JPS6386484A - Manufacture of optical semiconductor device - Google Patents
Manufacture of optical semiconductor deviceInfo
- Publication number
- JPS6386484A JPS6386484A JP61229791A JP22979186A JPS6386484A JP S6386484 A JPS6386484 A JP S6386484A JP 61229791 A JP61229791 A JP 61229791A JP 22979186 A JP22979186 A JP 22979186A JP S6386484 A JPS6386484 A JP S6386484A
- Authority
- JP
- Japan
- Prior art keywords
- encapsulating resin
- resin
- sealing resin
- stem base
- heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 21
- 230000003287 optical effect Effects 0.000 title claims description 7
- 239000004065 semiconductor Substances 0.000 title description 2
- 239000011347 resin Substances 0.000 claims abstract description 38
- 229920005989 resin Polymers 0.000 claims abstract description 38
- 238000010438 heat treatment Methods 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims abstract description 7
- 239000007788 liquid Substances 0.000 claims abstract description 5
- 238000007789 sealing Methods 0.000 claims description 21
- 239000004020 conductor Substances 0.000 claims description 6
- 239000008188 pellet Substances 0.000 abstract description 7
- 239000003795 chemical substances by application Substances 0.000 abstract description 6
- 238000005476 soldering Methods 0.000 abstract description 5
- 239000011248 coating agent Substances 0.000 abstract description 4
- 238000000576 coating method Methods 0.000 abstract description 4
- 229920001296 polysiloxane Polymers 0.000 abstract description 2
- 238000000151 deposition Methods 0.000 abstract 1
- 238000001723 curing Methods 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 239000006082 mold release agent Substances 0.000 description 3
- 238000007790 scraping Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Abstract
Description
【発明の詳細な説明】 〔発明の目的〕 （産業上の利用分野） この発明は光学導体装置の製造方法にかかり。[Detailed description of the invention] [Purpose of the invention] (Industrial application field) The present invention relates to a method of manufacturing an optical conductor device.
可視光域、赤外光域用発光素子や受光素子等の表示用光
源、センサに用いられるＬＥＤの製造方法に適用される
。It is applied to a method of manufacturing LEDs used in display light sources such as light emitting elements and light receiving elements for the visible light region and infrared light region, and sensors.
（従来の技術）
光学導体装置で樹脂封止型のＬＥＤの従来の製造方法に
ついて、要部の工程を第３図と第４図に示す、第３図は
ステムによって形成されるＬＥＤの製造工程の要部を示
し、ステム基台１０１の上面１０１ａにＬＥＩ）ペレッ
ト１０２がマウントされボンディングワイヤ１０３で電
極導出が施されたマウント構体１０４を用意する１次に
、このマウント構体１０４におけるＬＥＤベレット１０
２とこれがマウントされているステム基台上面１０１ａ
に封止樹脂（透光樹脂）液を滴下し、図中破線で示され
る封止樹脂半球１０５に形成する（第３図ａ）０次に、
ステム基台１０１を倒立させ（第３図ｂ）、ついで、１
００〜１２５℃程度の加熱硬化（キユアリング）を施し
封止樹脂半球体１０５ａに形成する（第３図ｃ）。(Prior Art) Regarding the conventional manufacturing method of a resin-sealed LED using an optical conductor device, the main steps are shown in FIGS. 3 and 4. FIG. 3 shows the manufacturing process of an LED formed by a stem. A mount structure 104 is prepared, in which an LEI pellet 102 is mounted on the upper surface 101a of a stem base 101 and electrodes are led out using bonding wires 103.First, the LED pellet 10 in this mount structure 104 is prepared.
2 and the top surface 101a of the stem base on which it is mounted.
A sealing resin (transparent resin) liquid is dropped onto the resin to form a sealing resin hemisphere 105 shown by a broken line in the figure (FIG. 3a). Next,
The stem base 101 is inverted (Fig. 3b), and then 1
The resin is cured by heating at a temperature of about 00 to 125° C. to form a sealing resin hemisphere 105a (FIG. 3c).
上記封止樹脂の硬化を施すための加熱によって封止樹脂
半球１０５は粘度が低下し、ステム基台１０１の側面に
這い上がり、第３図Ｃに示すように封止樹脂道上部１１
５を生ずる。The viscosity of the sealing resin hemisphere 105 decreases due to heating for curing the sealing resin, and it creeps up to the side of the stem base 101, and as shown in FIG.
