JPS6366422B2 - - Google Patents

Info

Publication number
JPS6366422B2
JPS6366422B2 JP56043096A JP4309681A JPS6366422B2 JP S6366422 B2 JPS6366422 B2 JP S6366422B2 JP 56043096 A JP56043096 A JP 56043096A JP 4309681 A JP4309681 A JP 4309681A JP S6366422 B2 JPS6366422 B2 JP S6366422B2
Authority
JP
Japan
Prior art keywords
tape
ring
metal
assembly
glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56043096A
Other languages
English (en)
Japanese (ja)
Other versions
JPS56150836A (en
Inventor
Danieru Baanzu Kaamen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Semiconductor Corp
Original Assignee
National Semiconductor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Semiconductor Corp filed Critical National Semiconductor Corp
Publication of JPS56150836A publication Critical patent/JPS56150836A/ja
Publication of JPS6366422B2 publication Critical patent/JPS6366422B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01025—Manganese [Mn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49789—Obtaining plural product pieces from unitary workpiece
    • Y10T29/4979—Breaking through weakened portion

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP4309681A 1980-03-24 1981-03-24 Method of assembling tape for semiconductor device and assembly tape Granted JPS56150836A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/133,053 US4355463A (en) 1980-03-24 1980-03-24 Process for hermetically encapsulating semiconductor devices

Publications (2)

Publication Number Publication Date
JPS56150836A JPS56150836A (en) 1981-11-21
JPS6366422B2 true JPS6366422B2 (en, 2012) 1988-12-20

Family

ID=22456800

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4309681A Granted JPS56150836A (en) 1980-03-24 1981-03-24 Method of assembling tape for semiconductor device and assembly tape

Country Status (3)

Country Link
US (1) US4355463A (en, 2012)
JP (1) JPS56150836A (en, 2012)
GB (1) GB2072423B (en, 2012)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190140832A (ko) * 2018-06-12 2019-12-20 주식회사 엘지화학 가소제 조성물 및 이를 포함하는 수지 조성물

