JPH01157499U - - Google Patents
Info
- Publication number
- JPH01157499U JPH01157499U JP4784488U JP4784488U JPH01157499U JP H01157499 U JPH01157499 U JP H01157499U JP 4784488 U JP4784488 U JP 4784488U JP 4784488 U JP4784488 U JP 4784488U JP H01157499 U JPH01157499 U JP H01157499U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- shield
- metal thin
- thin film
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims description 3
- 239000010409 thin film Substances 0.000 claims description 3
- 239000012790 adhesive layer Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims description 2
- 239000002985 plastic film Substances 0.000 claims description 2
- 229920006255 plastic film Polymers 0.000 claims description 2
Landscapes
- Laminated Bodies (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は本考案に係るシールド構造を用いた回
路基板を示す説明図、第２図は同回路図基板の源
板を示す説明図である。
図において、Ａは回路基板、２は回路導体、３
はシールドテープまたシート、３１はプラスチツ
クフイルム、３２は金属薄膜、４は接着剤層であ
る。
FIG. 1 is an explanatory view showing a circuit board using a shield structure according to the present invention, and FIG. 2 is an explanatory view showing a source plate of the circuit board. In the figure, A is a circuit board, 2 is a circuit conductor, and 3 is a circuit board.
31 is a plastic film, 32 is a metal thin film, and 4 is an adhesive layer.
Claims (1)
たシールドテープまたはシールドシートを金属薄
膜面において接着剤層により回路基板の導体形成
面に接着したことを特徴とする回路基板のシール
ド構造。 A shield structure for a circuit board, characterized in that a shield tape or a shield sheet having a metal thin film provided on one side of a plastic film is adhered to the conductor forming surface of the circuit board with the metal thin film surface using an adhesive layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988047844U JPH0611596Y2 (en) | 1988-04-08 | 1988-04-08 | Circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988047844U JPH0611596Y2 (en) | 1988-04-08 | 1988-04-08 | Circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01157499U true JPH01157499U (en) | 1989-10-30 |
| JPH0611596Y2 JPH0611596Y2 (en) | 1994-03-23 |
Family
ID=31274023
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988047844U Expired - Lifetime JPH0611596Y2 (en) | 1988-04-08 | 1988-04-08 | Circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0611596Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS596896U (en) * | 1982-07-06 | 1984-01-17 | 富士通株式会社 | shield tape |
-
1988
- 1988-04-08 JP JP1988047844U patent/JPH0611596Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS596896U (en) * | 1982-07-06 | 1984-01-17 | 富士通株式会社 | shield tape |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0611596Y2 (en) | 1994-03-23 |
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