JPS6412597A - Copper foil for printed circuit and manufacture thereof - Google Patents

Copper foil for printed circuit and manufacture thereof

Info

Publication number
JPS6412597A
JPS6412597A JP16767987A JP16767987A JPS6412597A JP S6412597 A JPS6412597 A JP S6412597A JP 16767987 A JP16767987 A JP 16767987A JP 16767987 A JP16767987 A JP 16767987A JP S6412597 A JPS6412597 A JP S6412597A
Authority
JP
Japan
Prior art keywords
copper foil
layer
dipped
room temperature
solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16767987A
Other languages
Japanese (ja)
Other versions
JPH0614590B2 (en
Inventor
Takeshi Yamagishi
Masahiro Miama
Tatsunori Matsumoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Denkai Co Ltd
Original Assignee
Nippon Denkai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Denkai Co Ltd filed Critical Nippon Denkai Co Ltd
Priority to JP16767987A priority Critical patent/JPH0614590B2/en
Publication of JPS6412597A publication Critical patent/JPS6412597A/en
Publication of JPH0614590B2 publication Critical patent/JPH0614590B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)

Abstract

PURPOSE:To improve a peeling strength and chemical-resistant properties by successively building up a chromate layer, a silane coupling agent layer and a layer of imidazole or its derivative on the rough surface side of a copper foil. CONSTITUTION:A copper foil with a rough surface is dipped at a room temperature into a solution of hexavalent chrome supply source such as Na2Cr2O7.2S2O whose concentration is 0.1-10g/l and pH is 3-6 and subjected to a cathode treatment to form a chromate layer and washed. Then the copper foil is dipped into a solution of gamma-aminopropyl trimethoxysilane with a concentration of 0.1-3wt.% at a room temperature to build up a silane coupling agent layer. Then the copper foil is dipped into a solution of 2-phenyl-4-methylimidazole or 2-methylimidazolin with a concentration of 0.05-5wt.% at a room temperature to build up a layer of imidazole family or its derivative. In this process, the order of building-up is important. With this constitution, the peeling strength during and after a heat treatment can be improved and sufficient hydrochloric acid-resistant properties and KCN-resistant properties can be obtained.
JP16767987A 1987-07-07 1987-07-07 Copper foil for printed circuit and manufacturing method thereof Expired - Lifetime JPH0614590B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16767987A JPH0614590B2 (en) 1987-07-07 1987-07-07 Copper foil for printed circuit and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16767987A JPH0614590B2 (en) 1987-07-07 1987-07-07 Copper foil for printed circuit and manufacturing method thereof

Publications (2)

Publication Number Publication Date
JPS6412597A true JPS6412597A (en) 1989-01-17
JPH0614590B2 JPH0614590B2 (en) 1994-02-23

Family

ID=15854211

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16767987A Expired - Lifetime JPH0614590B2 (en) 1987-07-07 1987-07-07 Copper foil for printed circuit and manufacturing method thereof

Country Status (1)

Country Link
JP (1) JPH0614590B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102933746A (en) * 2010-06-30 2013-02-13 三井金属矿业株式会社 Process for production of copper foil for negative electrode current collector

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102933746A (en) * 2010-06-30 2013-02-13 三井金属矿业株式会社 Process for production of copper foil for negative electrode current collector

Also Published As

Publication number Publication date
JPH0614590B2 (en) 1994-02-23

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