5.
次に、第４図にリードフレームによって形成されるＬＥ
Ｄの製造工程の要部を示す、第４図ａはリードフレーム
のリード２０１．２１１の一方のり−ド２１１の先端に
設けられた凹部２２１の底にＬＥＤペレット２０２がマ
ウントされ、その一方の電極はボンディングワイヤ２０
３で他方のり−ド２０１の先端に接続されて形成された
マウント構体凪を示している。また、同図は上記マウン
ト構体の下方に封止樹脂２０５が充填されたケース型２
０６がマウント構体に対応して設けられている。上記リ
ードフレームには複数のマウント構体が等間隔、かつ並
列に形成されているから、これらに対応して設けられる
ケース型も同じ等間隔で並列に配置され同時に加工され
る（第４図ａ）。次に、マウント構体里を下降させ、封
止樹脂２０５内にリード２０２゜２１２の一部を浸す（
第４図ｂ）。ついで、１００〜１２５℃程度の加熱硬化
（キユアリング）を施し封止樹脂体２０５ａに形成し、
ケース型２０６を外し、ＬＥＤが得られる（第４図Ｃ）
。Next, FIG. 4 shows the LE formed by the lead frame.
FIG. 4a, which shows the main part of the manufacturing process of D, shows that the LED pellet 202 is mounted at the bottom of the recess 221 provided at the tip of one of the leads 211 of the leads 201 and 211 of the lead frame, and one electrode of the LED pellet 202 is mounted on the bottom of the recess 221. is bonding wire 20
3 shows the mount structure lugs formed by being connected to the tip of the other board 201. The figure also shows a case mold 2 filled with sealing resin 205 below the mount structure.
06 is provided corresponding to the mount structure. Since a plurality of mount structures are formed in parallel at equal intervals on the lead frame, the case molds provided corresponding to these are also arranged in parallel at equal intervals and processed at the same time (Figure 4a). . Next, lower the mount structure and partially immerse the leads 202 and 212 into the sealing resin 205 (
Figure 4b). Next, heat curing (curing) is performed at about 100 to 125° C. to form a sealing resin body 205a,
Remove the case mold 206 and get the LED (Figure 4C)
.
上記封止樹脂の硬化を施すための加熱によって封止樹脂
２０５は粘度が低下し、リード２０１．２１１の側端に
このリードフレームがプレス打抜き形成時に発生した抜
きパリを伝って這い上がり、第４図Ｃに示される封止樹
脂道上部２１５を生ずる。The viscosity of the sealing resin 205 decreases due to heating for curing the sealing resin, and the lead frame creeps up to the side ends of the leads 201 and 211 along the punching holes generated during press punching, and the fourth This results in the sealing resin channel upper portion 215 shown in Figure C.
（発明が解決しようとする間麗点）
上記封止樹脂硬化により生ずる封止樹脂道上部は、ステ
ムによって形成されるＬＥＤにおいては白色樹脂でなる
ステム基台の側面に付着した場合、一般に封止樹脂はＬ
ＥＤペレットの発光色、例えば緑、赤に着色されている
ため顕著な外観不良となる。そして強固に付着するから
この除去には削るほかなく、手間がかかる上に削ったあ
とが残れば不良になる１次に、リードフレームによって
形成されるＬＥＤにおいては、リードに強固に付着する
ので、リード表面にはんだ層被着を施す際にはんだ不着
不良を生ずる。そこで削り取ることにより手間がかかる
とともに、リードの変形を生じ不良になる。(Another problem to be solved by the invention) In an LED formed by a stem, the upper part of the sealing resin channel produced by the above-mentioned curing of the sealing resin is generally sealed when attached to the side surface of the stem base made of white resin. Resin is L
Since the ED pellets are colored with emitted light, for example, green or red, the appearance is noticeably poor. Since it adheres strongly, the only way to remove it is by scraping, which is time-consuming and will result in defects if the scraping remains.In LEDs formed by lead frames, the primary LED is firmly adhered to the leads. When applying a solder layer to the lead surface, solder failure occurs. Scraping it off takes time and effort, and also causes deformation of the leads, resulting in defects.