Families Citing this family (105)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4466183A (en) * 1982-05-03 1984-08-21 National Semiconductor Corporation Integrated circuit packaging process
US4599538A (en) * 1982-09-30 1986-07-08 Gte Prod Corp Electroluminescent display device
US4560826A (en) * 1983-12-29 1985-12-24 Amp Incorporated Hermetically sealed chip carrier
US4722060A (en) * 1984-03-22 1988-01-26 Thomson Components-Mostek Corporation Integrated-circuit leadframe adapted for a simultaneous bonding operation
EP0163082B1 (en) * 1984-05-02 1988-11-23 GTE Products Corporation Packaged integrated circuit chip
US4684975A (en) * 1985-12-16 1987-08-04 National Semiconductor Corporation Molded semiconductor package having improved heat dissipation
US4723197A (en) * 1985-12-16 1988-02-02 National Semiconductor Corporation Bonding pad interconnection structure
US4722137A (en) * 1986-02-05 1988-02-02 Hewlett-Packard Company High frequency hermetically sealed package for solid-state components
JP2740161B2 (ja) * 1986-02-13 1998-04-15 日本電気株式会社 集積回路の実装構造
US4675472A (en) * 1986-08-04 1987-06-23 Beta Phase, Inc. Integrated circuit package and seal therefor
US5133795A (en) * 1986-11-04 1992-07-28 General Electric Company Method of making a silicon package for a power semiconductor device
US4961806A (en) * 1986-12-10 1990-10-09 Sanders Associates, Inc. Method of making a printed circuit
US5214571A (en) * 1986-12-10 1993-05-25 Miraco, Inc. Multilayer printed circuit and associated multilayer material
US5097390A (en) * 1986-12-10 1992-03-17 Interflex Corporation Printed circuit and fabrication of same
US4914741A (en) * 1987-06-08 1990-04-03 Digital Equipment Corporation Tape automated bonding semiconductor package
US4907065A (en) * 1988-03-01 1990-03-06 Lsi Logic Corporation Integrated circuit chip sealing assembly
JP2708191B2 (ja) 1988-09-20 1998-02-04 株式会社日立製作所 半導体装置
US4931906A (en) * 1988-03-25 1990-06-05 Unitrode Corporation Hermetically sealed, surface mountable component and carrier for semiconductor devices
US5070602A (en) * 1988-04-12 1991-12-10 Lance R. Kaufman Method of making a circuit assembly
US5034044A (en) * 1988-05-11 1991-07-23 General Electric Company Method of bonding a silicon package for a power semiconductor device
KR0158868B1 (ko) * 1988-09-20 1998-12-01 미다 가쓰시게 반도체장치
US5834799A (en) * 1989-08-28 1998-11-10 Lsi Logic Optically transmissive preformed planar structures
JP2805245B2 (ja) * 1989-08-28 1998-09-30 エルエスアイ ロジック コーポレーション フリップチップ構造
US5504035A (en) * 1989-08-28 1996-04-02 Lsi Logic Corporation Process for solder ball interconnecting a semiconductor device to a substrate using a noble metal foil embedded interposer substrate
US5168346A (en) * 1989-08-28 1992-12-01 Lsi Logic Corporation Method and apparatus for isolation of flux materials in flip-chip manufacturing
US5489804A (en) * 1989-08-28 1996-02-06 Lsi Logic Corporation Flexible preformed planar structures for interposing between a chip and a substrate
US5299730A (en) * 1989-08-28 1994-04-05 Lsi Logic Corporation Method and apparatus for isolation of flux materials in flip-chip manufacturing
US5230759A (en) * 1989-10-20 1993-07-27 Fujitsu Limited Process for sealing a semiconductor device
US5182424A (en) * 1989-10-31 1993-01-26 Vlastimil Frank Module encapsulation by induction heating
US5369059A (en) * 1989-12-08 1994-11-29 Cray Research, Inc. Method for constructing a reduced capacitance chip carrier
US5175612A (en) * 1989-12-19 1992-12-29 Lsi Logic Corporation Heat sink for semiconductor device assembly
US5247938A (en) * 1990-01-11 1993-09-28 University Of Washington Method and apparatus for determining the motility of a region in the human body
US5034568A (en) * 1990-05-14 1991-07-23 Rockwell International Corporation Package structure for multichip modules
US5399903A (en) * 1990-08-15 1995-03-21 Lsi Logic Corporation Semiconductor device having an universal die size inner lead layout
US5270262A (en) * 1991-02-28 1993-12-14 National Semiconductor Corporation O-ring package
US5350713A (en) * 1990-12-19 1994-09-27 Vlsi Technology, Inc. Design and sealing method for semiconductor packages
JP2933403B2 (ja) * 1991-03-15 1999-08-16 株式会社日立製作所 半導体パッケージ気密封止方法及び半導体パッケージ気密封止装置
US5137836A (en) * 1991-05-23 1992-08-11 Atmel Corporation Method of manufacturing a repairable multi-chip module
US5249098A (en) * 1991-08-22 1993-09-28 Lsi Logic Corporation Semiconductor device package with solder bump electrical connections on an external surface of the package
US5383269A (en) * 1991-09-03 1995-01-24 Microelectronics And Computer Technology Corporation Method of making three dimensional integrated circuit interconnect module
