JPS639666B2 - - Google Patents

Info

Publication number
JPS639666B2
JPS639666B2 JP55158844A JP15884480A JPS639666B2 JP S639666 B2 JPS639666 B2 JP S639666B2 JP 55158844 A JP55158844 A JP 55158844A JP 15884480 A JP15884480 A JP 15884480A JP S639666 B2 JPS639666 B2 JP S639666B2
Authority
JP
Japan
Prior art keywords
wire
glass
lead
sealed
slug
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55158844A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5783046A (en
Inventor
Shigeru Kawada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP55158844A priority Critical patent/JPS5783046A/ja
Publication of JPS5783046A publication Critical patent/JPS5783046A/ja
Publication of JPS639666B2 publication Critical patent/JPS639666B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/521—Structures or relative sizes of bond wires
    • H10W72/522—Multilayered bond wires, e.g. having a coating concentric around a core

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP55158844A 1980-11-13 1980-11-13 Slug lead Granted JPS5783046A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55158844A JPS5783046A (en) 1980-11-13 1980-11-13 Slug lead

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55158844A JPS5783046A (en) 1980-11-13 1980-11-13 Slug lead

Publications (2)

Publication Number Publication Date
JPS5783046A JPS5783046A (en) 1982-05-24
JPS639666B2 true JPS639666B2 (https=) 1988-03-01

Family

ID=15680635

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55158844A Granted JPS5783046A (en) 1980-11-13 1980-11-13 Slug lead

Country Status (1)

Country Link
JP (1) JPS5783046A (https=)

Also Published As

Publication number Publication date
JPS5783046A (en) 1982-05-24

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