JPS6431426A - Resin sealing apparatus for semiconductor device - Google Patents
Resin sealing apparatus for semiconductor deviceInfo
- Publication number
- JPS6431426A JPS6431426A JP18731887A JP18731887A JPS6431426A JP S6431426 A JPS6431426 A JP S6431426A JP 18731887 A JP18731887 A JP 18731887A JP 18731887 A JP18731887 A JP 18731887A JP S6431426 A JPS6431426 A JP S6431426A
- Authority
- JP
- Japan
- Prior art keywords
- block
- interval
- base
- plate
- clamping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/1742—Mounting of moulds; Mould supports
- B29C45/1744—Mould support platens
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
PURPOSE:To prevent a resin burr from generating at a lead frame on a cavity block by securing chase blocks at an interval from a surface plate on a base, and forming the interior of supporting pins in a honeycomb structure. CONSTITUTION:A spacer block 22 is secured at an interval from a surface plate 1 on a base 3, and the interiors of supporting pins 21 are formed in a honeycomb structure. Then, a thermal resistance between the plate 1 and the base 3 is increased to largely suppress the heat transfer from a heater 2 to a press, thereby eliminating a heat insulator which is heretofore required. Accordingly, the parting faces 5a of cavity blocks 5 can be contacted each other at the time of clamping, pressing forces are uniformly acted on both the parting faces 5a. Since the plate 1 and the block 22 are held at the interval, only the pins 21 are axially and elastically contracted and deformed at the time of clamping the molds, thereby effectively preventing a resin burr from generating at the lead frame on the block 5.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18731887A JPS6431426A (en) | 1987-07-27 | 1987-07-27 | Resin sealing apparatus for semiconductor device |
US07/219,483 US4915608A (en) | 1987-07-20 | 1988-07-15 | Device for resin sealing semiconductor devices |
US07/447,917 US5059379A (en) | 1987-07-20 | 1989-12-08 | Method of resin sealing semiconductor devices |
US07/447,866 US4983111A (en) | 1987-07-20 | 1989-12-08 | Device for resin sealing semiconductor devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18731887A JPS6431426A (en) | 1987-07-27 | 1987-07-27 | Resin sealing apparatus for semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6431426A true JPS6431426A (en) | 1989-02-01 |
Family
ID=16203907
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18731887A Pending JPS6431426A (en) | 1987-07-20 | 1987-07-27 | Resin sealing apparatus for semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6431426A (en) |
-
1987
- 1987-07-27 JP JP18731887A patent/JPS6431426A/en active Pending
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