JPS6355569U - - Google Patents
Info
- Publication number
- JPS6355569U JPS6355569U JP14871186U JP14871186U JPS6355569U JP S6355569 U JPS6355569 U JP S6355569U JP 14871186 U JP14871186 U JP 14871186U JP 14871186 U JP14871186 U JP 14871186U JP S6355569 U JPS6355569 U JP S6355569U
- Authority
- JP
- Japan
- Prior art keywords
- external connection
- connection terminal
- hybrid
- side wall
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011888 foil Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図ａ，ｂは夫々本考案のハイブリツドＩＣ
の正面図及び側面図、第２図ａ，ｂは夫々第１図
ａ，ｂにおける要部を拡大した正面図及び側面図
、第３図は従来のハイブリツドＩＣの正面図、第
４図は従来の他の構成のハイブリツドＩＣの正面
図である。
１……基板、２……ハイブリツドＩＣ主体部、
３……外部接続用電極、４……表面電極、５……
裏面電極、６……側壁電極、１１……ハイブリツ
ドＩＣ、１２……外部接続用端子（リードフレー
ム）、１３……外部接続用端子（基板の突起部）
。
Figures 1a and 1b are hybrid ICs of the present invention, respectively.
2a and 2b are enlarged front and side views of the main parts in FIGS. 1a and b, respectively. FIG. 3 is a front view of a conventional hybrid IC, and FIG. 4 is a conventional hybrid IC. FIG. 3 is a front view of a hybrid IC having another configuration. 1... Board, 2... Hybrid IC main part,
3...External connection electrode, 4...Surface electrode, 5...
Back electrode, 6...Side wall electrode, 11...Hybrid IC, 12...Terminal for external connection (lead frame), 13...Terminal for external connection (projection of board)
.
Claims (1)
ツドＩＣ用基板の一部を外部接続用端子として突
出形成したハイブリツドＩＣにおいて、前記外部
接続用端子の表裏両面に形成されている前記導電
箔からなる電極を、この外部接続用端子の側壁面
にメツキ形成した側壁電極により相互に接続した
ことを特徴とするハイブリツドＩＣ。 (2) 外部接続用端子の両側壁面に側壁電極を形
成し、これらの側壁電極により表面及び裏面の各
電極をその両側において相互に接続してなる実用
新案登録請求の範囲第１項記載のハイブリツドＩ
Ｃ。[Claims for Utility Model Registration] (1) In a hybrid IC in which a part of a hybrid IC substrate with conductive foil molded on the front and back surfaces is formed protrudingly as an external connection terminal, the external connection terminal is formed on both the front and back surfaces of the external connection terminal. A hybrid IC characterized in that the electrodes made of the conductive foil are connected to each other by a side wall electrode plated on the side wall surface of the external connection terminal. (2) The hybrid according to claim 1, which is formed by forming side wall electrodes on both side walls of an external connection terminal, and connecting the front and back electrodes to each other on both sides. I
C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14871186U JPS6355569U (en) | 1986-09-30 | 1986-09-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14871186U JPS6355569U (en) | 1986-09-30 | 1986-09-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6355569U true JPS6355569U (en) | 1988-04-14 |
Family
ID=31063240
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14871186U Pending JPS6355569U (en) | 1986-09-30 | 1986-09-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6355569U (en) |
-
1986
- 1986-09-30 JP JP14871186U patent/JPS6355569U/ja active Pending
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