JPH01145167U - - Google Patents
Info
- Publication number
- JPH01145167U JPH01145167U JP4026588U JP4026588U JPH01145167U JP H01145167 U JPH01145167 U JP H01145167U JP 4026588 U JP4026588 U JP 4026588U JP 4026588 U JP4026588 U JP 4026588U JP H01145167 U JPH01145167 U JP H01145167U
- Authority
- JP
- Japan
- Prior art keywords
- mounting board
- density mounting
- electrical
- substrate
- conduct
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
Description
第１図は、本考案に係る高密度実装基板を構成
とするハイブリツドＩＣの概略図、第２図は、第
１図に示すハイブリツドＩＣの側面図、第３図は
、従来の高密度実装基板を構成とするハイブリツ
ドＩＣの概略図、第４図は、第３図に示すハイブ
リツドＩＣの側面図。
２…高密度実装基板（基板）、５…パターン（
電気通路）、６…導通端子（導通部材）。
Fig. 1 is a schematic diagram of a hybrid IC configured with a high-density mounting board according to the present invention, Fig. 2 is a side view of the hybrid IC shown in Fig. 1, and Fig. 3 is a conventional high-density mounting board. FIG. 4 is a side view of the hybrid IC shown in FIG. 3. 2... High-density mounting board (substrate), 5... Pattern (
electrical path), 6...conducting terminal (conducting member).
Claims (1)
前記表面と裏面に各々形成されている前記電気通
路５を導通させる導通部材６を装着してなること
を特徴とする高密度実装基板。 A substrate 2 with electrical passages 5 formed on both the front and back sides,
A high-density mounting board characterized in that a conductive member 6 is attached to conduct the electrical path 5 formed on the front surface and the back surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4026588U JPH01145167U (en) | 1988-03-29 | 1988-03-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4026588U JPH01145167U (en) | 1988-03-29 | 1988-03-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01145167U true JPH01145167U (en) | 1989-10-05 |
Family
ID=31266739
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4026588U Pending JPH01145167U (en) | 1988-03-29 | 1988-03-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01145167U (en) |
-
1988
- 1988-03-29 JP JP4026588U patent/JPH01145167U/ja active Pending
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