FR2421465A1 - Power diode with cylindrical casing - enabling insertion into opening in plate acting as heat sink and self-centering device - Google Patents

Power diode with cylindrical casing - enabling insertion into opening in plate acting as heat sink and self-centering device

Info

Publication number
FR2421465A1
FR2421465A1 FR7809329A FR7809329A FR2421465A1 FR 2421465 A1 FR2421465 A1 FR 2421465A1 FR 7809329 A FR7809329 A FR 7809329A FR 7809329 A FR7809329 A FR 7809329A FR 2421465 A1 FR2421465 A1 FR 2421465A1
Authority
FR
France
Prior art keywords
opening
casing
self
power diode
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7809329A
Other languages
French (fr)
Other versions
FR2421465B1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sev Marchal
Original Assignee
Sev Marchal
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sev Marchal filed Critical Sev Marchal
Priority to FR7809329A priority Critical patent/FR2421465A1/en
Priority to DE19792912189 priority patent/DE2912189C2/en
Priority to JP3714679A priority patent/JPS54152475A/en
Publication of FR2421465A1 publication Critical patent/FR2421465A1/en
Application granted granted Critical
Publication of FR2421465B1 publication Critical patent/FR2421465B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/115—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Rectifiers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Synchronous Machinery (AREA)

Abstract

The power diode has a circular shoulder (10) around its casing. The shoulder divides the surface of the casing into two zones, i.e. a first zone facing the opening in the casing and used to position the diode (1) in the opening (3) before force is applied so that the casing and opening axes are coincident, and a second zone with a larger cross-section located on the side of the base and pressed into the socket (4) formed by the opening. The height of the zone with the smaller cross-section in the direction of the casing's axis is greater than or equal to the depth of the socket.
FR7809329A 1978-03-30 1978-03-30 Power diode with cylindrical casing - enabling insertion into opening in plate acting as heat sink and self-centering device Granted FR2421465A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR7809329A FR2421465A1 (en) 1978-03-30 1978-03-30 Power diode with cylindrical casing - enabling insertion into opening in plate acting as heat sink and self-centering device
DE19792912189 DE2912189C2 (en) 1978-03-30 1979-03-28 Semiconductor power diode
JP3714679A JPS54152475A (en) 1978-03-30 1979-03-30 Semiconductor element power diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7809329A FR2421465A1 (en) 1978-03-30 1978-03-30 Power diode with cylindrical casing - enabling insertion into opening in plate acting as heat sink and self-centering device

Publications (2)

Publication Number Publication Date
FR2421465A1 true FR2421465A1 (en) 1979-10-26
FR2421465B1 FR2421465B1 (en) 1982-07-23

Family

ID=9206456

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7809329A Granted FR2421465A1 (en) 1978-03-30 1978-03-30 Power diode with cylindrical casing - enabling insertion into opening in plate acting as heat sink and self-centering device

Country Status (3)

Country Link
JP (1) JPS54152475A (en)
DE (1) DE2912189C2 (en)
FR (1) FR2421465A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1983000074A1 (en) * 1981-06-24 1983-01-06 Schwenk, Siegfried Semiconductor rectifier

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4792204A (en) * 1987-06-08 1988-12-20 Siemens Aktiengesellschaft Process and apparatus for elimination of tolerance dependent variations of a selectable spacing between components in optical communication equipment
US4938054A (en) * 1989-05-03 1990-07-03 Gilbarco Inc. Ultrasonic linear meter sensor for positive displacement meter
DE10141603A1 (en) * 2001-08-24 2003-03-06 Bosch Gmbh Robert Method for attaching an electrical element and assembly with an attached electrical element

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3527971A (en) * 1968-05-08 1970-09-08 Applied Motors Inc Apparatus for mounting brushes and diodes in a dynamoelectric machine
DE1944515A1 (en) * 1969-09-02 1971-03-04 Siemens Ag Semiconductor component with plastic filling
FR2258709A1 (en) * 1974-01-18 1975-08-18 Lucas Electrical Co Ltd

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1188210B (en) * 1962-05-28 1965-03-04 Siemens Ag Semiconductor component
DE1489688A1 (en) * 1965-06-26 1969-12-11 Bosch Gmbh Robert Semiconductor component
DE1564749A1 (en) * 1966-10-27 1970-01-08 Semikron Gleichrichterbau Semiconductor device
DE1614481A1 (en) * 1967-04-03 1970-07-02 Siemens Ag Semiconductor component

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3527971A (en) * 1968-05-08 1970-09-08 Applied Motors Inc Apparatus for mounting brushes and diodes in a dynamoelectric machine
DE1944515A1 (en) * 1969-09-02 1971-03-04 Siemens Ag Semiconductor component with plastic filling
FR2258709A1 (en) * 1974-01-18 1975-08-18 Lucas Electrical Co Ltd

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1983000074A1 (en) * 1981-06-24 1983-01-06 Schwenk, Siegfried Semiconductor rectifier

Also Published As

Publication number Publication date
JPS6217380B2 (en) 1987-04-17
FR2421465B1 (en) 1982-07-23
DE2912189C2 (en) 1984-12-13
JPS54152475A (en) 1979-11-30
DE2912189A1 (en) 1979-10-04

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Legal Events

Date Code Title Description
ST Notification of lapse