JPS6387831U - - Google Patents
Info
- Publication number
- JPS6387831U JPS6387831U JP1986181596U JP18159686U JPS6387831U JP S6387831 U JPS6387831 U JP S6387831U JP 1986181596 U JP1986181596 U JP 1986181596U JP 18159686 U JP18159686 U JP 18159686U JP S6387831 U JPS6387831 U JP S6387831U
- Authority
- JP
- Japan
- Prior art keywords
- handling
- suction port
- utility
- gripped
- vacuum tweezers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 235000012431 wafers Nutrition 0.000 claims 7
- 239000004065 semiconductor Substances 0.000 claims 5
- 239000000463 material Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53191—Means to apply vacuum directly to position or hold work part
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
- Gripping Jigs, Holding Jigs, And Positioning Jigs (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986181596U JPS6387831U (US06566495-20030520-M00011.png) | 1986-11-26 | 1986-11-26 | |
EP87117420A EP0269097B1 (en) | 1986-11-26 | 1987-11-25 | Vacuum tweezers |
DE87117420T DE3787873T2 (de) | 1986-11-26 | 1987-11-25 | Vakuumpinzette. |
KR1019870013323A KR910009451B1 (ko) | 1986-11-26 | 1987-11-26 | 진공핀셋 |
US07/293,614 US4904012A (en) | 1986-11-26 | 1989-01-05 | Suction device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986181596U JPS6387831U (US06566495-20030520-M00011.png) | 1986-11-26 | 1986-11-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6387831U true JPS6387831U (US06566495-20030520-M00011.png) | 1988-06-08 |
Family
ID=16103575
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986181596U Pending JPS6387831U (US06566495-20030520-M00011.png) | 1986-11-26 | 1986-11-26 |
Country Status (5)
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH049271U (US06566495-20030520-M00011.png) * | 1990-05-14 | 1992-01-27 | ||
JP2007258206A (ja) * | 2006-03-20 | 2007-10-04 | Disco Abrasive Syst Ltd | ウエーハの保持パッド |
JP2014204089A (ja) * | 2013-04-09 | 2014-10-27 | 株式会社ディスコ | ウェーハ搬送機構及びウェーハの加工方法 |
Families Citing this family (52)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2624778B1 (fr) * | 1987-12-22 | 1994-09-23 | Recif Sa | Embout pour pipette a vide |
US5374090A (en) * | 1993-03-10 | 1994-12-20 | Advanced Micro Devices, Inc. | Cordless vacuum wand |
US5549340A (en) * | 1993-10-14 | 1996-08-27 | Smc Kabushiki Kaisha | Suction pad |
DE4342901A1 (de) * | 1993-12-16 | 1995-06-22 | Itt Ind Gmbh Deutsche | Saugpinzettenkopf |
JPH08148709A (ja) * | 1994-11-15 | 1996-06-07 | Mitsubishi Electric Corp | 薄型太陽電池の製造方法及び薄型太陽電池の製造装置 |
US5904697A (en) | 1995-02-24 | 1999-05-18 | Heartport, Inc. | Devices and methods for performing a vascular anastomosis |
US5888247A (en) * | 1995-04-10 | 1999-03-30 | Cardiothoracic Systems, Inc | Method for coronary artery bypass |
DE29512381U1 (de) * | 1995-08-01 | 1995-10-12 | Leybold Ag, 63450 Hanau | Vorrichtung zum Halten, für den Transport und für die Bearbeitung eines flachen, kreisscheibenförmigen Substrats |
US7445594B1 (en) | 1995-09-20 | 2008-11-04 | Medtronic, Inc. | Method and apparatus for temporarily immobilizing a local area of tissue |
US5836311A (en) * | 1995-09-20 | 1998-11-17 | Medtronic, Inc. | Method and apparatus for temporarily immobilizing a local area of tissue |
US6852075B1 (en) * | 1996-02-20 | 2005-02-08 | Cardiothoracic Systems, Inc. | Surgical devices for imposing a negative pressure to stabilize cardiac tissue during surgery |
US5915915A (en) * | 1996-03-07 | 1999-06-29 | Komag, Incorporated | End effector and method for loading and unloading disks at a processing station |
JP3771320B2 (ja) * | 1996-03-29 | 2006-04-26 | コマツ電子金属株式会社 | 半導体ウェハの貼付方法及び貼付装置 |
US5765890A (en) * | 1996-10-03 | 1998-06-16 | Memc Electronic Materials, Inc. | Device for transferring a semiconductor wafer |
US6969349B1 (en) * | 1997-09-17 | 2005-11-29 | Origin Medsystem, Inc. | Device to permit offpump beating heart coronary bypass surgery |
