JPS6364076B2 - - Google Patents

Info

Publication number
JPS6364076B2
JPS6364076B2 JP58024733A JP2473383A JPS6364076B2 JP S6364076 B2 JPS6364076 B2 JP S6364076B2 JP 58024733 A JP58024733 A JP 58024733A JP 2473383 A JP2473383 A JP 2473383A JP S6364076 B2 JPS6364076 B2 JP S6364076B2
Authority
JP
Japan
Prior art keywords
semiconductor laser
heat sink
heat
recess
laser element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58024733A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59151484A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP58024733A priority Critical patent/JPS59151484A/ja
Publication of JPS59151484A publication Critical patent/JPS59151484A/ja
Publication of JPS6364076B2 publication Critical patent/JPS6364076B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02375—Positioning of the laser chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Semiconductor Lasers (AREA)
JP58024733A 1983-02-18 1983-02-18 半導体レ−ザ装置 Granted JPS59151484A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58024733A JPS59151484A (ja) 1983-02-18 1983-02-18 半導体レ−ザ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58024733A JPS59151484A (ja) 1983-02-18 1983-02-18 半導体レ−ザ装置

Publications (2)

Publication Number Publication Date
JPS59151484A JPS59151484A (ja) 1984-08-29
JPS6364076B2 true JPS6364076B2 (enrdf_load_stackoverflow) 1988-12-09

Family

ID=12146347

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58024733A Granted JPS59151484A (ja) 1983-02-18 1983-02-18 半導体レ−ザ装置

Country Status (1)

Country Link
JP (1) JPS59151484A (enrdf_load_stackoverflow)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0160567U (enrdf_load_stackoverflow) * 1987-10-12 1989-04-17
US5284790A (en) * 1990-01-03 1994-02-08 Karpinski Arthur A Method of fabricating monolithic laser diode array
US5438580A (en) * 1993-09-24 1995-08-01 Opto Power Corporation Laser package and method of assembly
CN1327581C (zh) 2002-03-25 2007-07-18 三洋电机株式会社 半导体激光器件
JP2006013551A (ja) * 2002-03-25 2006-01-12 Sanyo Electric Co Ltd 半導体レーザ装置
JP2007048839A (ja) * 2005-08-08 2007-02-22 Mitsubishi Electric Corp 半導体素子
JP5368957B2 (ja) 2009-12-04 2013-12-18 シャープ株式会社 半導体レーザチップの製造方法
GB2514605B (en) * 2013-05-30 2016-09-14 Solus Tech Ltd Method and apparatus for mounting a semiconductor disk laser (SDL)
DE102013216526A1 (de) 2013-08-21 2015-02-26 Osram Opto Semiconductors Gmbh Laserbauelement
JP6773399B2 (ja) * 2015-09-28 2020-10-21 京セラ株式会社 光素子搭載用パッケージおよび電子装置
DE102018009383A1 (de) * 2018-11-30 2020-06-04 Diehl Defence Gmbh & Co. Kg Verfahren zum Herstellen eines Multistrahllasers
US20230246412A1 (en) * 2020-10-01 2023-08-03 Mitsubishi Electric Corporation Semiconductor laser device

Also Published As

Publication number Publication date
JPS59151484A (ja) 1984-08-29

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