JPS6382938U - - Google Patents
Info
- Publication number
- JPS6382938U JPS6382938U JP1986176806U JP17680686U JPS6382938U JP S6382938 U JPS6382938 U JP S6382938U JP 1986176806 U JP1986176806 U JP 1986176806U JP 17680686 U JP17680686 U JP 17680686U JP S6382938 U JPS6382938 U JP S6382938U
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- lead frame
- semiconductor chip
- wire
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/50—
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- H10W72/01515—
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- H10W72/075—
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- H10W72/07551—
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- H10W72/07553—
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- H10W72/531—
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- H10W72/536—
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- H10W72/5363—
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- H10W72/581—
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- H10W90/756—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986176806U JPS6382938U (enExample) | 1986-11-17 | 1986-11-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986176806U JPS6382938U (enExample) | 1986-11-17 | 1986-11-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6382938U true JPS6382938U (enExample) | 1988-05-31 |
Family
ID=31117410
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986176806U Pending JPS6382938U (enExample) | 1986-11-17 | 1986-11-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6382938U (enExample) |
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1986
- 1986-11-17 JP JP1986176806U patent/JPS6382938U/ja active Pending