JPH0245615U - - Google Patents
Info
- Publication number
- JPH0245615U JPH0245615U JP12456588U JP12456588U JPH0245615U JP H0245615 U JPH0245615 U JP H0245615U JP 12456588 U JP12456588 U JP 12456588U JP 12456588 U JP12456588 U JP 12456588U JP H0245615 U JPH0245615 U JP H0245615U
- Authority
- JP
- Japan
- Prior art keywords
- plate capacitor
- bonding wire
- hybrid integrated
- substrate
- guideline
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims 2
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
第１図は本考案の一実施例の平面図、第２図は
その正面図、第３図は従来構造の平面図である。
１……ケース、２……基板、３……単板コンデ
ンサ、４……パターン、５……ボンデイングワイ
ヤ、６……凹部（目安）。
FIG. 1 is a plan view of an embodiment of the present invention, FIG. 2 is a front view thereof, and FIG. 3 is a plan view of a conventional structure. 1... Case, 2... Board, 3... Single plate capacitor, 4... Pattern, 5... Bonding wire, 6... Recessed part (reference).
Claims (1)
れ、かつ該基板等にボンデイングワイヤで電気接
続される単板コンデンサにおいて、この単板コン
デンサの上面には、前記ボンデイングワイヤの接
続位置を示す目安を形成したことを特徴とする混
成集積回路用単板コンデンサ。 In a single-plate capacitor mounted on a case of a hybrid integrated circuit together with a substrate, etc., and electrically connected to the substrate etc. with a bonding wire, a guideline is formed on the upper surface of the single-plate capacitor to indicate the connection position of the bonding wire. A single-plate capacitor for hybrid integrated circuits.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12456588U JPH0245615U (en) | 1988-09-22 | 1988-09-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12456588U JPH0245615U (en) | 1988-09-22 | 1988-09-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0245615U true JPH0245615U (en) | 1990-03-29 |
Family
ID=31374411
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12456588U Pending JPH0245615U (en) | 1988-09-22 | 1988-09-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0245615U (en) |
-
1988
- 1988-09-22 JP JP12456588U patent/JPH0245615U/ja active Pending