JPS641223A - Chip type solid electrolytic capacitor - Google Patents
Chip type solid electrolytic capacitorInfo
- Publication number
- JPS641223A JPS641223A JP15611287A JP15611287A JPS641223A JP S641223 A JPS641223 A JP S641223A JP 15611287 A JP15611287 A JP 15611287A JP 15611287 A JP15611287 A JP 15611287A JP S641223 A JPS641223 A JP S641223A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- side outer
- solder plating
- section
- outer terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
PURPOSE: To eliminate an improper disconnection of wirings and improper contact of loss angle even at the time of mounting a solid electrolyte capacitor element of a cathode side outer terminal by soldering by eliminating the presence of a solder plating at the bonded section of the terminal to the element.
CONSTITUTION: An oxide film 21, a semiconductor layer 22 and a cathode layer 23 are sequentially formed on an anode 2 to form a solid electrolytic capacitor element 4. On the other hand, a cathode side outer terminal 6 and an anode side outer terminal 7 plated in advance with solders 61, 71 are prepared. In this case, the solder plating is not conducted at the bonded section 62 of the terminal 6 to the element 4. The section 62 is formed by a method for not forming the solder plating with a mask formed in advance, or a method for removing solder plating by mechanical working such as luting or optical working such as laser working. Then, the section 62 of the terminal 6 to the element 4 is secured with a conductive adhesive 5, an anode lead 3 and the anode side outer terminal 7 are welded, and a resin sheath 8 is formed.
COPYRIGHT: (C)1989,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15611287A JPS641223A (en) | 1987-06-23 | 1987-06-23 | Chip type solid electrolytic capacitor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15611287A JPS641223A (en) | 1987-06-23 | 1987-06-23 | Chip type solid electrolytic capacitor |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH011223A JPH011223A (en) | 1989-01-05 |
JPS641223A true JPS641223A (en) | 1989-01-05 |
Family
ID=15620572
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15611287A Pending JPS641223A (en) | 1987-06-23 | 1987-06-23 | Chip type solid electrolytic capacitor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS641223A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0418560A2 (en) * | 1989-09-19 | 1991-03-27 | Siemens Aktiengesellschaft | Process of manufacture of solid electrolytic chip capacitor |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6011441B2 (en) * | 1980-04-25 | 1985-03-26 | 株式会社千野製作所 | moisture sensing element |
-
1987
- 1987-06-23 JP JP15611287A patent/JPS641223A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6011441B2 (en) * | 1980-04-25 | 1985-03-26 | 株式会社千野製作所 | moisture sensing element |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0418560A2 (en) * | 1989-09-19 | 1991-03-27 | Siemens Aktiengesellschaft | Process of manufacture of solid electrolytic chip capacitor |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CA1213073A (en) | Method of manufacturing printed wiring boards | |
KR19980055816A (en) | Manufacturing Method of Chip Size Semiconductor Package | |
US3729820A (en) | Method for manufacturing a package of a semiconductor element | |
US6294826B1 (en) | Molded electronic component having pre-plated lead terminals and manufacturing process thereof | |
EP0945880A2 (en) | Surface-mount coil | |
CA2214130A1 (en) | Assemblies of substrates and electronic components | |
US6575354B2 (en) | Method for producing tin-silver alloy plating film, the tin-silver alloy plating film and lead frame for electronic parts having the film | |
JPS5513933A (en) | Circuit element substrate and its manufacturing method | |
JP2004327201A (en) | Electrochemical cell | |
JPS641223A (en) | Chip type solid electrolytic capacitor | |
EP1263273A2 (en) | A structure comprising a printed circuit board with electronic components mounted thereon and method for manufacturing the same | |
JPS6466925A (en) | Chip-shaped solid electrolytic capacitor with fuse | |
JPS6486527A (en) | Ccb tape carrier | |
JPS6435905A (en) | Method of mounting capacitor to circuit board | |
JPS6464298A (en) | Hybrid integrated circuit | |
WO2001063668A2 (en) | Method of forming lead-free solder alloys by electrochemical deposition process | |
JPS58221667A (en) | Soldering method of chip parts | |
JPS57190341A (en) | Circuit borad composition | |
JPS5591132A (en) | Semiconductor device | |
JPS6473610A (en) | Composite chip type electronic component and manufacture thereof | |
KR810002375Y1 (en) | Solid electrolytic capitors | |
Smith | Method for Soldering Aluminum | |
IE790296L (en) | Effecting a solder connection | |
JPS6486417A (en) | Contact and manufacture thereof | |
JPS5825214A (en) | Leadless cylindrical porcelain condenser |