JPH0245615U - - Google Patents

Info

Publication number
JPH0245615U
JPH0245615U JP12456588U JP12456588U JPH0245615U JP H0245615 U JPH0245615 U JP H0245615U JP 12456588 U JP12456588 U JP 12456588U JP 12456588 U JP12456588 U JP 12456588U JP H0245615 U JPH0245615 U JP H0245615U
Authority
JP
Japan
Prior art keywords
plate capacitor
bonding wire
hybrid integrated
substrate
guideline
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12456588U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12456588U priority Critical patent/JPH0245615U/ja
Publication of JPH0245615U publication Critical patent/JPH0245615U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例の平面図、第2図は
その正面図、第3図は従来構造の平面図である。 1……ケース、2……基板、3……単板コンデ
ンサ、4……パターン、5……ボンデイングワイ
ヤ、6……凹部(目安)。
FIG. 1 is a plan view of an embodiment of the present invention, FIG. 2 is a front view thereof, and FIG. 3 is a plan view of a conventional structure. 1... Case, 2... Board, 3... Single plate capacitor, 4... Pattern, 5... Bonding wire, 6... Recessed part (reference).

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 混成集積回路のケース上に基板等と共に搭載さ
れ、かつ該基板等にボンデイングワイヤで電気接
続される単板コンデンサにおいて、この単板コン
デンサの上面には、前記ボンデイングワイヤの接
続位置を示す目安を形成したことを特徴とする混
成集積回路用単板コンデンサ。
In a single-plate capacitor mounted on a case of a hybrid integrated circuit together with a substrate, etc., and electrically connected to the substrate etc. with a bonding wire, a guideline is formed on the upper surface of the single-plate capacitor to indicate the connection position of the bonding wire. A single-plate capacitor for hybrid integrated circuits.
JP12456588U 1988-09-22 1988-09-22 Pending JPH0245615U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12456588U JPH0245615U (en) 1988-09-22 1988-09-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12456588U JPH0245615U (en) 1988-09-22 1988-09-22

Publications (1)

Publication Number Publication Date
JPH0245615U true JPH0245615U (en) 1990-03-29

Family

ID=31374411

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12456588U Pending JPH0245615U (en) 1988-09-22 1988-09-22

Country Status (1)

Country Link
JP (1) JPH0245615U (en)

Similar Documents

Publication Publication Date Title
JPH0245615U (en)
JPH0270436U (en)
JPH01176936U (en)
JPS6447079U (en)
JPS5883172U (en) multilayer wiring board
JPS63172163U (en)
JPH0397939U (en)
JPH03120052U (en)
JPH0213731U (en)
JPH028041U (en)
JPH0213767U (en)
JPS63170964U (en)
JPH0298697U (en)
JPH01145167U (en)
JPH0270448U (en)
JPS6370134U (en)
JPS6247171U (en)
JPH0158956U (en)
JPS64280U (en)
JPS63164246U (en)
JPH0227761U (en)
JPH0236072U (en)
JPH0317616U (en)
JPH01116454U (en)
JPH0247052U (en)