JPS6384010A - ヒユ−ズ付きチツプ状固体電解コンデンサ - Google Patents
ヒユ−ズ付きチツプ状固体電解コンデンサInfo
- Publication number
- JPS6384010A JPS6384010A JP22859686A JP22859686A JPS6384010A JP S6384010 A JPS6384010 A JP S6384010A JP 22859686 A JP22859686 A JP 22859686A JP 22859686 A JP22859686 A JP 22859686A JP S6384010 A JPS6384010 A JP S6384010A
- Authority
- JP
- Japan
- Prior art keywords
- fuse
- anode lead
- lead terminal
- chip
- solid electrolytic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 title claims description 42
- 239000007787 solid Substances 0.000 title claims description 19
- 229920005989 resin Polymers 0.000 claims description 17
- 239000011347 resin Substances 0.000 claims description 17
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 16
- 229910052782 aluminium Inorganic materials 0.000 claims description 15
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 15
- 229910052759 nickel Inorganic materials 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 238000003466 welding Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 238000007664 blowing Methods 0.000 description 4
- 238000005253 cladding Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000000654 additive Substances 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Landscapes
- Fuses (AREA)
- Semiconductor Integrated Circuits (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22859686A JPS6384010A (ja) | 1986-09-26 | 1986-09-26 | ヒユ−ズ付きチツプ状固体電解コンデンサ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22859686A JPS6384010A (ja) | 1986-09-26 | 1986-09-26 | ヒユ−ズ付きチツプ状固体電解コンデンサ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6384010A true JPS6384010A (ja) | 1988-04-14 |
| JPH0548926B2 JPH0548926B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-07-22 |
Family
ID=16878833
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22859686A Granted JPS6384010A (ja) | 1986-09-26 | 1986-09-26 | ヒユ−ズ付きチツプ状固体電解コンデンサ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6384010A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4423561A1 (de) * | 1993-07-09 | 1995-01-12 | Rohm Co Ltd | Oberflächenmontage-Elektronikbauteil mit Schmelzsicherung |
| US5661628A (en) * | 1995-10-02 | 1997-08-26 | Rohm Co. Ltd. | Fused surface mounting type solid electrolytic capacitor |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5665635U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1979-10-24 | 1981-06-01 | ||
| JPS60257119A (ja) * | 1984-05-31 | 1985-12-18 | 松尾電機株式会社 | ヒユ−ズ入りコンデンサ及びその製造方法 |
| JPS61181120A (ja) * | 1985-02-07 | 1986-08-13 | 日本電気株式会社 | ヒュ−ズ付き固体電解コンデンサ |
-
1986
- 1986-09-26 JP JP22859686A patent/JPS6384010A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5665635U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1979-10-24 | 1981-06-01 | ||
| JPS60257119A (ja) * | 1984-05-31 | 1985-12-18 | 松尾電機株式会社 | ヒユ−ズ入りコンデンサ及びその製造方法 |
| JPS61181120A (ja) * | 1985-02-07 | 1986-08-13 | 日本電気株式会社 | ヒュ−ズ付き固体電解コンデンサ |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4423561A1 (de) * | 1993-07-09 | 1995-01-12 | Rohm Co Ltd | Oberflächenmontage-Elektronikbauteil mit Schmelzsicherung |
| US6259348B1 (en) | 1993-07-09 | 2001-07-10 | Rohm Co., Ltd. | Surface mounting type electronic component incorporating safety fuse |
| US5661628A (en) * | 1995-10-02 | 1997-08-26 | Rohm Co. Ltd. | Fused surface mounting type solid electrolytic capacitor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0548926B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-07-22 |