US6390976B1 (en) * | 1997-09-17 | 2002-05-21 | Origin Medsystems, Inc. | System to permit offpump beating heart coronary bypass surgery |
US6338712B2 (en) * | 1997-09-17 | 2002-01-15 | Origin Medsystems, Inc. | Device to permit offpump beating heart coronary bypass surgery |
US6019722A (en) * | 1997-09-17 | 2000-02-01 | Guidant Corporation | Device to permit offpump beating heart coronary bypass surgery |
US6072898A (en) | 1998-01-16 | 2000-06-06 | Beaty; Elwin M. | Method and apparatus for three dimensional inspection of electronic components |
BR9913759A (pt) | 1998-09-15 | 2001-06-12 | Medtronic Inc | Sistema para imobilizar temporariamente uma área de tecido, e, sistema para estabilizar tecido |
US6254155B1 (en) * | 1999-01-11 | 2001-07-03 | Strasbaugh, Inc. | Apparatus and method for reliably releasing wet, thin wafers |
IT1308606B1 (it) * | 1999-02-12 | 2002-01-08 | Lpe Spa | Dispositivo per maneggiare substrati mediante un istema autolivellante a depressione in reattori epistassiali ad induzione con suscettore |
US6511416B1 (en) * | 1999-08-03 | 2003-01-28 | Cardiothoracic Systems, Inc. | Tissue stabilizer and methods of use |
US6506149B2 (en) | 1999-09-07 | 2003-01-14 | Origin Medsystems, Inc. | Organ manipulator having suction member supported with freedom to move relative to its support |
US7338434B1 (en) | 2002-08-21 | 2008-03-04 | Medtronic, Inc. | Method and system for organ positioning and stabilization |
EP1220596A1 (en) * | 2000-12-29 | 2002-07-03 | Icos Vision Systems N.V. | A method and an apparatus for measuring positions of contact elements of an electronic component |
US6612590B2 (en) * | 2001-01-12 | 2003-09-02 | Tokyo Electron Limited | Apparatus and methods for manipulating semiconductor wafers |
US6676597B2 (en) * | 2001-01-13 | 2004-01-13 | Medtronic, Inc. | Method and device for organ positioning |
US6758808B2 (en) * | 2001-01-24 | 2004-07-06 | Cardiothoracic System, Inc. | Surgical instruments for stabilizing a localized portion of a beating heart |
US6680774B1 (en) * | 2001-10-09 | 2004-01-20 | Ultratech Stepper, Inc. | Method and apparatus for mechanically masking a workpiece |
US7104578B2 (en) * | 2002-03-15 | 2006-09-12 | Asm International N.V. | Two level end effector |
US7494460B2 (en) | 2002-08-21 | 2009-02-24 | Medtronic, Inc. | Methods and apparatus providing suction-assisted tissue engagement through a minimally invasive incision |
US6808216B2 (en) | 2002-08-30 | 2004-10-26 | Cardinal Ig Company | Methods and apparatus for handling workpieces |
US7931590B2 (en) * | 2002-10-29 | 2011-04-26 | Maquet Cardiovascular Llc | Tissue stabilizer and methods of using the same |
DE10259836A1 (de) * | 2002-12-19 | 2004-07-15 | Siemens Ag | Greifer und Betriebsverfahren |
US7105056B2 (en) * | 2002-12-30 | 2006-09-12 | Cardinal Cg Company | Pneumatic handling and recoating apparatus and method of use |
US20040212205A1 (en) * | 2003-01-30 | 2004-10-28 | Linker Frank V. | Method and apparatus for handling semiconductor wafers and interleafs |
US7479104B2 (en) | 2003-07-08 | 2009-01-20 | Maquet Cardiovascular, Llc | Organ manipulator apparatus |
US7181132B2 (en) | 2003-08-20 | 2007-02-20 | Asm International N.V. | Method and system for loading substrate supports into a substrate holder |
US7179224B2 (en) * | 2003-12-30 | 2007-02-20 | Cardiothoracic Systems, Inc. | Organ manipulator and positioner and methods of using the same |
US7399272B2 (en) | 2004-03-24 | 2008-07-15 | Medtronic, Inc. | Methods and apparatus providing suction-assisted tissue engagement |
DE102004018250A1 (de) * | 2004-04-15 | 2005-11-03 | Infineon Technologies Ag | Wafer-Stabilisierungsvorrichtung und Verfahren zu dessen Herstellung |
US20070088203A1 (en) * | 2005-05-25 | 2007-04-19 | Liming Lau | Surgical assemblies and methods for visualizing and performing surgical procedures in reduced-access surgical sites |
