JPS6457741A - Direct bonding ic lead frame - Google Patents

Direct bonding ic lead frame

Info

Publication number
JPS6457741A
JPS6457741A JP21588987A JP21588987A JPS6457741A JP S6457741 A JPS6457741 A JP S6457741A JP 21588987 A JP21588987 A JP 21588987A JP 21588987 A JP21588987 A JP 21588987A JP S6457741 A JPS6457741 A JP S6457741A
Authority
JP
Japan
Prior art keywords
lead frame
bonding
coining
face
roughness rmax
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21588987A
Other languages
Japanese (ja)
Inventor
Hiroyuki Nakayama
Hidehito Okamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kobe Steel Ltd
Original Assignee
Kobe Steel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobe Steel Ltd filed Critical Kobe Steel Ltd
Priority to JP21588987A priority Critical patent/JPS6457741A/en
Publication of JPS6457741A publication Critical patent/JPS6457741A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Insulated Conductors (AREA)

Abstract

PURPOSE:To obviate the need for plating wire bonding sections of a lead frame with a precious metal and to lower the manufacturing cost while ensuring safety of the manufacturing process of the lead frame, by finishing the surface of the wire bonding sections to roughness Rmax of 0.2mum or below. CONSTITUTION:In order to provide an inner lead 21 with a bonding face having roughness Rmax of 0.2mum, the surface of an inner lead coining punch is finished to a specular face with Rmax of 0.2mum so that the surface is transferred to the lead frame. A coining punch 33 is arranged at the center of an upper mold 41 of a coining apparatus such that the specular face thereof is applied against a lead frame material 42 which is arranged on a lower mold 43. Using this coining apparatus, the upper mold 41 is pressed down by a press so that the lead frame material 42 is crashed and the bonding section is coined into a specular face. The lead frame thus produced has a bonding surface with roughness Rmax of 0.2mum, as well as desirable bonding strength and exhibits stable performance.
JP21588987A 1987-08-28 1987-08-28 Direct bonding ic lead frame Pending JPS6457741A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21588987A JPS6457741A (en) 1987-08-28 1987-08-28 Direct bonding ic lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21588987A JPS6457741A (en) 1987-08-28 1987-08-28 Direct bonding ic lead frame

Publications (1)

Publication Number Publication Date
JPS6457741A true JPS6457741A (en) 1989-03-06

Family

ID=16679938

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21588987A Pending JPS6457741A (en) 1987-08-28 1987-08-28 Direct bonding ic lead frame

Country Status (1)

Country Link
JP (1) JPS6457741A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100346625B1 (en) * 1995-02-24 2002-11-30 삼성테크윈 주식회사 Automatic winding device for camera with built-in film
US7176580B1 (en) * 2003-10-24 2007-02-13 Joseph Fjelstad Structures and methods for wire bonding over active, brittle and low K dielectric areas of an IC chip
JP2007258205A (en) * 2006-03-20 2007-10-04 Denso Corp Electronic device and its manufacturing method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100346625B1 (en) * 1995-02-24 2002-11-30 삼성테크윈 주식회사 Automatic winding device for camera with built-in film
US7176580B1 (en) * 2003-10-24 2007-02-13 Joseph Fjelstad Structures and methods for wire bonding over active, brittle and low K dielectric areas of an IC chip
JP2007258205A (en) * 2006-03-20 2007-10-04 Denso Corp Electronic device and its manufacturing method

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