JPS6414946A - Method and apparatus for forming lead of semiconductor device - Google Patents
Method and apparatus for forming lead of semiconductor deviceInfo
- Publication number
- JPS6414946A JPS6414946A JP16989287A JP16989287A JPS6414946A JP S6414946 A JPS6414946 A JP S6414946A JP 16989287 A JP16989287 A JP 16989287A JP 16989287 A JP16989287 A JP 16989287A JP S6414946 A JPS6414946 A JP S6414946A
- Authority
- JP
- Japan
- Prior art keywords
- punch
- holder
- bending
- die set
- gap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE:To improve the yield rate of formed products, in molding and bending the leads of a semiconductor device, by buffering and restricting compressing force, and positioning a part between the die set of a punch and a holder with the step of a stopper stud. CONSTITUTION:An upper holder 12 is tightened with a stopper stud 13 and a fixing bolt 14 at the lower side of a punch die set 11. A gap, which is formed with a spring 15, is formed between the punch die set 11 and the upper holder 12. A ring 16 is arranged around the gap so that a load is alleviated at the time of press and the gap is equalized. A step 13a, which is made to agree with the upper surface of the punch holder 12, is provided at the stopper stud 13. The tightening of the punch die set 11 and the punch holder 12 is stopped end tightened again at a specified position. 4 bending punch 107 is attached to the lower end of the punch holder 12. The bases of leads are supported on a pad 111 at the lower surface of projection 107a at the lower side. The lead is molded with the side surface of the projection 107a, the lower surface of the bending punch, the side surface of a bending die 112 and the upper surface of the bending die.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16989287A JPS6414946A (en) | 1987-07-09 | 1987-07-09 | Method and apparatus for forming lead of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16989287A JPS6414946A (en) | 1987-07-09 | 1987-07-09 | Method and apparatus for forming lead of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6414946A true JPS6414946A (en) | 1989-01-19 |
Family
ID=15894895
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16989287A Pending JPS6414946A (en) | 1987-07-09 | 1987-07-09 | Method and apparatus for forming lead of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6414946A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100390451B1 (en) * | 1999-12-01 | 2003-07-04 | 앰코 테크놀로지 코리아 주식회사 | prevention structure for crack of substrate for manucture of semiconductor package in moulder |
-
1987
- 1987-07-09 JP JP16989287A patent/JPS6414946A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100390451B1 (en) * | 1999-12-01 | 2003-07-04 | 앰코 테크놀로지 코리아 주식회사 | prevention structure for crack of substrate for manucture of semiconductor package in moulder |
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