JPS6387863U - - Google Patents
Info
- Publication number
- JPS6387863U JPS6387863U JP18183386U JP18183386U JPS6387863U JP S6387863 U JPS6387863 U JP S6387863U JP 18183386 U JP18183386 U JP 18183386U JP 18183386 U JP18183386 U JP 18183386U JP S6387863 U JPS6387863 U JP S6387863U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- conductor
- forstellite
- semiconical
- palladium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 3
- 239000005749 Copper compound Substances 0.000 claims 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- 150000001880 copper compounds Chemical class 0.000 claims 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図、第２図は、本考案による印刷各工程の
状態を示す側断面図である。
１……基板、２……スルーホール穴、３……導
体ａ、４……導体ｂ、５……真空吸引。
FIGS. 1 and 2 are side sectional views showing the states of each printing process according to the present invention. 1... Board, 2... Through hole, 3... Conductor a, 4... Conductor b, 5... Vacuum suction.
Claims (1)
絶縁基板に、基板の表面と裏面の銀―パラジユウ
ム、銅化合物等の導体とを印刷により接続するス
ルーホール穴において、穴形状を半円錐状とし、
エツジ部にアール形状を設けたことを特徴とする
厚膜ハイブリツドＩＣ。 In a through-hole hole that connects a conductor such as silver-palladium or copper compound on the front surface and the back surface of a ceramic insulating substrate such as alumina or forstellite by printing, the hole shape is semiconical.
A thick film hybrid IC characterized by having a rounded edge.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18183386U JPS6387863U (en) | 1986-11-28 | 1986-11-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18183386U JPS6387863U (en) | 1986-11-28 | 1986-11-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6387863U true JPS6387863U (en) | 1988-06-08 |
Family
ID=31127068
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18183386U Pending JPS6387863U (en) | 1986-11-28 | 1986-11-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6387863U (en) |
-
1986
- 1986-11-28 JP JP18183386U patent/JPS6387863U/ja active Pending
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