US8083664B2 (en) | 2005-05-25 | 2011-12-27 | Maquet Cardiovascular Llc | Surgical stabilizers and methods for use in reduced-access surgical sites |
US7794387B2 (en) | 2006-04-26 | 2010-09-14 | Medtronic, Inc. | Methods and devices for stabilizing tissue |
US7936447B2 (en) * | 2006-05-08 | 2011-05-03 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
GB2470035B (en) * | 2009-05-06 | 2013-12-18 | Belron Hungary Kft Zug Branch | Suction lifting device for glazing panels with cantilever handle |
BR112012032039B1 (pt) | 2010-06-14 | 2020-12-15 | Maquet Cardiovascular Llc | Instrumentos cirúrgicos |
WO2012010186A1 (de) * | 2010-07-23 | 2012-01-26 | Ev Group Gmbh | Handhabungsvorrichtung zur handhabung eines wafers |
CN103843126B (zh) * | 2011-08-12 | 2017-07-14 | Ev 集团 E·索尔纳有限责任公司 | 用于容纳有结构的晶片的容纳装置 |
US20130105089A1 (en) * | 2011-10-28 | 2013-05-02 | Industrial Technology Research Institute | Method for separating substrate assembly |
JP6380160B2 (ja) | 2015-02-25 | 2018-08-29 | 三菱電機株式会社 | 真空ピンセット及び半導体装置の製造方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62287639A (ja) * | 1986-06-05 | 1987-12-14 | Nitto Electric Ind Co Ltd | 薄板回路基板における感圧性粘着テ−プの貼着方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1302028A (en) * | 1914-07-13 | 1919-04-29 | Westinghouse Electric & Mfg Co | Sheet-handling implement. |
US2916059A (en) * | 1958-02-18 | 1959-12-08 | Lan J Wong | Evacuation valve cup |
US3224106A (en) * | 1961-05-31 | 1965-12-21 | David G Way | Method and apparatus for use in assembling ring sections about a shaft with their end faces co-planar |
US3466079A (en) * | 1965-09-08 | 1969-09-09 | Western Electric Co | Pressurized fluid pickup device |
US3523706A (en) * | 1967-10-27 | 1970-08-11 | Ibm | Apparatus for supporting articles without structural contact and for positioning the supported articles |
US3517958A (en) * | 1968-06-17 | 1970-06-30 | Ibm | Vacuum pick-up with air shield |
US3608946A (en) * | 1968-11-19 | 1971-09-28 | Dow Chemical Co | Device for handling of a filter membrane |
US4050729A (en) * | 1976-04-20 | 1977-09-27 | Hutson Clifford L | Apparatus for handling delicate articles such as silicon wafers |
DE2628488A1 (de) * | 1976-06-25 | 1978-01-05 | Siemens Ag | Werkzeug-sortiment fuer eine vakuumgreifpinzette |
DE2631502A1 (de) * | 1976-07-13 | 1978-01-19 | Siemens Ag | Greifwerkzeug fuer eine saugpinzette |
JPS5433678A (en) * | 1977-08-22 | 1979-03-12 | Hitachi Ltd | Vacuum pincette |
EP0201240B1 (en) * | 1985-05-04 | 1992-09-23 | Kabushiki Kaisha Seibu Giken | Apparatus for supporting and/or conveying a plate with fluid without physical contact |
US4618178A (en) * | 1985-06-07 | 1986-10-21 | Clifford L. Hutson | Hand held vacuum actuated pickup instrument |
-
1986
- 1986-11-26 JP JP1986181596U patent/JPS6387831U/ja active Pending
-
1987
- 1987-11-25 EP EP87117420A patent/EP0269097B1/en not_active Expired - Lifetime
- 1987-11-25 DE DE87117420T patent/DE3787873T2/de not_active Expired - Fee Related
- 1987-11-26 KR KR1019870013323A patent/KR910009451B1/ko not_active IP Right Cessation
-
1989
- 1989-01-05 US US07/293,614 patent/US4904012A/en not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62287639A (ja) * | 1986-06-05 | 1987-12-14 | Nitto Electric Ind Co Ltd | 薄板回路基板における感圧性粘着テ−プの貼着方法 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH049271U (US06566495-20030520-M00011.png) * | 1990-05-14 | 1992-01-27 | ||
JP2007258206A (ja) * | 2006-03-20 | 2007-10-04 | Disco Abrasive Syst Ltd | ウエーハの保持パッド |
JP4634949B2 (ja) * | 2006-03-20 | 2011-02-16 | 株式会社ディスコ | ウエーハの保持パッド |
JP2014204089A (ja) * | 2013-04-09 | 2014-10-27 | 株式会社ディスコ | ウェーハ搬送機構及びウェーハの加工方法 |
Also Published As
Publication number | Publication date |
---|---|
DE3787873T2 (de) | 1994-02-10 |
EP0269097A2 (en) | 1988-06-01 |
US4904012A (en) | 1990-02-27 |
DE3787873D1 (de) | 1993-11-25 |
KR910009451B1 (ko) | 1991-11-16 |
EP0269097A3 (en) | 1989-09-13 |
EP0269097B1 (en) | 1993-10-20 |
KR880006768A (ko) | 1988-07-25 |