US5434750A (en) * 1992-02-07 1995-07-18 Lsi Logic Corporation Partially-molded, PCB chip carrier package for certain non-square die shapes
US5338705A (en) * 1992-09-10 1994-08-16 Texas Instruments Incorporated Pressure differential downset
US5438477A (en) * 1993-08-12 1995-08-01 Lsi Logic Corporation Die-attach technique for flip-chip style mounting of semiconductor dies
US5388327A (en) * 1993-09-15 1995-02-14 Lsi Logic Corporation Fabrication of a dissolvable film carrier containing conductive bump contacts for placement on a semiconductor device package
US5465481A (en) * 1993-10-04 1995-11-14 Motorola, Inc. Method for fabricating a semiconductor package
US5477009A (en) * 1994-03-21 1995-12-19 Motorola, Inc. Resealable multichip module and method therefore
US5550403A (en) * 1994-06-02 1996-08-27 Lsi Logic Corporation Improved laminate package for an integrated circuit and integrated circuit having such a package
US5770889A (en) * 1995-12-29 1998-06-23 Lsi Logic Corporation Systems having advanced pre-formed planar structures
US6730991B1 (en) * 1996-06-11 2004-05-04 Raytheon Company Integrated circuit chip package
KR100209682B1 (ko) * 1996-07-27 1999-07-15 구자홍 반도체 패키지 제조방법
US6013535A (en) 1997-08-05 2000-01-11 Micron Technology, Inc. Method for applying adhesives to a lead frame
US6204093B1 (en) * 1997-08-21 2001-03-20 Micron Technology, Inc. Method and apparatus for applying viscous materials to a lead frame
US6110761A (en) 1997-08-05 2000-08-29 Micron Technology, Inc. Methods for simultaneously electrically and mechanically attaching lead frames to semiconductor dice and the resulting elements
US6336973B1 (en) 1997-08-05 2002-01-08 Micron Technology, Inc. Apparatus and method for modifying the configuration of an exposed surface of a viscous fluid
US6040205A (en) * 1997-08-05 2000-03-21 Micron Technology, Inc. Apparatus and method for controlling the depth of immersion of a semiconductor element in an exposed surface of a viscous fluid
US6096576A (en) 1997-09-02 2000-08-01 Silicon Light Machines Method of producing an electrical interface to an integrated circuit device having high density I/O count
US6744346B1 (en) 1998-02-27 2004-06-01 Micron Technology, Inc. Electronic device workpieces, methods of semiconductor processing and methods of sensing temperature of an electronic device workpiece
US6303986B1 (en) * 1998-07-29 2001-10-16 Silicon Light Machines Method of and apparatus for sealing an hermetic lid to a semiconductor die
US6872984B1 (en) 1998-07-29 2005-03-29 Silicon Light Machines Corporation Method of sealing a hermetic lid to a semiconductor die at an angle
US6229322B1 (en) * 1998-08-21 2001-05-08 Micron Technology, Inc. Electronic device workpiece processing apparatus and method of communicating signals within an electronic device workpiece processing apparatus
US6967497B1 (en) 1998-08-21 2005-11-22 Micron Technology, Inc. Wafer processing apparatuses and electronic device workpiece processing apparatuses
US6362429B1 (en) * 1999-08-18 2002-03-26 Micron Technology, Inc. Stress relieving tape bonding interconnect
US6956878B1 (en) 2000-02-07 2005-10-18 Silicon Light Machines Corporation Method and apparatus for reducing laser speckle using polarization averaging
US20010017551A1 (en) * 2000-02-24 2001-08-30 Hembree David R. An electronic device workpiece processing intermediate member
US6387723B1 (en) * 2001-01-19 2002-05-14 Silicon Light Machines Reduced surface charging in silicon-based devices
US7177081B2 (en) * 2001-03-08 2007-02-13 Silicon Light Machines Corporation High contrast grating light valve type device
US20030208753A1 (en) * 2001-04-10 2003-11-06 Silicon Light Machines Method, system, and display apparatus for encrypted cinema
US6707591B2 (en) * 2001-04-10 2004-03-16 Silicon Light Machines Angled illumination for a single order light modulator based projection system
US6865346B1 (en) 2001-06-05 2005-03-08 Silicon Light Machines Corporation Fiber optic transceiver
US6782205B2 (en) * 2001-06-25 2004-08-24 Silicon Light Machines Method and apparatus for dynamic equalization in wavelength division multiplexing
US6747781B2 (en) * 2001-06-25 2004-06-08 Silicon Light Machines, Inc. Method, apparatus, and diffuser for reducing laser speckle
US6646778B2 (en) * 2001-08-01 2003-11-11 Silicon Light Machines Grating light valve with encapsulated dampening gas
US6639722B2 (en) * 2001-08-15 2003-10-28 Silicon Light Machines Stress tuned blazed grating light valve
US6829092B2 (en) 2001-08-15 2004-12-07 Silicon Light Machines, Inc. Blazed grating light valve
US6930364B2 (en) 2001-09-13 2005-08-16 Silicon Light Machines Corporation Microelectronic mechanical system and methods
