JPS6365653A - セラミックス配線基板の製造方法 - Google Patents
セラミックス配線基板の製造方法Info
- Publication number
- JPS6365653A JPS6365653A JP20894286A JP20894286A JPS6365653A JP S6365653 A JPS6365653 A JP S6365653A JP 20894286 A JP20894286 A JP 20894286A JP 20894286 A JP20894286 A JP 20894286A JP S6365653 A JPS6365653 A JP S6365653A
- Authority
- JP
- Japan
- Prior art keywords
- alumina
- copper
- temperature
- metallized
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 15
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 42
- 229910052802 copper Inorganic materials 0.000 claims abstract description 42
- 239000010949 copper Substances 0.000 claims abstract description 42
- 238000000034 method Methods 0.000 claims abstract description 29
- 239000012298 atmosphere Substances 0.000 claims abstract description 21
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000001301 oxygen Substances 0.000 claims abstract description 14
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 14
- 238000005530 etching Methods 0.000 claims abstract description 13
- 229910052750 molybdenum Inorganic materials 0.000 claims abstract description 10
- 230000007935 neutral effect Effects 0.000 claims abstract description 10
- 229910052721 tungsten Inorganic materials 0.000 claims abstract description 9
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims abstract 3
- 239000011733 molybdenum Substances 0.000 claims abstract 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims abstract 3
- 239000010937 tungsten Substances 0.000 claims abstract 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 40
- 239000000758 substrate Substances 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 11
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 7
- 238000010304 firing Methods 0.000 claims description 7
- 238000007639 printing Methods 0.000 claims description 6
- 239000001257 hydrogen Substances 0.000 claims description 5
- 229910052739 hydrogen Inorganic materials 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 238000001465 metallisation Methods 0.000 abstract description 5
- 238000010438 heat treatment Methods 0.000 abstract description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 abstract 5
- 238000010276 construction Methods 0.000 abstract 1
- 238000007747 plating Methods 0.000 description 10
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 229910017309 Mo—Mn Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000010344 co-firing Methods 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20894286A JPS6365653A (ja) | 1986-09-05 | 1986-09-05 | セラミックス配線基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20894286A JPS6365653A (ja) | 1986-09-05 | 1986-09-05 | セラミックス配線基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6365653A true JPS6365653A (ja) | 1988-03-24 |
| JPH058866B2 JPH058866B2 (enrdf_load_stackoverflow) | 1993-02-03 |
Family
ID=16564687
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20894286A Granted JPS6365653A (ja) | 1986-09-05 | 1986-09-05 | セラミックス配線基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6365653A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1349206A2 (en) | 2002-03-29 | 2003-10-01 | Dowa Mining Co., Ltd. | Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereof |
| JP2011199209A (ja) * | 2010-03-24 | 2011-10-06 | Dowa Metaltech Kk | 金属−セラミックス接合回路基板の製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60150653A (ja) * | 1984-01-18 | 1985-08-08 | Toshiba Corp | 半導体装置 |
| JPS60156791A (ja) * | 1984-01-25 | 1985-08-16 | Mitsui Eng & Shipbuild Co Ltd | 石炭の水添液化方法 |
-
1986
- 1986-09-05 JP JP20894286A patent/JPS6365653A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60150653A (ja) * | 1984-01-18 | 1985-08-08 | Toshiba Corp | 半導体装置 |
| JPS60156791A (ja) * | 1984-01-25 | 1985-08-16 | Mitsui Eng & Shipbuild Co Ltd | 石炭の水添液化方法 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1349206A2 (en) | 2002-03-29 | 2003-10-01 | Dowa Mining Co., Ltd. | Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereof |
| US7387741B2 (en) | 2002-03-29 | 2008-06-17 | Dowa Mining Co., Ltd. | Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereof |
| EP1349206B1 (en) * | 2002-03-29 | 2019-10-09 | Dowa Metaltech Co., Ltd. | Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereof |
| JP2011199209A (ja) * | 2010-03-24 | 2011-10-06 | Dowa Metaltech Kk | 金属−セラミックス接合回路基板の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH058866B2 (enrdf_load_stackoverflow) | 1993-02-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |