JPS6364074U - - Google Patents
Info
- Publication number
- JPS6364074U JPS6364074U JP1986157985U JP15798586U JPS6364074U JP S6364074 U JPS6364074 U JP S6364074U JP 1986157985 U JP1986157985 U JP 1986157985U JP 15798586 U JP15798586 U JP 15798586U JP S6364074 U JPS6364074 U JP S6364074U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- copper foil
- flexible board
- adhesive layer
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010410 layer Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000011889 copper foil Substances 0.000 claims description 5
- 239000012790 adhesive layer Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 239000011241 protective layer Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 description 4
- 239000010408 film Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000013039 cover film Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Combinations Of Printed Boards (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
- Multi-Conductor Connections (AREA)
Description
第１図は本考案によるフレキシブル基板の接合
部構造の第１実施例を示す断面図、第２図は第１
図のフレキシブル基板の外部部品としての液晶表
示素子への接合状態図、第３図は従来のフレキシ
ブル基板の接合部構造の断面図、第４図ないし第
６図はフレキシブル基板を外部部品である液晶表
示素子の端子部に接合する場合を順次示した説明
図である。
１１……フレキシブル基板、１２……ベースフ
イルム、１３，１４，１７，１８……接着層、１
５，１６……銅箔層、１９，２０……カバーフイ
ルム、２１……液晶表示素子、２２，２６……半
田、２７……半田ヒータ、３０……紫外線硬化樹
脂膜。
FIG. 1 is a sectional view showing a first embodiment of the joint structure of a flexible substrate according to the present invention, and FIG.
Figure 3 is a cross-sectional view of the joint structure of a conventional flexible substrate, and Figures 4 to 6 show how the flexible substrate is bonded to a liquid crystal display element as an external component. FIG. 4 is an explanatory diagram sequentially illustrating the case of bonding to a terminal portion of a display element. 11... Flexible substrate, 12... Base film, 13, 14, 17, 18... Adhesive layer, 1
5, 16... Copper foil layer, 19, 20... Cover film, 21... Liquid crystal display element, 22, 26... Solder, 27... Solder heater, 30... Ultraviolet curing resin film.
Claims (1)
の銅箔層に接着層を介して保護層を形成してなり
、銅箔層と保護層とで導体層を構成する両面銅箔
型のフレキシブル基板において、このフレキシブ
ル基板の外部部品との接合部における加熱加圧部
側の導体層を取り除き、基材上に露出した接着層
表面に紫外線硬化樹脂膜を形成したことを特徴と
するフレキシブル基板の接合部構造。 A double-sided copper foil in which a copper foil layer is formed on both sides of a base material via an adhesive layer, and a protective layer is formed on this copper foil layer via an adhesive layer, and the copper foil layer and the protective layer constitute a conductor layer. type of flexible board, the conductor layer on the side of the heated and pressurized part at the joint with the external component of the flexible board is removed, and an ultraviolet curing resin film is formed on the surface of the adhesive layer exposed on the base material. Flexible board joint structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986157985U JPS6364074U (en) | 1986-10-15 | 1986-10-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986157985U JPS6364074U (en) | 1986-10-15 | 1986-10-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6364074U true JPS6364074U (en) | 1988-04-27 |
Family
ID=31081046
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986157985U Pending JPS6364074U (en) | 1986-10-15 | 1986-10-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6364074U (en) |
-
1986
- 1986-10-15 JP JP1986157985U patent/JPS6364074U/ja active Pending
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