abstract

PURPOSE:To prevent the damage of the end section of a reaction pipe completely when the reaction pipe is exchanged, and to ensure constant sealing properties at all times by making the diameter of an opened end section in the reaction pipe smaller than that of a central section by contraction in a semiconductor production device into which the reaction pipe, one end of which is opened, is inserted. CONSTITUTION:Wafers 4 are charged into a reaction pipe 3, and a cover 5 is closed and the reaction pipe 3 is sealed, thus preventing the intrusion of atmospheric air from a wafer charging port. The wafers 4 are kept at a fixed temperature by controlling the calorific value of a heater section 1, a reaction gas required is introduced from a reaction-gas introducing section 6, and treatment such as oxidizing diffusion is executed. The cover 5 is opened again, and the completely treated wafers 4 are extracted from the reaction pipe 3. The sealing properties of the reaction pipe 3 are ensured by the cover 5 through the treatment, and the diameter of the opening end of the reaction pipe 3 is reduced by contraction. Even when the rear section of the reaction pipe 3 is lifted under the state in which the reaction pipe 3 is drawn to the rear of a device, a contact with a soaking pipe 2 is stopped in a contact on a contracted surface, and the opening end of the reaction pipe 3 is protected so as not to be brought into contact with the soaking pipe 2.