この発明は上記問題点を解決するために改良されたＬＥ
Ｄの製造方法を提供する。This invention is an improved LE to solve the above problems.
A method for manufacturing D is provided.
（問題点を解決するための手段）
この発明にかかる光学導体装置の製造方法は、樹脂封止
型の光学導体装置の製造において、マウント構体に液状
の封止樹脂を付着させたのち、この封止樹脂の隣接域に
離型剤のコーティングを施し、ついで加熱を施して上記
封止樹脂を硬化させるものである。(Means for Solving the Problems) A method for manufacturing an optical conductor device according to the present invention is such that in manufacturing a resin-sealed optical conductor device, a liquid sealing resin is applied to a mount structure, and then the sealing resin is applied to a mount structure. A region adjacent to the sealing resin is coated with a mold release agent, and then heating is applied to harden the sealing resin.
（作 用）
この発明によれば封止樹脂を加熱することにより生ずる
この樹脂の這い上がりを防止でき、外観不良、リードの
はんだ付かす等の不良発生を防止し、かつ手間が省ける
。(Function) According to the present invention, it is possible to prevent the resin from creeping up due to heating of the sealing resin, thereby preventing defects such as poor appearance and soldering of leads, and saving time and effort.
（実施例）
以下、この発明にかかる樹脂封止型のＬＥＤの製造方法
の一実施例につき図面を参照して説明する。(Example) Hereinafter, an example of the method for manufacturing a resin-sealed LED according to the present invention will be described with reference to the drawings.
なお、説明において従来と変わらない部分については従
来と同じ符号を付けて示し説明を省略し。In the description, parts that are the same as in the prior art are designated by the same reference numerals as in the prior art, and the explanation will be omitted.
従来との相違部のみ説明する。Only the differences from the conventional one will be explained.
第１図はステムによって形成される製造工程の要部を示
し、第１図ａおよび第１図すは職従来の製造工程の要部
を示す第３図ａおよび第３図すと変わらない、そして、
第１図すの状態に形成されたのち、第１図Ｃに示すよう
に、ステム基台１０１の周側面を離型剤層１１で被覆す
る。この被覆にはシリコーン系の離型剤を塗付、または
スプレする。Fig. 1 shows the main part of the manufacturing process formed by the stem, and Fig. 1a and Fig. 1 are the same as Figs. and,
After the stem base 101 is formed into the state shown in FIG. 1, the peripheral surface of the stem base 101 is coated with a release agent layer 11, as shown in FIG. 1C. This coating is coated or sprayed with a silicone release agent.
上記離型剤として発明者は広く検討を行なった結果、ハ
イ・リリース（商品名１株式会社ハイソールジャパン製
）が好適であった。しかも、この被覆は極めて薄層でよ
く、例えばスプレによる場合。As a result of extensive studies by the inventors as the above-mentioned mold release agent, High Release (trade name 1 manufactured by Hysol Japan Co., Ltd.) was found to be suitable. Moreover, this coating may be a very thin layer, for example by spraying.
１〜２秒間でよく、シかも、取上の程度の加熱に対して
充分な効果が認められる上に洗浄除去を施することなく
、以下の工程を達成できる。The heating time may be 1 to 2 seconds, which is sufficient for heating to the extent that it is removed, and the following steps can be accomplished without washing and removing.
次に、リードフレームによって形成されるＬＥＤの製造
工程の要部を示す第２図において、第２図ａおよび第２
図すは、従来の製造工程の要部を示す第４図ａおよび第
４図すと変わらない、そして、第２図すの状態に形成さ
れたのち、第２図Ｃに示すように、封止樹脂２０５から
上方へ露出したリード２０１．２１１に対し両面に離型
剤層２１を被覆する。Next, in FIG. 2 showing the main parts of the manufacturing process of an LED formed by a lead frame, FIG.
The figure is the same as that shown in Figures 4a and 4, which show the main parts of the conventional manufacturing process. The leads 201 and 211 exposed upward from the stopper resin 205 are coated with a release agent layer 21 on both sides.
この被覆はすでに述べたステムにより形成されるＬＥＤ
の製造工程と同様に施される。また、この離型剤層は洗
浄除去することなくのちのはんだ付けを達成できる。This coating covers the LED formed by the stem already mentioned.
