JPS6371576U - - Google Patents
Info
- Publication number
- JPS6371576U JPS6371576U JP16591786U JP16591786U JPS6371576U JP S6371576 U JPS6371576 U JP S6371576U JP 16591786 U JP16591786 U JP 16591786U JP 16591786 U JP16591786 U JP 16591786U JP S6371576 U JPS6371576 U JP S6371576U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- wiring board
- printed wiring
- via hole
- coated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
第１図は、本考案にかかる印刷配線板の部分構
造断面図、第２図は本考案における半田付け方法
のフローチヤート、第３図は従来の半田付け方法
のフローチヤート、第４図は従来の印刷配線板の
部分構造断面図である。
１：印刷配線基板、２：ビアホール、３：スル
ホール、４：銅層、５：部品リード、６，１０，
１２：半田、７：半田ペースト、８：ソルダーレ
ジスト、９：チツプ部品、１１：コーナー。
Figure 1 is a cross-sectional view of a partial structure of a printed wiring board according to the present invention, Figure 2 is a flowchart of the soldering method of the present invention, Figure 3 is a flowchart of a conventional soldering method, and Figure 4 is a conventional soldering method. FIG. 2 is a partial structural sectional view of a printed wiring board of FIG. 1: Printed wiring board, 2: Via hole, 3: Through hole, 4: Copper layer, 5: Component lead, 6, 10,
12: Solder, 7: Solder paste, 8: Solder resist, 9: Chip parts, 11: Corner.
Claims (1)
ために形成されたビアホール上に、半田ペースト
を塗布しリフローソルダリングによつて半田が付
着しうるように形成されていることを特徴とする
印刷配線板。 A via hole formed to electrically connect one surface and the other surface is coated with solder paste and is formed so that solder can be attached by reflow soldering. Printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16591786U JPS6371576U (en) | 1986-10-29 | 1986-10-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16591786U JPS6371576U (en) | 1986-10-29 | 1986-10-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6371576U true JPS6371576U (en) | 1988-05-13 |
Family
ID=31096399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16591786U Pending JPS6371576U (en) | 1986-10-29 | 1986-10-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6371576U (en) |
-
1986
- 1986-10-29 JP JP16591786U patent/JPS6371576U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6371576U (en) | ||
| JPS6350169U (en) | ||
| JPH0385682U (en) | ||
| JPS62114475U (en) | ||
| JPH0298678U (en) | ||
| JPS5868001U (en) | chip parts | |
| JPH01162277U (en) | ||
| JPH0328775U (en) | ||
| JPS61144674U (en) | ||
| JPS59158356U (en) | Component mounting structure on multilayer printed wiring board | |
| JPS61157363U (en) | ||
| JPS63136352U (en) | ||
| JPS61127863U (en) | ||
| JPS62112178U (en) | ||
| JPS6217176U (en) | ||
| JPS62182574U (en) | ||
| JPS61183566U (en) | ||
| JPH0167725U (en) | ||
| JPS62170675U (en) | ||
| JPS5954974U (en) | Printed board | |
| JPS62109479U (en) | ||
| JPS6236580U (en) | ||
| JPS61156266U (en) | ||
| JPH01116474U (en) | ||
| JPS61156262U (en) |