JPS6364115U - - Google Patents
Info
- Publication number
- JPS6364115U JPS6364115U JP15749686U JP15749686U JPS6364115U JP S6364115 U JPS6364115 U JP S6364115U JP 15749686 U JP15749686 U JP 15749686U JP 15749686 U JP15749686 U JP 15749686U JP S6364115 U JPS6364115 U JP S6364115U
- Authority
- JP
- Japan
- Prior art keywords
- wave substrate
- acoustic wave
- shield layer
- surface acoustic
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000010897 surface acoustic wave method Methods 0.000 claims 3
- 238000000605 extraction Methods 0.000 claims 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Description
第1図はこの考案に係る表面波装置の第1の例
を示す斜視図、第2図は同上の縦断側面図、第3
図は同じく第2の例を示す斜視図、第4図は同上
のプリント基板への実装状態を示す斜視図、第5
図は同縦断面図、第6図は従来の表面波装置を示
す平面図、第7図は同上の縦断面図である。
1……表面波基板、2,3,4,5……櫛歯状
電極、2a,3a,4a,5a……引出電極、6
……シールド層、13……樹脂モールド、14…
…空洞、21,22,23,24,25……リー
ド端子。
FIG. 1 is a perspective view showing a first example of a surface wave device according to the invention, FIG. 2 is a longitudinal sectional side view of the same, and FIG.
The figures are also a perspective view showing the second example, FIG. 4 is a perspective view showing the mounting state on the same printed circuit board,
6 is a plan view showing a conventional surface wave device, and FIG. 7 is a longitudinal sectional view of the same. DESCRIPTION OF SYMBOLS 1...Surface wave substrate, 2, 3, 4, 5...Comb-shaped electrode, 2a, 3a, 4a, 5a...Extractor electrode, 6
...Shield layer, 13...Resin mold, 14...
...Cavity, 21, 22, 23, 24, 25...Lead terminal.
Claims (1)
分に上記電極の引出電極を設け、前記表面波基板
の裏面にシールド層を設け、各引出電極及びシー
ルド層に各々接続したリード端子を表面波基板の
電極形成面方向に折曲げて突出させ、表面波基板
の外周に樹脂モールドを施した表面波装置。 A comb-shaped electrode, etc. is provided on the surface of the surface wave substrate, and extraction electrodes of the above-mentioned electrodes are provided at the four corners, a shield layer is provided on the back surface of the surface wave substrate, and lead terminals are connected to each extraction electrode and the shield layer, respectively. A surface acoustic wave device in which a surface acoustic wave substrate is bent to protrude in the direction of the electrode formation surface, and a resin mold is applied to the outer periphery of the surface acoustic wave substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15749686U JPS6364115U (en) | 1986-10-14 | 1986-10-14 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15749686U JPS6364115U (en) | 1986-10-14 | 1986-10-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6364115U true JPS6364115U (en) | 1988-04-27 |
Family
ID=31080097
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15749686U Pending JPS6364115U (en) | 1986-10-14 | 1986-10-14 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6364115U (en) |
-
1986
- 1986-10-14 JP JP15749686U patent/JPS6364115U/ja active Pending
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