JPS6372180A - Electronic component and manufacture of the same - Google Patents

Abstract

(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION OBJECTS OF THE INVENTION (Industrial Field of Application) The present invention relates to an electronic component that can be used as part of an electronic circuit that operates under multiple potentials, and a method for manufacturing the same.

(Prior Art) Conventionally, the one shown in Fig. 10 is known as a conductive substrate (for example, a low carbon iron plate) that is equipped with various ICC circuits and functions as a part of an electric circuit used for various purposes. There is.

A substrate 20 shown in the figure is constructed by covering a metal core portion 21 with an insulating layer 22 such as an enamel layer. Then, on the insulating layer 22, IC parts 2 suitable for various uses are placed.
3, the power terminal of this IC component 23 and the metal core part 21 are connected by an electrode layer 24 penetrating the insulating layer 22, and a predetermined voltage is applied to the metal core part 21 from a power supply part (not shown). , and drive the IC component 23.

However, in the substrate 20 having the above structure, since the metal core portion 21 is an integral structure, only a single potential can be supplied as an electric circuit, and there is a problem that it cannot be used when power sources with a plurality of different potentials are required. be. Further, for the same reason, it could not be applied to an active usage mode in which a part of the metal core section 21 is used for power supply and the other part is used for signal transmission.

(Problems to be Solved by the Invention) As mentioned above, the conventional substrate as an electronic component has the problem that it cannot be used when supplying different potentials or when supplying a certain potential and transmitting a signal at the same time. be.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an electronic component and a method for manufacturing the same, which can supply different potentials or supply a certain potential and transmit signals without any problem.

[Structure of the invention]

(Means for Solving the Problems) The electronic component of the present invention includes a conductive substrate, a gap portion dividing the conductive substrate into a plurality of regions, and a conductive portion filled in the gap portion and divided into the plurality of regions. and an insulating material that integrally connects the conductive substrates, and the conductive substrates in each region are used as supply parts for different potentials or signals.

Further, the method for manufacturing an electronic component of the present invention includes a step of forming a plurality of gaps in one conductive substrate, a step of filling each of the plurality of gaps with an insulating material, and a step of filling each of the gaps with an insulating material. The method includes the step of cutting a predetermined region of a conductive substrate containing a conductive substrate, electrically dividing it into a plurality of regions using an insulating material, and forming an electronic component that is integrally connected.

(Function) In the electronic component with the above configuration, each region of the conductive substrate is electrically insulated by the insulating material filled in the gap, and these are integrally connected, so each region has a different potential. It functions as a supply section for a certain potential or as a transmission section for a signal.

According to the method for manufacturing an electronic component, it is possible to manufacture an electronic component that exhibits the functions described above.

(Example) The present invention will be explained in detail below.

1 and 2 show the electronic components of this embodiment.

The electronic component 1 shown in the figure includes a conductive substrate 2 made of, for example, a low carbon iron plate, and three areas 3A, 3
1st to divide into B and 3C. A gap portion consisting of second gaps 4A and 4B, and a first gap. It is configured to include an insulating material 5 made of, for example, enamel, which fills the second voids 4A and 4B and covers both the front and back surfaces of the insulating substrate 2.

The first gap 4A is formed in a U-shape at the upper side of the conductive substrate 2 in FIG. 1, thereby dividing the conductive substrate 2 into a region 3A and a region 3B.

The second gap 4B is formed in the shape of [] at the lower left corner of the conductive substrate 2 in FIG. 1, thereby dividing the conductive substrate 2 into a region 3B and a region 3C.

Said 1st. The second voids 4A and 4B are each filled with an insulating material 5 to form divided regions 3A.

3B and 3C are electrically insulated, and each area 3A and 3
B and 3C are integrally combined.

Next, an example of a method for manufacturing the electronic component 1 having the above structure will be described with reference to FIGS. 4(a), (b) and FIGS. 5(al) and (b).

First, as shown in FIGS. 4(a) and 4(b), one conductive substrate 2A having a larger area than the conductive substrate 2 is prepared. A void 4A and a second void 4B having a reversed shape are formed along predetermined dimensions. 1st. Second void 4A.

The formation positions of the conductive substrates 4B are set so that they do not reach the edge of the conductive substrate 2A. Also, 1st. Second void 4A
, 4B should be made smaller than the coating thickness t2 of the insulating material 5, which will be described later, in each region 3A.

This is necessary for integrally connecting 3B and 3C.

Next, as shown in FIGS. 5A and 5B, an insulating material 5 made of enamel is coated on both the front and back surfaces of the conductive substrate 2A by a method such as electrophoresis or dipping to a thickness of t2. Also, the first and second voids 4A.

4B is also filled with this insulating material 5.

Next, as shown by the two-dot chain line in FIG.
．． A rectangular cutting line is drawn such that the second voids 4A and 4B are located at the upper part and the lower left corner, respectively, and the conductive substrate 2A is cut along this cutting line.

Thereby, the electronic component 1 having the configuration shown in FIGS. 1 and 2 can be manufactured.

According to the electronic component 1 manufactured in this way, the three regions 3A, 3B, aclJ< electrically insulated, and
Since they are integrally connected as a whole, each area 3
A, 3B, and 3C are supplied with different potentials, for example, the area 3A is connected to 24 (Vl), and insulation on the front and back surfaces of the area can be performed at the same time as the gap filling. Conductive substrate 2
Each side surface may also be covered with the insulating material 5.

Next, a specific usage example of this electronic component 1 is shown in FIG. 6(a).
7(b), and FIGS. 7(a) and 7(b).