It is applied in the same way as the manufacturing process. Further, this mold release agent layer can be used for later soldering without being washed away.
この発明によれば樹脂封止型の半導体装置の製造方法に
おいて、封止樹脂の硬化のための加熱工程により、この
樹脂ず隣接部に這い上がるのが完全に防止でき、外観不
良や、はんだ不良の発生、−例の２５．５％を０％にで
き顕著に工程歩留を向上できる利点がある。また、この
発明は実施が簡単で、特別な装置の改変も要しない利点
もある。According to the present invention, in the method of manufacturing a resin-sealed semiconductor device, the heating step for curing the sealing resin can completely prevent the resin from creeping up into adjacent parts, resulting in poor appearance and soldering defects. This has the advantage that the occurrence of 25.5% in the example can be reduced to 0%, and the process yield can be significantly improved. Further, the present invention has the advantage that it is easy to implement and does not require modification of special equipment.
第１図ａ ＝ ｄはこの発明にかかる一実施例の製造工
程を示すいずれも断面図、第２図ａ ” ｄはこの発明
にかかる別の実施例に製造工程を示すいずれも断面図、
第３図ａ−ｃは従来例の製造工程を示すいずれも断面図
、第４図ａ ＝ Ｑは別の従来例の製造工程を示すいず
れも断面図である。Figures 1a and d are sectional views showing the manufacturing process of one embodiment of the present invention; Figures 2a and 2d are sectional views showing the manufacturing process of another embodiment of the invention;
3A to 3C are sectional views showing the manufacturing process of a conventional example, and FIGS. 4A to 4C are sectional views showing the manufacturing process of another conventional example.
Claims (1)
体に液状の封止樹脂を付着させたのち、この封止樹脂の
隣接域に離型剤のコーティングを施し、ついで加熱を施
して上記封止樹脂を硬化させる光学導体装置の製造方法
。In the production of resin-sealed optical conductor devices, a liquid sealing resin is applied to the mount structure, a release agent is applied to the area adjacent to the sealing resin, and then heating is applied to seal the above-mentioned seal. A method for manufacturing an optical conductor device by curing resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61229791A JPS6386484A (en) | 1986-09-30 | 1986-09-30 | Manufacture of optical semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61229791A JPS6386484A (en) | 1986-09-30 | 1986-09-30 | Manufacture of optical semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6386484A true JPS6386484A (en) | 1988-04-16 |
Family
ID=16897727
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61229791A Pending JPS6386484A (en) | 1986-09-30 | 1986-09-30 | Manufacture of optical semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6386484A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102683316A (en) * | 2011-03-09 | 2012-09-19 | 斯坦雷电气株式会社 | Semiconductor device and manufacture method thereof |
| US8415695B2 (en) | 2007-10-24 | 2013-04-09 | Switch Bulb Company, Inc. | Diffuser for LED light sources |
| US8439528B2 (en) | 2007-10-03 | 2013-05-14 | Switch Bulb Company, Inc. | Glass LED light bulbs |
| US8853921B2 (en) | 2006-05-02 | 2014-10-07 | Switch Bulb Company, Inc. | Heat removal design for LED bulbs |
-
1986
- 1986-09-30 JP JP61229791A patent/JPS6386484A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8853921B2 (en) | 2006-05-02 | 2014-10-07 | Switch Bulb Company, Inc. | Heat removal design for LED bulbs |
| US8439528B2 (en) | 2007-10-03 | 2013-05-14 | Switch Bulb Company, Inc. | Glass LED light bulbs |
| US8415695B2 (en) | 2007-10-24 | 2013-04-09 | Switch Bulb Company, Inc. | Diffuser for LED light sources |
| US8981405B2 (en) | 2007-10-24 | 2015-03-17 | Switch Bulb Company, Inc. | Diffuser for LED light sources |
| CN102683316A (en) * | 2011-03-09 | 2012-09-19 | 斯坦雷电气株式会社 | Semiconductor device and manufacture method thereof |
| CN102683316B (en) * | 2011-03-09 | 2016-06-08 | 斯坦雷电气株式会社 | Optical semiconductor device and manufacture method thereof |
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