JPS6388982U - - Google Patents

Info

Publication number
JPS6388982U
JPS6388982U JP18390986U JP18390986U JPS6388982U JP S6388982 U JPS6388982 U JP S6388982U JP 18390986 U JP18390986 U JP 18390986U JP 18390986 U JP18390986 U JP 18390986U JP S6388982 U JPS6388982 U JP S6388982U
Authority
JP
Japan
Prior art keywords
electronic components
taping structure
adhesive layer
transferable
polymerized
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18390986U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18390986U priority Critical patent/JPS6388982U/ja
Publication of JPS6388982U publication Critical patent/JPS6388982U/ja
Pending legal-status Critical Current

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  • Packages (AREA)
  • Packaging Frangible Articles (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、テーピング構体の側面図、第２図は
、集積回路装置の平面図、第３図は、本考案に係
るテーピング構体の第１図Ａ―Ａ線に沿う断面図
、第４図は、同じく第１図Ｂ―Ｂ線に沿う断面図
である。 １，２……テープ、５……接着層、ａ……電子
部品。 1 is a side view of the taping structure, FIG. 2 is a plan view of the integrated circuit device, FIG. 3 is a sectional view of the taping structure according to the present invention taken along the line AA in FIG. 1, and FIG. 1 is a sectional view taken along the line BB in FIG. 1. 1, 2... Tape, 5... Adhesive layer, a... Electronic component.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 重合接着したテープ間に、所定間隔毎に電子部
品を挾持させるテーピング構体において、一方の
テープ重合面に、電子部品に対応して、電子部品
に転移可能な接着層を形成したことを特徴とする
テーピング構体。 A taping structure in which electronic components are sandwiched at predetermined intervals between polymerized and bonded tapes, characterized in that an adhesive layer that is transferable to the electronic components is formed on one tape polymerization surface in correspondence with the electronic components. Taping structure.
JP18390986U 1986-11-28 1986-11-28 Pending JPS6388982U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18390986U JPS6388982U (en) 1986-11-28 1986-11-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18390986U JPS6388982U (en) 1986-11-28 1986-11-28

Publications (1)

Publication Number Publication Date
JPS6388982U true JPS6388982U (en) 1988-06-09

Family

ID=31131079

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18390986U Pending JPS6388982U (en) 1986-11-28 1986-11-28

Country Status (1)

Country Link
JP (1) JPS6388982U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020001825A (en) * 2018-06-25 2020-01-09 Tdk株式会社 Electronic component storage package and storage method of electronic components

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59194498A (en) * 1983-04-19 1984-11-05 双信電機株式会社 Carrier tape of chiplike electronic part

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59194498A (en) * 1983-04-19 1984-11-05 双信電機株式会社 Carrier tape of chiplike electronic part

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020001825A (en) * 2018-06-25 2020-01-09 Tdk株式会社 Electronic component storage package and storage method of electronic components

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