First, as shown in FIGS. 6(a) and (b), the electronic component l
The conductive substrate 10 is removed from the surface of the insulating material 5 in the area 3A of
The two through holes 6a and 6b reaching the surface are connected to the area 3B.
A similar through hole 6c is formed in the region 3C, and a similar through hole 6d is formed in the region 3C. Next, as shown in FIGS. 7(a) and 7(b), the through hole 6
connected to the conductive substrate 2 in the area 3A via a and 6b,
In addition, the first. Second electrode layer 7a
, 7b, and a third electrode connected to the conductive substrate 2 in the region 3B via the through hole 6c and located on the region 3B] W7c and the conductive electrode in the region 3C via the through hole 6d. connected to the substrate 2, and both regions 3B,
A fourth electrode layer 7d having a thickness of 3C is formed on the insulating material 5, respectively.

Then, an IC component (not shown) or the like is mounted between each of the electrodes Ji7a, 7b, 7c, and 7d to form an electrode layer. For example, 24 (V) can be supplied to the IC component through the electrodes a and 7b, 5 (V) can be applied to the electrode WJ7c, and a ground potential can be supplied to the IC component through the electrode i7d.

The present invention is not limited to the embodiments described above, and various modifications can be made within the scope of the invention.

For example, in the embodiment described above, each area 3A, 3B.

Although the case where 3C is used as a supply part of three different potentials has been described, two of these can be used as a supply part of potentials, and the remaining one can be used for signal transmission.

Furthermore, the number of divided regions is not limited to three, but can be any number.

Application examples of the present invention include those shown in FIGS. 8 and 9.

This figure shows a case where the electronic component having the above configuration is used as a substrate for a thermal head. That is, for an electronic component 10 that is divided into three regions 11A, IIB, and IIC similarly to the electronic component 1 described above, a heat generating layer is connected to the conductive base tr1i2 in the region 11A via the through hole 12a. 14 is provided, and a pair of electrode layers 13a and 13b are further laminated on this heating element layer 14.

Further, on the insulating material 5 in the region 11B, there is a driving ICl.
3 is mounted, and the electrode layer 13c connected to the conductive substrate 2 in this region 11B via the through hole 12b in the region 11B is connected to the conductive substrate 2 in this region 11C via the through hole 12c in the region 11G. The electrode layers 13d are laminated. Furthermore, the electrode layer 13
4 wires (for example, gold wire) 1 between b and the driving ICl3
In '6a, the driving ICl 3 and the electrode layer 13C are electrically connected by a conductive wire 16b, and the driving ICl 3 and the electrode layer 13d are electrically connected by a conductive wire 16c using a wire bonding method.

Then, a voltage of, for example, 24 (Vl) is applied to the heating element layer 14 through the conductive substrate 2 in the region 11A, and a voltage of, for example, 5 (V) is applied to the driving ICl 3 through the conductive substrate 2 in the region 11B. The ground potential (0
(Vl), respectively, so that the thermal head is constructed.

Although not shown in FIGS. 8 and 9, in the actual manufacture of this thermal head, it is not necessary to cover the outer periphery of the electrode layers 13a to 13d, the driving ICl 3, etc. with a wear-resistant layer. Needless to say.

〔Effect of the invention〕

According to the present invention described in detail above, it is possible to provide an electronic component that can be used as a supply section for different potentials or signals while using a single conductive substrate, and a method for manufacturing the same.

[Brief explanation of the drawing]

FIG. 1 is a plan view showing an embodiment of the electronic component of the present invention, and FIG.
The figure is a sectional view taken along the line 1-1 in Figure 1, and Figure 3 (al is a plan view showing the other side of the embodiment of the present invention, Figure 3A) is Figure 3(a).
4(a) is a plan view showing the manufacturing process of the electronic component shown in FIG. 1, and FIG. 4(b) is a sectional view taken along line nn of FIG.
5(a) is a plan view showing the manufacturing process of the electronic component shown in FIG. 1, and FIG. 5('b) is a cross-sectional view taken along line IV-IVV of FIG. 5(a). Cross-sectional view FIG. 6(a) is a plan view showing a state in which a through hole is drilled in the electronic component shown in FIG. 1, FIG. 6(b) is a cross-sectional view taken along the line V-V of FIG. 6(a), FIG. 7(al) is a plan view showing a state in which an electrode layer is further formed on the electronic component shown in FIG. 6(a), FIG. 7(b) is a sectional view taken along the line VI-VI of FIG. 7(a), Fig. 8 is a partially enlarged plan view showing an application example of the present invention, Fig. 9 is a sectional view taken along the line ■-■ in Fig. 8, and Fig. 10 is a sectional view of a conventional electronic component. 1...Electronic Parts, 2... Conductive substrate, 3A, 3B,
3C...Area, 4A...First void, 4B...Second void, 5...Insulating material. 4B 3B 44 3A, 7' Fig. 3 (G) (b) Fig. 6 Fig. 7 Fig. 8

Claims (2)

[Claims] (1) It has a conductive substrate, a gap that divides the conductive substrate into a plurality of regions, and an insulating material that fills the gap and integrally connects the conductive substrate divided into the plurality of regions. . An electronic component, characterized in that each of the conductive substrates in each region is used as a supply section for supplying different potentials or signals. (2) a step of forming a plurality of gaps in one conductive substrate; and a step of filling each of the plurality of gaps with an insulating material;
A predetermined area of the conductive substrate, including each gap filled with insulating material, is cut and electrically divided into multiple areas by the insulating material.
and forming an integrally combined electronic component.