JPS6377379U - - Google Patents
Info
- Publication number
- JPS6377379U JPS6377379U JP17095486U JP17095486U JPS6377379U JP S6377379 U JPS6377379 U JP S6377379U JP 17095486 U JP17095486 U JP 17095486U JP 17095486 U JP17095486 U JP 17095486U JP S6377379 U JPS6377379 U JP S6377379U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- hole section
- exposed
- outside
- land
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Description
第１図及び第２図は本考案における多層プリン
ト配線板の一実施例を示すもので、第１図は要部
の縦断面図、第２図は分解斜視図、第３図は多層
プリント配線板の従来例を示す縦断面図である。
１……連結用回路層、２……露出ランド層、３
Ａ・３Ｂ……中間回路層、４……スルーホール部
、５……絶縁ベース、６……接着層、７……回路
導体、８……接続用膨出部、９Ａ・９Ｂ……ラン
ド部、１０……部分リード線、１１……はんだ付
け部分、Ｈ……逃げ穴。
Figures 1 and 2 show an embodiment of the multilayer printed wiring board according to the present invention. Figure 1 is a vertical sectional view of the main parts, Figure 2 is an exploded perspective view, and Figure 3 is a multilayer printed wiring board. FIG. 2 is a longitudinal sectional view showing a conventional example of a plate. 1... Connection circuit layer, 2... Exposed land layer, 3
A・3B...Intermediate circuit layer, 4...Through hole part, 5...Insulating base, 6...Adhesive layer, 7...Circuit conductor, 8...Bulging part for connection, 9A/9B...Land part , 10...Partial lead wire, 11...Soldering part, H...Escape hole.
Claims (1)
該連結用回路層の外側を覆うとともに前記回路導
体の外側位置に露出状態のランド部９Ａ・９Ｂを
搭載してなる露出ランド層２と、これら各層を貫
通するとともに回路導体とランド部とを電気的に
接続してなるスルーホール部４とを備えているこ
とを特徴とする多層プリント配線板。 a connecting circuit layer 1 equipped with a circuit conductor 5;
An exposed land layer 2 which covers the outside of the connection circuit layer and has land portions 9A and 9B exposed outside the circuit conductor; A multilayer printed wiring board characterized by comprising a through-hole section 4 which is connected to the through-hole section 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17095486U JPH039343Y2 (en) | 1986-11-07 | 1986-11-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17095486U JPH039343Y2 (en) | 1986-11-07 | 1986-11-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6377379U true JPS6377379U (en) | 1988-05-23 |
| JPH039343Y2 JPH039343Y2 (en) | 1991-03-08 |
Family
ID=31106144
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17095486U Expired JPH039343Y2 (en) | 1986-11-07 | 1986-11-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH039343Y2 (en) |
-
1986
- 1986-11-07 JP JP17095486U patent/JPH039343Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH039343Y2 (en) | 1991-03-08 |