JPS6393562A - ウェハの保持方法及びその装置 - Google Patents
ウェハの保持方法及びその装置Info
- Publication number
- JPS6393562A JPS6393562A JP61240767A JP24076786A JPS6393562A JP S6393562 A JPS6393562 A JP S6393562A JP 61240767 A JP61240767 A JP 61240767A JP 24076786 A JP24076786 A JP 24076786A JP S6393562 A JPS6393562 A JP S6393562A
- Authority
- JP
- Japan
- Prior art keywords
- holder
- wafer
- recess
- recessed portion
- carrier plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 26
- 238000005498 polishing Methods 0.000 claims description 29
- 239000000463 material Substances 0.000 claims description 16
- 230000037303 wrinkles Effects 0.000 abstract description 3
- 238000010521 absorption reaction Methods 0.000 abstract 3
- 235000012431 wafers Nutrition 0.000 description 43
- 230000001070 adhesive effect Effects 0.000 description 14
- 239000000853 adhesive Substances 0.000 description 13
- 239000012790 adhesive layer Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- -1 polyparaphenylene Polymers 0.000 description 3
- 230000003014 reinforcing effect Effects 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229920002492 poly(sulfone) Polymers 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229920001342 Bakelite® Polymers 0.000 description 1
- 229920002160 Celluloid Polymers 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000004637 bakelite Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000015271 coagulation Effects 0.000 description 1
- 238000005345 coagulation Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61240767A JPS6393562A (ja) | 1986-10-09 | 1986-10-09 | ウェハの保持方法及びその装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61240767A JPS6393562A (ja) | 1986-10-09 | 1986-10-09 | ウェハの保持方法及びその装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6393562A true JPS6393562A (ja) | 1988-04-23 |
| JPH0232112B2 JPH0232112B2 (enrdf_load_stackoverflow) | 1990-07-18 |
Family
ID=17064406
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61240767A Granted JPS6393562A (ja) | 1986-10-09 | 1986-10-09 | ウェハの保持方法及びその装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6393562A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01289657A (ja) * | 1988-05-13 | 1989-11-21 | Matsushita Electric Ind Co Ltd | 研摩定盤および研摩方法 |
| JP2003060014A (ja) * | 2001-08-17 | 2003-02-28 | Disco Abrasive Syst Ltd | 板状被加工物のための保持具 |
| EP1759810A1 (en) | 2005-08-31 | 2007-03-07 | Shin-Etsu Chemical Co., Ltd. | Wafer polishing method and polished wafer |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60135174A (ja) * | 1983-12-23 | 1985-07-18 | Toppan Printing Co Ltd | 裏面研磨方法 |
-
1986
- 1986-10-09 JP JP61240767A patent/JPS6393562A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60135174A (ja) * | 1983-12-23 | 1985-07-18 | Toppan Printing Co Ltd | 裏面研磨方法 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01289657A (ja) * | 1988-05-13 | 1989-11-21 | Matsushita Electric Ind Co Ltd | 研摩定盤および研摩方法 |
| JP2003060014A (ja) * | 2001-08-17 | 2003-02-28 | Disco Abrasive Syst Ltd | 板状被加工物のための保持具 |
| EP1759810A1 (en) | 2005-08-31 | 2007-03-07 | Shin-Etsu Chemical Co., Ltd. | Wafer polishing method and polished wafer |
| US7588481B2 (en) | 2005-08-31 | 2009-09-15 | Shin-Etsu Chemical Co., Ltd. | Wafer polishing method and polished wafer |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0232112B2 (enrdf_load_stackoverflow) | 1990-07-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| EXPY | Cancellation because of completion of term |