JPS6370150U - - Google Patents
Info
- Publication number
- JPS6370150U JPS6370150U JP16639186U JP16639186U JPS6370150U JP S6370150 U JPS6370150 U JP S6370150U JP 16639186 U JP16639186 U JP 16639186U JP 16639186 U JP16639186 U JP 16639186U JP S6370150 U JPS6370150 U JP S6370150U
- Authority
- JP
- Japan
- Prior art keywords
- base film
- circuit board
- attached
- outer lead
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986166391U JPH0519956Y2 (US06826419-20041130-M00005.png) | 1986-10-28 | 1986-10-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986166391U JPH0519956Y2 (US06826419-20041130-M00005.png) | 1986-10-28 | 1986-10-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6370150U true JPS6370150U (US06826419-20041130-M00005.png) | 1988-05-11 |
| JPH0519956Y2 JPH0519956Y2 (US06826419-20041130-M00005.png) | 1993-05-25 |
Family
ID=31097319
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986166391U Expired - Lifetime JPH0519956Y2 (US06826419-20041130-M00005.png) | 1986-10-28 | 1986-10-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0519956Y2 (US06826419-20041130-M00005.png) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52156560A (en) * | 1976-06-23 | 1977-12-27 | Hitachi Ltd | Semiconductor device and its production |
| JPS6384990A (ja) * | 1986-09-30 | 1988-04-15 | 株式会社東芝 | 携帯可能媒体 |
-
1986
- 1986-10-28 JP JP1986166391U patent/JPH0519956Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52156560A (en) * | 1976-06-23 | 1977-12-27 | Hitachi Ltd | Semiconductor device and its production |
| JPS6384990A (ja) * | 1986-09-30 | 1988-04-15 | 株式会社東芝 | 携帯可能媒体 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0519956Y2 (US06826419-20041130-M00005.png) | 1993-05-25 |