US6956995B1 (en) 2001-11-09 2005-10-18 Silicon Light Machines Corporation Optical communication arrangement
US6692129B2 (en) * 2001-11-30 2004-02-17 Silicon Light Machines Display apparatus including RGB color combiner and 1D light valve relay including schlieren filter
US6800238B1 (en) 2002-01-15 2004-10-05 Silicon Light Machines, Inc. Method for domain patterning in low coercive field ferroelectrics
US6728023B1 (en) 2002-05-28 2004-04-27 Silicon Light Machines Optical device arrays with optimized image resolution
US6767751B2 (en) 2002-05-28 2004-07-27 Silicon Light Machines, Inc. Integrated driver process flow
US7054515B1 (en) 2002-05-30 2006-05-30 Silicon Light Machines Corporation Diffractive light modulator-based dynamic equalizer with integrated spectral monitor
US6822797B1 (en) 2002-05-31 2004-11-23 Silicon Light Machines, Inc. Light modulator structure for producing high-contrast operation using zero-order light
US6829258B1 (en) 2002-06-26 2004-12-07 Silicon Light Machines, Inc. Rapidly tunable external cavity laser
US6813059B2 (en) * 2002-06-28 2004-11-02 Silicon Light Machines, Inc. Reduced formation of asperities in contact micro-structures
US6908201B2 (en) * 2002-06-28 2005-06-21 Silicon Light Machines Corporation Micro-support structures
US6714337B1 (en) 2002-06-28 2004-03-30 Silicon Light Machines Method and device for modulating a light beam and having an improved gamma response
US6801354B1 (en) 2002-08-20 2004-10-05 Silicon Light Machines, Inc. 2-D diffraction grating for substantially eliminating polarization dependent losses
US7057795B2 (en) 2002-08-20 2006-06-06 Silicon Light Machines Corporation Micro-structures with individually addressable ribbon pairs
US6712480B1 (en) 2002-09-27 2004-03-30 Silicon Light Machines Controlled curvature of stressed micro-structures
US6928207B1 (en) 2002-12-12 2005-08-09 Silicon Light Machines Corporation Apparatus for selectively blocking WDM channels
US7057819B1 (en) 2002-12-17 2006-06-06 Silicon Light Machines Corporation High contrast tilting ribbon blazed grating
US6987600B1 (en) 2002-12-17 2006-01-17 Silicon Light Machines Corporation Arbitrary phase profile for better equalization in dynamic gain equalizer
US6934070B1 (en) 2002-12-18 2005-08-23 Silicon Light Machines Corporation Chirped optical MEM device
US6927891B1 (en) 2002-12-23 2005-08-09 Silicon Light Machines Corporation Tilt-able grating plane for improved crosstalk in 1×N blaze switches
US7068372B1 (en) 2003-01-28 2006-06-27 Silicon Light Machines Corporation MEMS interferometer-based reconfigurable optical add-and-drop multiplexor
US20040152242A1 (en) * 2003-01-30 2004-08-05 Wong Chun Kit Device package utilizing interconnect strips to make connections between package and die
US7286764B1 (en) 2003-02-03 2007-10-23 Silicon Light Machines Corporation Reconfigurable modulator-based optical add-and-drop multiplexer
US6947613B1 (en) 2003-02-11 2005-09-20 Silicon Light Machines Corporation Wavelength selective switch and equalizer
US6922272B1 (en) 2003-02-14 2005-07-26 Silicon Light Machines Corporation Method and apparatus for leveling thermal stress variations in multi-layer MEMS devices
US7391973B1 (en) 2003-02-28 2008-06-24 Silicon Light Machines Corporation Two-stage gain equalizer
US6806997B1 (en) 2003-02-28 2004-10-19 Silicon Light Machines, Inc. Patterned diffractive light modulator ribbon for PDL reduction
US6922273B1 (en) 2003-02-28 2005-07-26 Silicon Light Machines Corporation PDL mitigation structure for diffractive MEMS and gratings
US7027202B1 (en) 2003-02-28 2006-04-11 Silicon Light Machines Corp Silicon substrate as a light modulator sacrificial layer
US7042611B1 (en) 2003-03-03 2006-05-09 Silicon Light Machines Corporation Pre-deflected bias ribbons
US8974916B2 (en) 2009-12-20 2015-03-10 Agilent Technologies, Inc. Devices obtained by solid state bonding method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3271625A (en) * 1962-08-01 1966-09-06 Signetics Corp Electronic package assembly
US3374537A (en) * 1965-03-22 1968-03-26 Philco Ford Corp Method of connecting leads to a semiconductive device
US3546543A (en) * 1968-08-30 1970-12-08 Nat Beryllia Corp Hermetically sealed electronic package for semiconductor devices with high current carrying conductors
US4209355A (en) * 1978-07-26 1980-06-24 National Semiconductor Corporation Manufacture of bumped composite tape for automatic gang bonding of semiconductor devices
US4243495A (en) * 1978-08-18 1981-01-06 Trott William A Continuous electroforming of metal sheets with lines of weakness for bending and/or break out portions

