JPS6431428A - Resin sealing apparatus for semiconductor device - Google Patents

Resin sealing apparatus for semiconductor device

Info

Publication number
JPS6431428A
JPS6431428A JP18732087A JP18732087A JPS6431428A JP S6431428 A JPS6431428 A JP S6431428A JP 18732087 A JP18732087 A JP 18732087A JP 18732087 A JP18732087 A JP 18732087A JP S6431428 A JPS6431428 A JP S6431428A
Authority
JP
Japan
Prior art keywords
block
chase
grooves
pressurizing direction
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18732087A
Other languages
Japanese (ja)
Inventor
Hideaki Suezaki
Hiromichi Yamada
Suekichi Tanaka
Yutaka Morita
Koji Tsutsumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP18732087A priority Critical patent/JPS6431428A/en
Publication of JPS6431428A publication Critical patent/JPS6431428A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/1742—Mounting of moulds; Mould supports
    • B29C45/1744—Mould support platens
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/2602—Mould construction elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To prevent a resin burr from generating at a lead frame on a chase block by forming a plurality of slit grooves having specific structure opening in a direction perpendicular to the pressurizing direction to the spacer block. CONSTITUTION:A plurality of slit grooves 24 opening in a direction perpendicular to a pressurizing direction are formed on a spacer block 23, two adjacent grooves 24 of the grooves 24 are positioned on the inner and outer peripheral surfaces of the block 23, and the depth size is set to the size elastically deformable in a pressurizing direction of the block 23. Accordingly, the block 23 is elastically compressed or deformed in a pressurizing direction together with a supporting pin 9 to prevent upper and lower chase blocks 21 from deforming. Therefore, the parting faces 21a of both the chase blocks 21 can be contacted each other at the time of clamping, pressing forces are uniformly acted, thereby effectively preventing a resin burr from generating at the lead frame on the chase block.
JP18732087A 1987-07-27 1987-07-27 Resin sealing apparatus for semiconductor device Pending JPS6431428A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18732087A JPS6431428A (en) 1987-07-27 1987-07-27 Resin sealing apparatus for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18732087A JPS6431428A (en) 1987-07-27 1987-07-27 Resin sealing apparatus for semiconductor device

Publications (1)

Publication Number Publication Date
JPS6431428A true JPS6431428A (en) 1989-02-01

Family

ID=16203944

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18732087A Pending JPS6431428A (en) 1987-07-27 1987-07-27 Resin sealing apparatus for semiconductor device

Country Status (1)

Country Link
JP (1) JPS6431428A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004007168A1 (en) * 2002-07-12 2004-01-22 F.T. Engineering B.V. Aligning means for an injection-molding device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004007168A1 (en) * 2002-07-12 2004-01-22 F.T. Engineering B.V. Aligning means for an injection-molding device

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