JPS56158420A - Vapor growth device - Google Patents
Vapor growth deviceInfo
- Publication number
- JPS56158420A JPS56158420A JP6428580A JP6428580A JPS56158420A JP S56158420 A JPS56158420 A JP S56158420A JP 6428580 A JP6428580 A JP 6428580A JP 6428580 A JP6428580 A JP 6428580A JP S56158420 A JPS56158420 A JP S56158420A
- Authority
- JP
- Japan
- Prior art keywords
- pipe
- vapor growth
- reaction
- heaters
- valve
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45561—Gas plumbing upstream of the reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02381—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
Abstract
PURPOSE:To perform stable vapor growth by providing a heating device at the external circumference of a gas supply pipe wherein the growth of harmful substances at a piping system is prevented. CONSTITUTION:A pipe 4 is exhausted 9 by closing valves 3a-3c and by opening a valve 14. With the valves operated, reaction gas is sent from bombs 5, 6 to a reaction pipe 1 kept at high temperature and decompressed by heaters 2 and a pump 9 after closing the valve 14 and Si3N4 is formed on an Si substrate. All processes are done by heating the pipe 4 by heaters 12. Accordingly, residual moisture during the suspension of operation is removed at the initial exhaustion and harmful substances such as Si(OH)4 or the like will not be generated. Furthermore, the pipe is heated at 150-200 deg.C to prevent the invasion of moisture in the pipe and the gas sent to the reaction pipe 1 is also previously heated to mitigate the temperature slope and stable vapor growth can be performed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6428580A JPS56158420A (en) | 1980-05-12 | 1980-05-12 | Vapor growth device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6428580A JPS56158420A (en) | 1980-05-12 | 1980-05-12 | Vapor growth device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56158420A true JPS56158420A (en) | 1981-12-07 |
Family
ID=13253803
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6428580A Pending JPS56158420A (en) | 1980-05-12 | 1980-05-12 | Vapor growth device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56158420A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60176544U (en) * | 1984-04-28 | 1985-11-22 | 沖電気工業株式会社 | Thin film forming equipment |
JPS6222420A (en) * | 1985-07-23 | 1987-01-30 | Canon Inc | Formation device for deposited film |
JPH0232533A (en) * | 1988-07-22 | 1990-02-02 | Nec Corp | Gaseous phase growth device |
CN102776559A (en) * | 2011-05-13 | 2012-11-14 | 特力生有限公司 | Method for conveying ammonia gas |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5228258A (en) * | 1975-08-28 | 1977-03-03 | Nec Corp | Method for growth of crystals from liquid phase |
-
1980
- 1980-05-12 JP JP6428580A patent/JPS56158420A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5228258A (en) * | 1975-08-28 | 1977-03-03 | Nec Corp | Method for growth of crystals from liquid phase |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60176544U (en) * | 1984-04-28 | 1985-11-22 | 沖電気工業株式会社 | Thin film forming equipment |
JPS6222420A (en) * | 1985-07-23 | 1987-01-30 | Canon Inc | Formation device for deposited film |
JPH0232533A (en) * | 1988-07-22 | 1990-02-02 | Nec Corp | Gaseous phase growth device |
CN102776559A (en) * | 2011-05-13 | 2012-11-14 | 特力生有限公司 | Method for conveying ammonia gas |
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