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190140832A (ko) * 2018-06-12 2019-12-20 주식회사 엘지화학 가소제 조성물 및 이를 포함하는 수지 조성물

Also Published As

Publication number Publication date
US4355463A (en) 1982-10-26
GB2072423A (en) 1981-09-30
JPS56150836A (en) 1981-11-21
GB2072423B (en) 1983-11-23

Similar Documents

Publication Publication Date Title
JPS6366422B2 (en, 2012)
US6861295B2 (en) Low-pin-count chip package and manufacturing method thereof
US6703696B2 (en) Semiconductor package
US4835120A (en) Method of making a multilayer molded plastic IC package
JPS6324647A (ja) 半導体パッケ−ジ
JP2001036000A (ja) チップサイズスタックパッケージ及びメモリモジュールとその製造方法
US20040061206A1 (en) Discrete package having insulated ceramic heat sink
US5185653A (en) O-ring package
US4099200A (en) Package for semiconductor beam lead devices
JPH05226564A (ja) 半導体装置
US4470507A (en) Assembly tape for hermetic tape packaging semiconductor devices
US6049971A (en) Casing for integrated circuit chips and method of fabrication
JP2004095818A (ja) リードフレームならびにそれを用いた樹脂封止型半導体装置およびその製造方法
EP0282124B1 (en) Method for manufacturing a modular semiconductor power device and device obtained thereby
JPH053142B2 (en, 2012)
US5248895A (en) Semiconductor apparatus having resin encapsulated tab tape connections
JPH07122670A (ja) ガラス封止型半導体装置の製造方法
EP0081419A2 (en) High lead count hermetic mass bond integrated circuit carrier
JPH065726A (ja) 樹脂製中空パッケージを用いた半導体装置
JPS6027181B2 (ja) 半導体装置の製造方法
KR100704311B1 (ko) 내부리드 노출형 반도체 칩 패키지와 그 제조 방법
JP3210838B2 (ja) 半導体素子収納用パッケージの製造方法
JPH0525182B2 (en, 2012)
JPS6025900Y2 (ja) 半導体装置
JPS6043660B2 (ja) 半導体装置